MC14521B. 24 Stage Frequency Divider
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- Melinda Peters
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1 24Stage Frequency Divider The coists of a chain of 24 flipflops with an input circuit that allows three modes of operation. The input will function as a crystal oscillator, an C oscillator, or as an input buffer for an external oscillator. Each flipflop divides the frequency of the previous flipflop by two, coequently this part will count up to 2 24 = 6,777,26. The count advances on the negative going edge of the clock. The outputs of the last sevetages are available for added flexibility. Features All Stages are esettable eset Disables the C Oscillator for Low Standby Power Drain C and Crystal Oscillator Outputs Are Capable of Driving External Loads Test Mode to educe Test Time and Pi Brought Out on Crystal Oscillator Inverter to Allow the Connection of External esistors for LowPower Operation Supply Voltage ange = 3. to 8 Capable of Driving Two LowPower TTL Loads or One LowPower Schottky TTL Load over the ated Temperature ange PbFree Packages are Available* MAXIMUM ATINGS (Voltages eferenced to ) Parameter Symbol Value Unit PDIP6 P SUFFIX CASE SOIC6 D SUFFIX CASE 75B SOEIAJ6 F SUFFIX CASE MAKING DIAGAMS CP AWLYYWWG 452BG AWLYWW ALYWG DC Supply Voltage ange.5 to +8. V Input or Output Voltage ange (DC or Traient) Input or Output Current (DC or Traient) per Pin V in, V out.5 to +.5 V I in, I out ± ma A = Assembly Location WL, L = Wafer Lot YY, Y = Year WW, W = Work Week G = PbFree Package Power Dissipation, per Package (Note ) P D 5 mw Ambient Temperature ange T A 55 to +25 C Storage Temperature ange T stg 65 to +5 C Lead Temperature (8Second Soldering) T L 26 C Stresses exceeding Maximum atings may damage the device. Maximum atings are stress ratings only. Functional operation above the ecommended Operating Conditio is not implied. Extended exposure to stresses above the ecommended Operating Conditio may affect device reliability.. Temperature Derating: Plastic P and D/DW Packages: 7. mw/ C From 65 C To 25 C This device contai protection circuitry to guard agait damage due to high static voltages or electric fields. However, precautio must be taken to avoid applicatio of any voltage higher than maximum rated voltages to this highimpedance circuit. For proper operation, V in and V out should be cotrained to the range (V in or V out ). Unused inputs must always be tied to an appropriate logic voltage level (e.g., either or ). Unused outputs must be left open. ODEING INFOMATION See detailed ordering and shipping information in the package dimeio section on page 2 of this data sheet. *For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques eference Manual, SOLDEM/D.
2 BLOCK DIAGAM ESET 2 IN 6 STAGES THU 7 STAGES 8 THU 24 Q8 Q Q2 PIN ASSIGNMENT 6 7 OUT OUT2 = PIN 6 = PIN ESET Q2 Q Q8 Output Count Capacity Q8 2 8 = 262,44 Q 2 = 524, =,48,576 Q2 2 2 = 2,7, = 4,4, = 8,388, = 6,777,26 8 IN ODEING INFOMATION CP CPG Device Package Shipping PDIP6 PDIP6 25 Units / ail D DG D2 D2G F FG SOIC6 SOIC6 SOIC6 SOIC6 SOEIAJ6 SOEIAJ6 48 Units / ail 25 / Tape & eel 5 Units / ail FEL FELG SOEIAJ6 SOEIAJ6 2 / Tape & eel For information on tape and reel specificatio, including part orientation and tape sizes, please refer to our Tape and eel Packaging Specificatio Brochure, BD8/D. 2
