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1 Disribued by: The conen and copyrighs of he aached maerial are he propery of is owner.

2 Preferred Device Schoky Barrier Diodes These Schoky barrier diodes are designed for high speed swiching applicaions, circui proecion, and volage clamping. Exremely low forward volage reduces conducion loss. Miniaure surface moun package is excellen for hand held and porable applicaions where space is limied. Feaures Exremely Fas Swiching Speed Low 0.35 V I F = 0 madc Pb Free Package is Available 30 VOLT SILICON HOT CARRIER DETECTOR AND SWITCHING DIODES MAXIMUM RATINGS (T J = 5 C unless oherwise noed) Raing Symbol Value Uni Reverse Volage V R 30 V CATHODE ANODE THERMAL CHARACTERISTICS Characerisic Symbol Max Uni Toal Device Dissipaion FR 5 Board, P D 00 mw (Noe ) T A = 5 C Derae above 5 C.57 mw/ C Thermal Resisance, Juncion o Ambien R JA 635 C/W Juncion and Sorage Temperaure T J, T sg 55 o 5 C Maximum raings are hose values beyond which device damage can occur. Maximum raings applied o he device are individual sress limi values (no normal operaing condiions) and are no valid simulaneously. If hese limis are exceeded, device funcional operaion is no implied, damage may occur and reliabiliy may be affeced.. FR 4 Minimum Pad. SOD 53 CASE 50 PLASTIC MARKING DIAGRAM JVM JV = Device Code M = Dae Code* = Pb Free Package (Noe: Microdo may be in eiher locaion) *Dae Code orienaion may vary depending upon manufacuring locaion. ORDERING INFORMATION Device Package Shipping BAT54XVT SOD / Tape & Reel BAT54XVTG SOD 53 (Pb Free) 3000 / Tape & Reel For informaion on ape and reel specificaions, including par orienaion and ape sizes, please refer o our Tape and Reel Packaging Specificaions Brochure, BRD80/D. Preferred devices are recommended choices for fuure use and bes overall value. Semiconducor Componens Indusries, LLC, 005 Ocober, 005 Rev. 3 Publicaion Order Number: BAT54XVT/D

3 ELECTRICAL CHARACTERISTICS (T A = 5 C unless oherwise noed) Characerisic Symbol Min Typ Max Uni Reverse Breakdown Volage (I R = 0 A) Toal Capaciance (V R =.0 V, f =.0 MHz) Reverse Leakage (V R = 5 V) (I F = 0. madc) (I F = 30 madc) (I F = 00 madc) Reverse Recovery Time (I F = I R = 0 madc, I R(REC) =.0 madc) Figure (I F =.0 madc) (I F = 0 madc) V (BR)R 30 V C T pf I R Adc V F Vdc V F Vdc V F Vdc rr 5.0 ns V F Vdc V F Vdc Forward Curren (DC) I F 00 madc Repeiive Peak Forward Curren I FRM 300 madc Non Repeiive Peak Forward Curren ( <.0 s) I FSM 600 madc V k 00 H 0. F I F 0. F r p 0% I F rr 50 Oupu Pulse Generaor DUT 50 Inpu Sampling Oscilloscope V R 90% INPUT SIGNAL I R i R(REC) = ma OUTPUT PULSE (I F = I R = 0 ma; measured a i R(REC) = ma) Noes:. A.0 k variable resisor adjused for a Forward Curren (I F ) of 0 ma. Noes:. Inpu pulse is adjused so I R(peak) is equal o 0 ma. Noes: 3. p» rr Figure. Recovery Time Equivalen Tes Circui

4 00 I R, REVERSE CURRENT ( A) I F, FORWARD CURRENT (ma) 0 50 C 5 C.0 85 C 5 C 40 C 55 C V F, FORWARD VOLTAGE (VOLTS) Figure. 000 T A = 50 C 00 T A = 5 C 0.0 T A = 85 C T A = 5 C V R, REVERSE VOLTAGE (VOLTS) Figure 3. Leakage Curren 4 C T, TOTAL CAPACITANCE (pf) V R, REVERSE VOLTAGE (VOLTS) Figure 4. Toal Capaciance 3

5 PACKAGE DIMENSIONS SOD 53 CASE 50 0 ISSUE B X A B D PL 0.08 (0.003) M T X Y Y NOTES:. DIMENSIONING AND TOLERANCING PER ANSI Y4.5M, 98.. CONTROLLING DIMENSION: MILLIMETER. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL. MILLIMETERS DIM MIN NOM MAX A B C D J K S INCHES MIN NOM MAX C J S K T SEATING PLANE SOLDERING FOOTPRINT* SCALE 0: mm inches *For addiional informaion on our Pb Free sraegy and soldering deails, please download he ON Semiconducor Soldering and Mouning Techniques Reference Manual, SOLDERRM/D. ON Semiconducor and are regisered rademarks of Semiconducor Componens Indusries, LLC (SCILLC). SCILLC reserves he righ o make changes wihou furher noice o any producs herein. SCILLC makes no warrany, represenaion or guaranee regarding he suiabiliy of is producs for any paricular purpose, nor does SCILLC assume any liabiliy arising ou of he applicaion or use of any produc or circui, and specifically disclaims any and all liabiliy, including wihou limiaion special, consequenial or incidenal damages. Typical parameers which may be provided in SCILLC daa shees and/or specificaions can and do vary in differen applicaions and acual performance may vary over ime. All operaing parameers, including Typicals mus be validaed for each cusomer applicaion by cusomer s echnical expers. SCILLC does no convey any license under is paen righs nor he righs of ohers. SCILLC producs are no designed, inended, or auhorized for use as componens in sysems inended for surgical implan ino he body, or oher applicaions inended o suppor or susain life, or for any oher applicaion in which he failure of he SCILLC produc could creae a siuaion where personal injury or deah may occur. Should Buyer purchase or use SCILLC producs for any such uninended or unauhorized applicaion, Buyer shall indemnify and hold SCILLC and is officers, employees, subsidiaries, affiliaes, and disribuors harmless agains all claims, coss, damages, and expenses, and reasonable aorney fees arising ou of, direcly or indirecly, any claim of personal injury or deah associaed wih such uninended or unauhorized use, even if such claim alleges ha SCILLC was negligen regarding he design or manufacure of he par. SCILLC is an Equal Opporuniy/Affirmaive Acion Employer. This lieraure is subjec o all applicable copyrigh laws and is no for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Lieraure Disribuion Cener for ON Semiconducor P.O. Box 63, Phoenix, Arizona USA Phone: or Toll Free USA/Canada Fax: or Toll Free USA/Canada orderli@onsemi.com N. American Technical Suppor: Toll Free USA/Canada Japan: ON Semiconducor, Japan Cusomer Focus Cener 9 Kamimeguro, Meguro ku, Tokyo, Japan Phone: ON Semiconducor Websie: Order Lieraure: hp:// For addiional informaion, please conac your local Sales Represenaive. BAT54XVT/D