MC14027B. Dual J K Flip Flop
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1 M4027B Dual Flip Flop The M4027B dual flip flop has independen,, lock (), Se (S) and Rese (R) inpus for each flip flop. These devices may be used in conrol, regiser, or oggle funcio. Feaures Diode Proecion on All Inpus Supply Volage Range = 3.0 Vdc o 8 Vdc Logic Swing Independen of Fanou Logic Edge locked Flip Flop Design Logic Sae is Reained Indefiniely wih lock Level Eiher High or Low; Informaion is Traferred o he Oupu Only on he Posiive Going Edge of he lock Pulse apable of Driving Two Low Power TTL Loads or One Low Power Schoky TTL Load Over he Raed Temperaure Range Pin for Pin Replacemen for D4027B Pb Free Packages are Available* MAXIMUM RATINGS (Volages Referenced o ) Symbol Parameer Value Uni D Supply Volage Range 0. o +8.0 V V in, V ou Inpu or Oupu Volage Range (D or Traien) 0. o + 0. V I in, I ou P D Inpu or Oupu urren (D or Traien) per Pin Power Dissipaion, per Package (Noe ) ±0 ma 00 mw T A Ambien Temperaure Range o +2 T sg Sorage Temperaure Range 6 o +0 T L Lead Temperaure (8 Second Soldering) 260 Maximum raings are hose values beyond which device damage can occur. Maximum raings applied o he device are individual sress limi values (no normal operaing condiio) and are no valid simulaneously. If hese limis are exceeded, device funcional operaion is no implied, damage may occur and reliabiliy may be affeced.. Temperaure Deraing: Plasic P and D/DW Packages: 7.0 mw/ From 6 To 2 A WL, L YY, Y WW, W PDIP 6 P SUFFIX ASE 648 SOI 6 D SUFFIX ASE 7B SOEIA 6 F SUFFIX ASE 966 MARING DIAGRAMS M4027BP AWLYYWW 4027B AWLYWW M4027B AWLYWW = Assembly Locaion = Wafer Lo = Year = Work Week ORDERING INFORMATION See deailed ordering and shipping informaion in he package dimeio secion on page 3 of his daa shee This device conai proecion circuiry o guard agai damage due o high saic volages or elecric fields. However, precauio mus be aken o avoid applicaio of any volage higher han maximum raed volages o his high impedance circui. For proper operaion, V in and V ou should be corained o he range (V in or V ou ). Unused inpus mus always be ied o an appropriae logic volage level (e.g., eiher or ). Unused oupus mus be lef open. *For addiional informaion on our Pb Free sraegy and soldering deails, please download he ON Semiconducor Soldering and Mouning Techniques Reference Manual, SOLDERRM/D. Semiconducor ompone Indusries, LL, 200 February, 200 Rev. Publicaion Order Number: M4027B/D
2 M4027B Inpus TRUTH TABLE Oupus* S R n n+ n+ X X X X o o o X X 0 0 X n n X X X 0 X 0 X X X 0 X 0 X X X X X = Don are = Presen Sae = Level hange * = Nex Sae No hange PIN ASSIGNMENT A 6 A 2 B A 3 4 B R A 4 3 B A 2 R B A 6 B S A 7 0 B 8 9 S B BLO DIAGRAM 7 6 S 3 R S 3 R 4 2 = PIN 6 = PIN 8 2
3 M4027B ORDERING INFORMATION Device Package Shipping M4027BP PDIP 6 00 Unis / Rail M4027BPG PDIP 6 (Pb Free) 00 Unis / Rail M4027BD SOI 6 48 Unis / Rail M4027BDG SOI 6 (Pb Free) 48 Unis / Rail M4027BDR2 SOI Unis / Tape & Reel M4027BDR2G SOI 6 (Pb Free) 200 Unis / Tape & Reel M4027BFEL SOEIA Unis / Tape & Reel M4027BFELG SOEIA 6 (Pb Free) 2000 Unis / Tape & Reel For informaion on ape and reel specificaio, including par orienaion and ape sizes, please refer o our Tape and Reel Packaging Specificaio Brochure, BRD80/D. 3