3 ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ELECTICAL CHAACTEISTICS (Voltages eferenced to ) Characteristic Output Voltage V in = or V in = or Level Level Input Voltage Level (V O = 4.5 or.5 ) (V O =. or. ) (V O = or.5 ) Level (V O =.5 or 4.5 ) (V O =. or. ) (V O =.5 or ) Output Drive Current (V OH = 2.5 ) Source (V OH = 4.6 ) Pi 4 & 7 (V OH =.5 ) (V OH = ) (V OH = 2.5 ) Source (V OH = 4.6 ) Pi,, (V OH =.5 ), 2, 3, 4 (V OH = ) and 5 (V OL =.4 ) Sink (V OL =.5 ) (V OL =.5 ) Symbol V OL 5 V OH 5 V IL 5 V IH 5 I OH 5 5 I OL 5 55 C 25 C 25 C Min Max Min Typ (Note 2) Max Min Max Input Current I in 5 ±. ±. ±. ±. Adc Unit madc madc madc Input Capacitance (V in = ) C in 7.5 pf Quiescent Current (Per Package) Total Supply Current (Note 3, 4) (Dynamic plus Quiescent, Per Package) ( = 5 pf on all outputs, all buffers switching) I DD 5 I T I T = (.42 A/kHz) f + I DD I T = (.85 A/kHz) f + I DD I T = (.4 A/kHz) f + I DD 2. Data labelled Typ is not to be used for design purposes but is intended as an indication of the IC s potential performance. 3. The formulas given are for the typical characteristics only at 25 C. 4. To calculate total supply current at loads other than 5 pf: I T ( ) = I T (5 pf) + ( 5) Vfk where: I T is in A (per package), in pf, V = ( ) in volts, f in khz is input frequency, and k = Adc Adc 3
4 ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ SWITCHING CHAACTEISTICS (Note 5) ( = 5 pf, T A = 25 C) Characteristic Output ise and Fall Time (Counter Outputs) t TLH, t THL = (.5 /pf) + 25 t TLH, t THL = (.75 /pf) t TLH, t THL = (.55 /pf) Propagation Delay Time Clock to Q8 t PHL, t PLH = (.7 /pf) t PHL, t PLH = (.66 /pf) t PHL, t PLH = (.5 /pf) Clock to t PHL, t PLH = (.7 /pf) + 55 t PHL, t PLH = (.66 /pf) t PHL, t PLH = (.5 /pf) Propagation Delay Time eset to Q n t PHL = (.7 /pf) + 25 t PHL = (.66 /pf) t PHL = (.5 /pf) + 35 Symbol t TLH, t THL 5 t PHL, t PLH t PHL Clock Pulse Width t WH(cl) 5 Clock Pulse Frequency f cl 5 Clock ise and Fall Time t TLH, t THL 5 eset Pulse Width t WH() 5 eset emoval Time t rem Min Typ (Note 6) Max Unit The formulas given are for the typical characteristics only at 25 C. 6. Data labelled Typ is not to be used for design purposes but is intended as an indication of the IC s potential performance s MHz s 5 F I D. F CEAMIC PULSE GENEATO Q8 Q Q2 V in 2 2 % 5% % V 5% DUTY CYCLE Figure. Power Dissipation Test Circuit and Waveform 4
5 PULSE GENEATO Q8 Q Q2 Q n % % % t WL t WH 5% % % t PLH t PHL t TLH t THL Figure 2. Switching Time Test Circuit and Waveforms C S o C T 8 M IN * OUT Q8 Q Q2 *Optional for low power operation, k 7 k. Figure 3. Crystal Oscillator Circuit * Characteristic 5 khz Circuit Crystal Characteristics esonant Frequency 5 Equivalent esistance, S. External esistor/capacitor Values o C T C S Frequency Stability Frequency Change as a Function of (T A = 25 C) Change from V to V Change from V to 5 V Frequency Change as a Function of Temperature ( = V) T A Change from 55 C to + 25 C MC452 only Complete Oscillator* T A Change from +25 C to+25 C MC452 only Complete Oscillator* khz Circuit Unit khz k k pf pf *Complete oscillator includes crystal, capacitors, and resistors. ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ Figure 4. Typical Data for Crystal Oscillator Circuit 5
