MC74HCT373A/D. Octal 3-State Noninverting Transparent Latch with LSTTL-Compatible Inputs. High Performance Silicon Gate CMOS

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1 Ocal -Sae Noninvering Traparen Lach wih LSTTL-Compaible Inpus High Performance Silicon Gae CMOS The MC7HCT7A may be used as a level converer for inerfacing TTL or NMOS oupus o High Speed CMOS inpus. The HCT7A is idenical in pinou o he LS7. The eigh laches of he HCT7A are raparen ype laches. While he Lach Enable is high he oupus follow he aa Inpus. When Lach Enable is aken low, daa meeing he seup and hold imes becomes lached. The Oupu Enable does no affec he sae of he lach, bu when Oupu Enable is high, all oupus are forced o he high impedance sae. Thus, daa may be lached even when he oupus are no enabled. The HCT7A is idenical in funcion o he HCT57A, which has he inpu pi on he opposie side of he package from he oupu pi. This device is similar in funcion o he HCT5A, which has invering oupus. Feaures Oupu rive Capabiliy: 5 LSTTL Loads TTL/NMOS Compaible Inpu Levels Oupus irecly Inerface o CMOS, NMOS, and TTL Operaing olage Range:.5 o Low Inpu Curren:.0 A In Compliance wih he Requiremens efined by JEEC Sandard No. 7 A Chip Complexiy: 96 FETs or 9 Equivalen Gaes These evices are Pb Free and are RoHS Complian ATA INPUTS LATCH ENAB ENAB LOGIC IAGRAM PIN = CC PIN 0 = GN NONINERTING S SOIC W SUFFIX CASE 75 ENAB ÎÎ ORERING INFORMATION evice Package Shipping MC7HCT7AWG SOIC (Pb Free) 8 / Rail MC7HCT7AWRG MC7HCT7ATRG hp://oemi.com MARKING IAGRAMS HCT7A AWLYYWWG SOIC PIN ASSIGNMENT GN SOIC (Pb Free) TSSOP (Pb Free) 000 / Tape & Reel 500 / Tape & Reel For informaion on ape and reel specificaio, including par orienaion and ape sizes, please refer o our Tape and Reel Packaging Specificaion Brochure, BR80/. TSSOP T SUFFIX CASE 98E CC LATCH ENAB HCT 7A ALYW TSSOP A = Assembly Locaion WL, L = Wafer Lo YY, Y = Year WW, W = Work Week G or = Pb Free Package (Noe: Microdo may be in eiher locaion) Semiconducor Componens Indusries, LLC, Sepember, Rev. Publicaion Order Number: MC7HCT7A/

2 Î Î esign Crieria alue ÎÎÎ Unis Î Inernal Gae Coun* 9 ÎÎÎ ea. Î Inernal Gae Propagaion elay.5 Î Inernal Gae Power issipaion 5.0 Î W Speed Power Produc pj *Equivalen o a wo inpu NAN gae. FUNCTION TAB Inpus Oupu Oupu Lach Enable Enable L H H H L H L L L L X No Change H X X Z X = don care Z = high impedance MAXIMUM RATINGS Symbol Parameer alue Uni CC C Supply olage (Referenced o GN) 0.5 o +7.0 in C Inpu olage (Referenced o GN) 0.5 o CC ou C Oupu olage (Referenced o GN) 0.5 o CC I in C Inpu Curren, per Pin ± ma I ou C Oupu Curren, per Pin ±5 ma I CC C Supply Curren, CC and GN Pi ±75 ma P Power issipaion in Sill Air, SOIC Package TSSOP Package T sg Sorage Temperaure 65 o +50 C T L Lead Temperaure, mm from Case for 0 Seconds (SOIC or TSSOP Package) 60 Sresses exceeding hose lised in he Maximum Raings able may damage he device. If any of hese limis are exceeded, device funcionaliy should no be assumed, damage may occur and reliabiliy may be affeced. eraing: SOIC Package: 7 mw/ C from 65 o 5 C TSSOP Package: 6. mw/ C from 65 o 5 C mw C This device conai proecion circuiry o guard agai damage due o high saic volages or elecric fields. However, precauio mus be aken o avoid applicaio of any volage higher han maximum raed volages o his high impedance circui. For proper operaion, in and ou should be corained o he range GN ( in or ou ) CC. Unused inpus mus always be ied o an appropriae logic volage level (e.g., eiher GN or CC ). Unused oupus mus be lef open. RECOMMENE OPERATING CONITIONS Symbol Parameer Min Max Uni CC C Supply olage (Referenced o GN).5 in, ou C Inpu olage, Oupu olage (Referenced o GN) 0 CC T A Operaing Temperaure, All Package Types C r, f Inpu Rise and Fall Time (Figure ) Funcional operaion above he sresses lised in he Recommended Operaing Ranges is no implied. Exended exposure o sresses beyond he Recommended Operaing Ranges limis may affec device reliabiliy. hp://oemi.com