4 M4027B Î ELETRIAL HARATERISTIS (Volages Referenced o ) Î 2 Î 2 ÎÎ haracerisic Symbol Vdc Min Max Min Typ Max Min Max Uni (Noe 2) Î Oupu Volage 0 Level V ÎÎ V in = OL Vdc Î or ÎÎ V in = 0 or Level V OH Vdc Î Î Inpu Volage 0 Level V IL Î Vdc ÎÎ (V O = 4. or 0. Vdc) ÎÎ (V ÎÎ O = 9.0 or.0 Vdc) (V O = 3. or. Vdc) ÎÎ ÎÎ (V O = 0. or 4. Vdc) Level V IH.0 ÎÎ ÎÎ (V O =.0 or 9.0 Vdc) ÎÎ ÎÎ Vdc (V O =. or 3. Vdc) 8.2 Î Oupu Drive urren I ÎÎ (V OH = 2. Vdc) Source OH madc ÎÎ (V OH = 4.6 Vdc) ÎÎ (V ÎÎ OH = 9. Vdc) (V OH = 3. Vdc) ÎÎ ÎÎ (V OL = 0.4 Vdc) Sink I OL.0 ÎÎ ÎÎ (V OL = 0. Vdc) ÎÎ ÎÎ madc (V OL =. Vdc) Inpu urren I in ± 0. ± ± 0. ±.0 Adc Inpu apaciance ÎÎ (V in = 0) in.0 7. pf ÎÎ uiescen urren I DD.0 ÎÎ ÎÎ (Per Package) ÎÎ Adc Î Toal Supply urren (Noes 3 & 4) I ÎÎ (Dynamic plus uiescen, T.0 I 0 Î T = (0.8 A/kHz) f + I DD Adc I T = (.6 A/kHz) f + I DD ÎÎ Per Package) ÎÎ Î I T = (2.4 A/kHz) f + I DD ( ÎÎ L = 0 pf on all oupus, all buffers swiching) 2. Daa labelled Typ is no o be used for design purposes bu is inended as an indicaion of he I s poenial performance. 3. The formulas given are for he ypical characerisics only a To calculae oal supply curren a loads oher han 0 pf: I T ( L ) = I T (0 pf) + ( L 0) Vfk where: I T is in A (per package), L in pf, V = ( ) in vols, f in khz is inpu frequency, and k =
5 M4027B Î SWITHING HARATERISTIS (Noe ) ( L = 0 pf, T A = 2 ) haracerisic Î Symbol Min Typ Max Uni (Noe 6) Î Oupu Rise and Fall Time TLH, ÎÎ TLH, THL = (. /pf) L + 2 TLH, THL = (0.7 /pf) L + 2. Î THL TLH, THL = (0. /pf) L Propagaion Delay Times** Î PLH, ÎÎ lock o, PLH, PHL = (.7 /pf) L + 90 Î PHL PLH, PHL = (0.66 /pf) L PLH, PHL = (0. /pf) L Î Se o, PLH, PHL = (.7 /pf) L PLH, PHL = (0.66 /pf) L PLH, PHL = (0. /pf) L Î Rese o, PLH, PHL = (.7 /pf) L PLH, PHL = (0.66 /pf) L PLH, PHL = (0. /pf) L Î Seup Times su Î Hold Times h ÎÎ ÎÎ 3 7 lock Pulse Widh Î WH, WL Î 7 38 lock Pulse Frequency f cl ÎÎ MHz ÎÎ Î lock Pulse Rise and Fall Time TLH, THL.0 s ÎÎ 0.0 ÎÎ 4.0 Removal Times Î rem ÎÎ 90 0 Î Se 0 4 ÎÎ 3 3 Rese Se and Rese Pulse Widh Î WH ÎÎ The formulas given are for he ypical characerisics only a Daa labelled Typ is no o be used for design purposes bu is inended as an indicaion of he I s poenial performance. 70 3
6 M4027B V DD 0% 0% su 0% 0% su h 0% 0% WH WL f cl PLH PHL V OH 0% 0% V OL TLH THL Inpus R and S low. For he measuremen of WH, I/f cl, and P D he Inpus and are kep high. SET OR 0% RESET 0% w rem LO 0% 0% or PLH PHL 0% w V OH V OL Figure. Dynamic Signal Waveforms (,, lock, and Oupu) Figure 2. Dynamic Signal Waveforms (Se, Rese, lock, and Oupu) LOGI DIAGRAM (/2 of Device Shown) S R 6
7 M4027B PAAGE DIMENSIONS PDIP 6 P SUFFIX PLASTI DIP PAAGE ASE ISSUE T 6 A 8 9 B NOTES:. DIMENSIONING AND TOLERANING PER ANSI Y4.M, ONTROLLING DIMENSION: INH. 3. DIMENSION L TO ENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INLUDE MOLD FLASH.. ROUNDED ORNERS OPTIONAL. H G F D 6 PL S 0.2 (0.00) M T SEATING T PLANE A M L M INHES MILLIMETERS DIM MIN MAX MIN MAX A B D F G 0.00 BS 2.4 BS H 0.00 BS.27 BS L M S SOI 6 D SUFFIX PLASTI SOI PAAGE ASE 7B 0 ISSUE A B P 8 PL 0.2 (0.00) M B S NOTES:. DIMENSIONING AND TOLERANING PER ANSI Y4.M, ONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0. (0.006) PER SIDE.. DIMENSION D DOES NOT INLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.27 (0.00) TOTAL IN EXESS OF THE D DIMENSION AT MAXIMUM MATERIAL ONDITION. T SEATING PLANE G D 6 PL 0.2 (0.00) M T B S A S M R X 4 F MILLIMETERS INHES DIM MIN MAX MIN MAX A B D F G.27 BS 0.00 BS M P R
