MC14015B. Dual 4 Bit Static Shift Register

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1 M0B Dual Bi Saic Shif egiser The M0B dual bi saic shif regiser is coruced wih MOS Phannel and Nhannel enhancemen mode devices in a single monolihic srucure. I coiss of wo idenical, independen sae serialinpu/paralleloupu regisers. Each regiser has independen lock and ese inpus wih a single serial Daa inpu. The regiser saes are ype D maserslave flipflops. Daa is shifed from one sage o he nex during he posiivegoing clock raiion. Each regiser can be cleared when a high level is applied on he ese line. These complemenary MOS shif regisers find primary use in buffer sorage and serialoparallel conversion where low power dissipaion and/or noise immuniy is desired. PDIP6 P SUFFIX ASE 68 6 MAKIN DIAAMS M0BP AWLYYWW Feaures Diode Proecion on All Inpus Supply Volage ange =.0 Vdc o 8 Vdc Logic Edgelocked FlipFlop Design Logic sae is reained indefiniely wih clock level eiher high or low; informaion is raferred o he oupu only on he posiive going edge of he clock pulse apable of Driving Two Lowpower TTL Loads or One Lowpower Schoky TTL Load Over he aed Temperaure ange PbFree Packages are Available* SOI6 D SUFFIX ASE 75B TSSOP6 DT SUFFIX ASE 8F 6 6 0B AWLYWW 0B ALYW MAXIMUM ATINS (Volages eferenced o V SS ) Symbol Parameer Value Uni D Supply Volage ange 0.5 o +8.0 V V in, V ou I in, I ou P D Inpu or Oupu Volage ange (D or Traien) Inpu or Oupu urren (D or Traien) per Pin Power Dissipaion, per Package (Noe ) 0.5 o V ± 0 ma 500 mw T A Ambien Temperaure ange 55 o +5 T sg Sorage Temperaure ange 65 o +0 T L Lead Temperaure (8Second Soldering) 60 Maximum raings are hose values beyond which device damage can occur. Maximum raings applied o he device are individual sress limi values (no normal operaing condiio) and are no valid simulaneously. If hese limis are exceeded, device funcional operaion is no implied, damage may occur and reliabiliy may be affeced.. Temperaure Deraing: Plasic P and D/DW Packages: 7.0 mw/ From 65 To 5 This device conai proecion circuiry o guard agai damage due o high saic volages or elecric fields. However, precauio mus be aken o avoid applicaio of any volage higher han maximum raed volages o his highimpedance circui. For proper operaion, V in and V ou should be corained o he range V SS (V in or V ou ). Unused inpus mus always be ied o an appropriae logic volage level (e.g., eiher V SS or ). Unused oupus mus be lef open. A WL, L YY, Y WW, W SOEIAJ6 F SUFFIX ASE 66 M0B ALYW = Assembly Locaion = Wafer Lo = Year = Work Week = PbFree Indicaor ODEIN INFOMATION See deailed ordering and shipping informaion in he package dimeio secion on page of his daa shee. *For addiional informaion on our PbFree sraegy and soldering deails, please download he ON Semiconducor Soldering and Mouning Techniques eference Manual, SOLDEM/D. 6 Semiconducor ompone Indusries, LL, 005 Publicaion Order Number: M0B/D

2 M0B PIN ASSINMENT BLOK DIAAM B Q B 6 D B 7 D Q0 Q 5 Q A Q A Q0 A A D A V SS B Q0 B Q B Q B Q A A 6 D Q Q Q0 Q Q Q 0 = PIN 6 V SS = PIN 8 TUTH TABLE D Q0 Q n Q n 0 Q n X 0 No hange No hange X X 0 0 X = Don are Q n = Q0, Q, Q, or Q, as applicable. Q n = Oupu of prior sage. ODEIN INFOMATION Device Package Shipping M0BP PDIP6 500 Unis / ail M0BP PDIP6 500 Unis / ail (PbFree) M0BD SOI6 8 Unis / ail M0BD SOI6 500 Unis / Tape & eel M0BD SOI6 (PbFree) 500 Unis / Tape & eel M0BDT TSSOP6* 500 Unis / Tape & eel M0BFEL SOEIAJ6 000 Unis / Tape & eel M0BFEL SOEIAJ6 (PbFree) 000 Unis / Tape & eel For informaion on ape and reel specificaio, including par orienaion and ape sizes, please refer o our Tape and eel Packaging Specificaio Brochure, BD80/D. *This package is inherenly PbFree.