3 C ECTRICAL CHARACTERISTICS (olages Referenced o GN) Guaraneed Limi Symbol Parameer Tes Condiio CC 55 o 5 C 85 C 5 C Uni IH Minimum High Level Inpu olage ou = 0. or CC 0. I ou A.5 IL Maximum Low Level Inpu olage ou = 0. or CC 0. I ou A.5 OH Minimum High Level Oupu olage in = IH or IL I ou A in = IH or IL I ou 6.0 ma OL Maximum Low Level Oupu olage in = IH or IL I ou A I in Maximum Inpu Leakage Curren in = IH or IL I ou 6.0 ma in = CC or GN ±0. ±.0 ±.0 A I OZ Maximum Three Sae Leakage Curren Oupu in High Impedance Sae in = IL or IH ou = CC or GN ±0.5 ±5.0 ±0 A I CC Maximum uiescen Supply Curren (per Package) in = CC or GN I ou = 0 A A I CC Addiional uiescen Supply in =., Any One Inpu 55 C 5 C o 5 CÎÎÎ Curren in = CC or GN, Oher Inpus ÎÎÎ ÎÎÎ ma.9. NOTE:. Toal Supply Curren = I CC + I CC. l ou = 0 A AC ECTRICAL CHARACTERISTICS ( CC = 5.0 ±0%, C L = 50 pf, Inpu r = f = 6.0 ) ÎÎÎ Guaraneed Limi ÎÎÎ 55 o Symbol ÎÎÎ Parameer 5 C 85 C 5 CÎÎÎ Uni PLH, ÎÎÎ Maximum Propagaion elay, Inpu o 8 5 ÎÎÎ PHL ÎÎÎ (Figures and 5) Î PLH, PHL ÎÎÎ Maximum Propagaion elay, Lach Enable o 0 8 ÎÎÎ (Figures and 5) ÎÎÎ PLZ, Maximum Propagaion elay, Oupu Enable o PHZ ÎÎÎ (Figures and 6) Î PZL, ÎÎÎ Maximum Propagaion elay, Oupu Enable o 5 5 ÎÎÎ PZH (Figures and 6) TLH, Maximum Oupu Traiion Time, Any Oupu 5 8 THL ÎÎÎ (Figures and 5) Î C in Maximum Inpu Capaciance pf C ou Maximum Three Sae Oupu Capaciance ÎÎ (Oupu in High Impedance Sae) Î pf 5 C, CC = 5.0 C P Power issipaion Capaciance (Per Lach)* * Used o deermine he no load dynamic power coumpion: P = C P CC f + I CC CC. 65 pf hp://oemi.com

4 TIMING REUIREMENTS ( CC = 5.0 ±0%, Inpu r = f = 6.0 ) Î Guaraneed Limi ÎÎÎ 55 o Î Symbol Parameer 5 C 85 C 5 C ÎÎÎ Uni su Minimum Seup Time, Inpu o Lach Enable 0 5 ÎÎÎ (Figure ) Î h Minimum Hold Time, Lach Enable o Inpu 0 5 ÎÎ (Figure ) Î w ÎÎÎ Minimum Pulse Widh, Lach Enable 5 8 ÎÎÎ (Figure ) ÎÎ Î r, f ÎÎÎ Maximum Inpu Rise and Fall Times ÎÎÎ (Figure ) ÎÎÎ EXPANE LOGIC IAGRAM LATCH ENAB ENAB hp://oemi.com

5 SWITCHING WAEFORMS INPUT r PLH TLH %. 90% f GN PHL THL LATCH ENAB w PLH PHL GN Figure. Figure. ENAB PZH PHZ PZL PLZ 0% 90% GN HIGH IMPEANCE OL OH HIGH IMPEANCE INPUT LATCH ENAB su ALI h GN GN Figure. Figure. TEST CIRCUITS TEST POINT TEST POINT EICE UNER TEST C L * EICE UNER TEST k C L * CONNECT TO CC WHEN TESTING PLZ AN PZL. CONNECT TO GN WHEN TESTING PHZ AN PZH. *Includes all probe and jig capaciance *Includes all probe and jig capaciance Figure 5. Figure 6. hp://oemi.com 5