8 M4027B PAAGE DIMENSIONS SOEIA 6 F SUFFIX PLASTI EIA SOI PAAGE ASE ISSUE O e 6 9 Z b D A H E A 0.3 (0.00) M 0.0 (0.004) 8 E VIEW P M L E L DETAIL P c NOTES: М. DIMENSIONING AND TOLERANING PER ANSI Y4.M, 982. М 2. ONTROLLING DIMENSION: MILLIMETER. М 3. DIMENSIONS D AND E DO NOT INLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXEED 0. (0.006) PER SIDE. М 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENE ONLY. М. THE LEAD WIDTH DIMENSION (b) DOES NOT INLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL ONDITION. DAMBAR ANNOT BE LOATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPAE BETWEEN PROTRUSIONS AND ADAENT LEAD TO BE 0.46 ( 0.08). MILLIMETERS INHES DIM MIN MAX MIN MAX A A b c D E e.27 BS 0.00 BS H E L L E M Z ON Semiconducor and are regisered rademarks of Semiconducor ompone Indusries, LL (SILL). SILL reserves he righ o make changes wihou furher noice o any producs herein. SILL makes no warrany, represenaion or guaranee regarding he suiabiliy of is producs for any paricular purpose, nor does SILL assume any liabiliy arising ou of he applicaion or use of any produc or circui, and specifically disclaims any and all liabiliy, including wihou limiaion special, coequenial or incidenal damages. Typical parameers which may be provided in SILL daa shees and/or specificaio can and do vary in differen applicaio and acual performance may vary over ime. All operaing parameers, including Typicals mus be validaed for each cusomer applicaion by cusomer s echnical expers. SILL does no convey any licee under is paen righs nor he righs of ohers. SILL producs are no designed, inended, or auhorized for use as compone in sysems inended for surgical implan ino he body, or oher applicaio inended o suppor or susain life, or for any oher applicaion in which he failure of he SILL produc could creae a siuaion where personal injury or deah may occur. Should Buyer purchase or use SILL producs for any such uninended or unauhorized applicaion, Buyer shall indemnify and hold SILL and is officers, employees, subsidiaries, affiliaes, and disribuors harmless agai all claims, coss, damages, and expees, and reasonable aorney fees arising ou of, direcly or indirecly, any claim of personal injury or deah associaed wih such uninended or unauhorized use, even if such claim alleges ha SILL was negligen regarding he design or manufacure of he par. SILL is an Equal Opporuniy/Affirmaive Acion Employer. This lieraure is subjec o all applicable copyrigh laws and is no for resale in any manner. PUBLIATION ORDERING INFORMATION LITERATURE FULFILLMENT: Lieraure Disribuion ener for ON Semiconducor P.O. Box 632, Phoenix, Arizona USA Phone: or Toll Free USA/anada Fax: or Toll Free USA/anada orderli@oemi.com N. American Technical Suppor: Toll Free USA/anada apan: ON Semiconducor, apan usomer Focus ener 2 9 amimeguro, Meguro ku, Tokyo, apan 3 00 Phone: ON Semiconducor Websie: Order Lieraure: hp:// For addiional informaion, please conac your local Sales Represenaive. M4027B/D
9 This daashee has been download from: Daashees for elecronics compone.
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Small Signal Fas Swiching Diode Feaures These diodes are also available in oher case syles including he DO- case wih he ype designaion N8, he MiniMELF case wih he ype designaion LL8, and he SOT- case wih
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