6 FEQUENCY DEVIATION (%) = 5 V V V Figure 5. C Oscillator Stability TEST CICUIT FIGUE 7 2 TC = 56 k, S =, f =.5 = V, T A = 25 C { C = pf 6 S = 2 k, f = 7.8 = V, T A = 25 C T A, AMBIENT TEMPEATUE ( C), DEVICE ONLY f, OSCILLATO FEQUENCY (khz) f AS A FUNCTION OF C ( TC = 56 k ) ( S = 2 k) = V TEST CICUIT FIGUE 7 f AS A FUNCTION OF TC (C = pf) ( S 2 TC ).. k k k. m TC, ESISTANCE (OHMS).... C, CAPACITANCE ( F) Figure 6. C Oscillator Frequency as a Function of TC and C S TC C IN OUT Q8 Q Q2 PULSE GENEATO IN Q8 Q Q2 OUT Figure 7. C Oscillator Circuit Figure 8. Functional Test Circuit ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ FUNCTIONAL TEST SEQUENCE A test function (see Figure 8) has been included for the reduction of test time required to exercise all 24 counter stages. This test function divides the counter into three 8stage sectio, and 255 counts are loaded in each of the 8stage sectio in parallel. All flipflops are now at a logic. The counter is now returned to the normal 24stages in series configuration. One more pulse is entered into Input 2 (In 2) which will cause the counter to ripple from an all state to an all state. Inputs Outputs Comments eset In 2 Out 2 Q8 thru GND Counter is in three 8stage sectio in parallel mode Counter is reset. In 2 and Out 2 are connected together. First to traition on In 2, Out 2 node. 255 to traitio are clocked into this In 2, Out 2 node. The 255th to traition. GND Counter converted back to 24stages in series mode. Out 2 converts back to an output. Counter ripples from an all state to an all stage. 6
7 LOGIC DIAGAM 5 ESET 2 IN 2 STAGES 8 3 THU 7 7 OUT STAGES 6 THU Q8 Q 2 3 Q2 4 5 = PIN 6 = PIN 8 7
8 PACKAGE DIMENSIONS PDIP6 CASE 6488 ISSUE T A 6 8 B NOTES:. DIMENSIONING AND TOLEANCING PE ANSI Y4.5M, CONTOLLING DIMENSION: INCH. 3. DIMENSION L TO CENTE OF LEADS WHEN FOMED PAALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. OUNDED CONES OPTIONAL. H G F D 6 PL S C K.25 (.) M T T SEATING PLANE A M J L M INCHES MILLIMETES DIM MIN MAX MIN MAX A B C D F G. BSC 2.54 BSC H BSC.27 BSC J K L M S SOIC6 CASE 75B5 ISSUE J A 6 8 B P 8 PL.25 (.) M B S NOTES:. DIMENSIONING AND TOLEANCING PE ANSI Y4.5M, CONTOLLING DIMENSION: MILLIMETE. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD POTUSION. 4. MAXIMUM MOLD POTUSION.5 (.6) PE SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBA POTUSION. ALLOWABLE DAMBA POTUSION SHALL BE.27 (.5) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATEIAL CONDITION. T SEATING PLANE G K C D 6 PL.25 (.) M T B S A S M X 45 J F MILLIMETES INCHES DIM MIN MAX MIN MAX A B C D F G.27 BSC BSC J K M 7 7 P
9 PACKAGE DIMENSIONS SOEIAJ6 CASE 66 ISSUE A e 6 Z b D A H E A.3 (.5) M. (.4) 8 E VIEW P M L E Q L DETAIL P c NOTES: М. DIMENSIONING AND TOLEANCING PE ANSI Y4.5M, 82. М 2. CONTOLLING DIMENSION: MILLIMETE. М 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH O POTUSIONS AND AE MEASUED AT THE PATING LINE. MOLD FLASH O POTUSIONS SHALL NOT EXCEED.5 (.6) PE SIDE. М 4. TEMINAL NUMBES AE SHOWN FO EFEENCE ONLY. М 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBA POTUSION. ALLOWABLE DAMBA POTUSION SHALL BE.8 (.3) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATEIAL CONDITION. DAMBA CANNOT BE LOCATED ON THE LOWE ADIUS O THE FOOT. MINIMUM SPACE BETWEEN POTUSIONS AND ADJACENT LEAD TO BE.46 (.8). MILLIMETES INCHES DIM MIN MAX MIN MAX A A b c D E e.27 BSC BSC H E L L E M Q Z
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