6 PACKAGE IMENSIONS TSSOP T SUFFIX CASE 98E 0 ISSUE C 0.5 (0.006) T L 0.5 (0.006) T U X L/ PIN IENT U S S C 0.00 (0.00) T SEATING PLANE X K REF 0.0 (0.00) M T U S S 0 A G H B U N J J N K K ÍÍÍÍ ÍÍÍÍ SORING FOOTPRINT* 7.06 SECTION N N 0.5 (0.00) M NOTES:. IMENSIONING AN TORANCING PER ANSI Y.5M, 98.. CONTROLLING IMENSION: MILLIMETER.. IMENSION A OES NOT INCLUE MOL FLASH, PROTRUSIONS OR GATE BURRS. MOL FLASH OR GATE BURRS SHALL NOT EXCEE 0.5 (0.006) PER SIE.. IMENSION B OES NOT INCLUE INTERA FLASH OR PROTRUSION. INTERA FLASH OR PROTRUSION SHALL NOT EXCEE 0.5 (0.00) PER SIE. 5. IMENSION K OES NOT INCLUE AMBAR PROTRUSION. ALLOWAB AMBAR PROTRUSION SHALL BE 0.08 (0.00) TOTAL IN EXCESS OF THE K IMENSION AT MAXIMUM MATERIAL CONITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. IMENSION A AN B ARE TO BE ETERMINE AT ATUM PLANE W. F MILLIMETERS INCHES IM MIN MAX MIN MAX ETAIL E A B C W F G 0.65 BSC 0.06 BSC H J ETAIL E J K K L 6.0 BSC 0.5 BSC M PITCH 6X 0.6 6X.6 IMENSIONS: MILLIMETERS *For addiional informaion on our Pb Free sraegy and soldering deails, please download he ON Semiconducor Soldering and Mouning Techniques Reference Manual, SORRM/. hp://oemi.com 6

7 PACKAGE IMENSIONS SOIC W SUFFIX CASE ISSUE G H 0X 0.5 M B M E A h X 5 NOTES:. IMENSIONS ARE IN MILLIMETERS.. INTERPRET IMENSIONS AN TORANCES PER ASME Y.5M, 99.. IMENSIONS AN E O NOT INCLUE MOL PROTRUSION.. MAXIMUM MOL PROTRUSION 0.5 PER SIE. 5. IMENSION B OES NOT INCLUE AMBAR PROTRUSION. ALLOWAB PROTRUSION SHALL BE 0. TOTAL IN EXCESS OF B IMENSION AT MAXIMUM MATERIAL CONITION. X B 0.5 M T A S 8X e 0 B B S A A T SEATING PLANE C L MILLIMETERS IM MIN MAX A.5.65 A B C E e.7 BSC H h L ON Semiconducor and he are regisered rademarks of Semiconducor Componens Indusries, LLC (SCILLC) or is subsidiaries in he Unied Saes and/or oher counries. SCILLC ow he righs o a number of paens, rademarks, copyrighs, rade secres, and oher inellecual propery. A lising of SCILLC s produc/paen coverage may be accessed a Marking.pdf. SCILLC reserves he righ o make changes wihou furher noice o any producs herein. SCILLC makes no warrany, represenaion or guaranee regarding he suiabiliy of is producs for any paricular purpose, nor does SCILLC assume any liabiliy arising ou of he applicaion or use of any produc or circui, and specifically disclaims any and all liabiliy, including wihou limiaion special, coequenial or incidenal damages. Typical parameers which may be provided in SCILLC daa shees and/or specificaio can and do vary in differen applicaio and acual performance may vary over ime. All operaing parameers, including Typicals mus be validaed for each cusomer applicaion by cusomer s echnical expers. SCILLC does no convey any licee under is paen righs nor he righs of ohers. SCILLC producs are no designed, inended, or auhorized for use as componens in sysems inended for surgical implan ino he body, or oher applicaio inended o suppor or susain life, or for any oher applicaion in which he failure of he SCILLC produc could creae a siuaion where personal injury or deah may occur. Should Buyer purchase or use SCILLC producs for any such uninended or unauhorized applicaion, Buyer shall indemnify and hold SCILLC and is officers, employees, subsidiaries, affiliaes, and disribuors harmless agai all claims, coss, damages, and expees, and reasonable aorney fees arising ou of, direcly or indirecly, any claim of personal injury or deah associaed wih such uninended or unauhorized use, even if such claim alleges ha SCILLC was negligen regarding he design or manufacure of he par. SCILLC is an Equal Opporuniy/Affirmaive Acion Employer. This lieraure is subjec o all applicable copyrigh laws and is no for resale in any manner. PUBLICATION ORERING INFORMATION LITERATURE FULFILLMENT: Lieraure isribuion Cener for ON Semiconducor P.O. Box 56, enver, Colorado 807 USA Phone: or Toll Free USA/Canada Fax: or Toll Free USA/Canada orderli@oemi.com N. American Technical Suppor: Toll Free USA/Canada Europe, Middle Eas and Africa Technical Suppor: Phone: Japan Cusomer Focus Cener Phone: hp://oemi.com 7 ON Semiconducor Websie: Order Lieraure: hp:// For addiional informaion, please conac your local Sales Represenaive MC7HCT7A/

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