3 M0B ELETIAL HAATEISTIS (Volages eferenced o V SS ) Î 55 5 ÎÎ 5 V Î haracerisic Î Symbol DD Vdc Min MaxÎ Min Typ Î Max Min Max Uni (Noe ) Oupu Volage 0 Level V Î V in = Î OL Vdc ÎÎ or Î 0 Î Î V in = 0 or Level Î V OH Î Î.5 Vdc Î Inpu Volage 0 Level V IL ÎÎ Vdc Î (V O =.5 or.05 Vdc) 5.0.5Î.5Î.5.5 (V Î O =.0 or.0 Vdc) (V O =.5 or.5 Vdc).0Î 6.75Î.0.0 Î (V O = 0.5 or.5 Vdc) Level Î V IH 5.0 Î (V O =.0 or.0 Vdc) Î.5 Î Î 7.0 Vdc (V O =.5 or.5 Vdc) 8.5 Oupu Drive urren I Î (V OH =.5 Vdc) Source Î OH madc Î..Î.7 Î (V OH =.6 Vdc) Î Î 0.6 (V Î OH =.5 Vdc) (V OH =.5 Vdc). Î. 8.8Î. Î (V OL = 0. Vdc) Sink Î I OL Î (V OL = 0.5 Vdc) Î 0.6 Î..5Î 0. madc (V OL =.5 Vdc) Î Inpu urren I in ± 0. ± ± 0. ±.0 Adc ÎÎ Inpu apaciance Î (V in = 0) Î in Î Î pf Î Quiescen urren Î I DD 5.0 Î (Per Package) Î 5.0 0Î 0.00Î 0 00 Adc Toal Supply urren (Noes & ) I Î (Dynamic plus Quiescen, Î T 5.0 I 0 ÎÎ T = (. A/kHz)f + I DD Adc I T = (. A/kHz)f + I DD Î Per Package) ÎÎ I T = (.6 A/kHz)f + I DD ( Î L = 50 pf on all oupus, all buffers swiching). Daa labelled Typ is no o be used for design purposes bu is inended as an indicaion of he I s poenial performance.. The formulas given are for he ypical characerisics only a 5.. To calculae oal supply curren a loads oher han 50 pf: I T ( L ) = I T (50 pf) + ( L 50) Vfk where: I T is in A (per package), L in pf, V = ( V SS ) in vols, f in khz is inpu frequency, and k = 0.00.

4 M0B SWITHIN HAATEISTIS (Noe 5) ( L = 50 pf, T A = 5 ) haracerisic ÎÎ Symbol Î Î Min Î Typ Î Max Uni (Noe 6) Oupu ise and Fall Time TLH, THL = (.5 /pf) L ÎÎ TLH, + 5 THL Î Î Î TLH, THL = (0.75 /pf) L +.5 ÎÎ 0 Î Î 50 Î 00 TLH, THL = (0.55 /pf) L Propagaion Delay Time lock, Daa o Q ÎÎ PLH, PHL Î Î Î PLH, PHL = (.7 /pf) L + 5 ÎÎ 5.0 Î Î 0 Î 750 PLH, PHL = (0.66 /pf) L PLH, PHL = (0.5 /pf) L + 65 ÎÎ Î Î 0 Î 70 ese o Q Î PLH, PHL = (.7 /pf) L PLH, PHL = (0.66 /pf) L + 7 ÎÎ 0 Î Î 80 Î 50 PLH, PHL = (0.5 /pf) L + 5 ÎÎ Î Î 0 Î 70 lock Pulse Widh ÎÎ WH Î 5.0 Î 00 Î 85 Î Î Î 5 Î 55 Î lock Pulse Frequency ÎÎ f cl Î 5.0 Î Î.0 Î.5 Î 0 Î Î 6.0 Î.0 MHz lock Pulse ise and Fall Times Î TLH, THL 5.0 s Î 0 Î Î Î 5 ese Pulse Widh Î WH Î Î Î Î Î 0 Î 60 Î Seup Time ÎÎ su Î 5.0 Î 50 Î 00 Î The formulas given are for ypical characerisics only a Daa labelled Typ is no o be used for design purposes bu is inended as an indicaion of he I s poenial performance PULSE ENEATO PULSE ENEATO 500 F I D D Q0 Q Q Q 0.0 F EAMI L L L L V SS f LOK 50% DATA Figure. Power Dissipaion Tes ircui and Waveform

5 M0B PAKAE DIMENSIONS PDIP6 P SUFFIX PLASTI DIP PAKAE ASE 6808 ISSUE T 6 A 8 B NOTES:. DIMENSIONIN AND TOLEANIN PE ANSI Y.5M, 8.. ONTOLLIN DIMENSION: INH.. DIMENSION L TO ENTE OF LEADS WHEN FOMED PAALLEL.. DIMENSION B DOES NOT INLUDE MOLD FLASH. 5. OUNDED ONES OPTIONAL. H F S K T SEATIN PLANE D 6 PL 0.5 (0.00) M T A M J L M INHES MILLIMETES DIM MIN MAX MIN MAX A B D F BS.5 BS H BS.7 BS J K L M S SOI6 D SUFFIX PLASTI SOI PAKAE ASE 75B05 ISSUE J A 6 8 B P 8 PL 0.5 (0.00) M B S NOTES:. DIMENSIONIN AND TOLEANIN PE ANSI Y.5M, 8.. ONTOLLIN DIMENSION: MILLIMETE.. DIMENSIONS A AND B DO NOT INLUDE MOLD POTUSION.. MAXIMUM MOLD POTUSION 0. (0.006) PE SIDE. 5. DIMENSION D DOES NOT INLUDE DAMBA POTUSION. ALLOWABLE DAMBA POTUSION SHALL BE 0.7 (0.005) TOTAL IN EXESS OF THE D DIMENSION AT MAXIMUM MATEIAL ONDITION. T SEATIN PLANE K D 6 PL 0.5 (0.00) M T B S A S M X 5 J F MILLIMETES INHES DIM MIN MAX MIN MAX A B D F BS BS J K M P

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