BCD-TO-DECIMAL DECODER HIGH-VOLTAGE SILICON-GATE CMOS IW4028B TECHNICAL DATA
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1 TECHNICAL DATA BCD-TO-DECIMAL DECODER HIGH-OLTAGE SILICON-GATE CMOS IW4028B The IW4028B types are BCD-to-decimal or binary-tooctal decoders consisting of buffering on all 4 inputs, decoding-logic gates, and output buffers. A BCD code applied to the four inputs, A0 to A3 results in a high level at the selected one of decimal decoded outputs. Similarly, a 3-bit binary code applied to inputs A0 through A2 is decoded in octal code at output 0 to7 if A3= 0. High drive capability is provided at all outputs to enhance dc and dynamic performance in high fan-out applications. FEATURES BCD-to-decimal decoding or binary-to-octal decoding Operating oltage Range: 3.0 to 18 Maximum input current of 1 A at 18 over full package-temperature range; 0 na at 18 and 25 C Noise margin (over full package temperature range): 1.0 supply 2.0 supply 2.5 supply ORDERING INFORMATION IW4028BN Plastic IW4028BD SOIC T A = -55 to 125 C for all packages PIN ASSIGNMENT ORDERING INFORMATION Device Operating Temperature Range Package Packing IW4028BN DIP 16 Tube IW4028BD Т А = С SOP16 Tube IW4028BDT SOP16 Tape & Reel LOGIC DIAGRAM PIN 16= CC PIN 8= GND February, er. 00
2 MAXIMUM RATINGS * Symbol Parameter alue Unit CC DC Supply oltage (Referenced to GND) -0.5 to +20 IN DC Input oltage (Referenced to GND) -0.5 to CC +0.5 OUT DC Output oltage (Referenced to GND) -0.5 to CC +0.5 I IN DC Input Current, per Pin ma P D Power Dissipation in Still Air, Plastic DIP+ SOIC Package+ P D Power Dissipation per Output Transistor 0 mw Tstg Storage Temperature -65 to +0 C T L Lead Temperature, 1 mm from Case for Seconds (Plastic DIP or SOIC Package) 260 C * Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. + Derating - Plastic DIP: - mw/ C from 65 to 125 C SOIC Package: - 7 mw/ C from 65 to 125 C mw RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Max Unit CC DC Supply oltage (Referenced to GND) IN, OUT DC Input oltage, Output oltage (Referenced to GND) 0 CC T A Operating Temperature, All Package Types C This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, IN and OUT should be constrained to the range GND ( IN or OUT ) CC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or CC ). Unused outputs must be left open February, er. 00
3 DC ELECTRICAL CHARACTERISTICS (oltages Referenced to GND) Symbol Parameter Test Conditions IH IL OH OL I IN I CC I OL I OH Minimum High-Level Input oltage Maximum Low -Level Input oltage Minimum High-Level Output oltage Maximum Low-Level Output oltage Maximum Input Leakage Current Maximum Quiescent Supply Current (per Package) Minimum Output Low (Sink) Current Minimum Output High (Source) Current OUT = 0.5 or CC OUT = 1.0 or CC OUT = 1.5 or CC OUT = 0.5 or CC OUT = 1.0 or CC OUT = 1.5 or CC CC IN =GND or CC IN =GND or CC Guaranteed Limit -55 C 25 C 125 C Unit IN = GND or CC A IN = GND or CC 20 IN = GND or CC OL =0.4 OL =0.5 OL =1.5 IN = GND or CC OH =2.5 OH =4.6 OH =9.5 OH = A ma ma February, er. 00
4 AC ELECTRICAL CHARACTERISTICS (C L =50pF, R L =200k, Input t r = t f = 20 ns) Symbol Parameter CC Guaranteed Limit -55 C 25 C 125 C Unit t PHL, t PLH Maximum Propagation Delay, Input A to Output Y (Figure 1) ns t THL, t TLH Maximum Output Transition Time, Any Output (Figure 1) ns C IN Maximum Input Capacitance pf FUNCTION TABLE Inputs Outputs A3 A2 A1 A0 Y0 Y1 Y2 Y3 Y4 Y5 Y6 Y7 Y8 Y9 L L L L H L L L L L L L L L L L L H L H L L L L L L L L L L H L L L H L L L L L L L L L H H L L L H L L L L L L L H L L L L L L H L L L L L L H L H L L L L L H L L L L L H H L L L L L L L H L L L L H H H L L L L L L L H L L H L L L L L L L L L L L H L H L L H L L L L L L L L L H H L H L L L L L L L L L L L H L H H L L L L L L L L L L H H L L L L L L L L L L L L H H L H L L L L L L L L L L H H H L L L L L L L L L L L H H H H L L L L L L L L L L February, er. 00
5 Figure 1. Switching Waveforms EXPANDED LOGIC DIAGRAM Figure February, er. 00
6 PACKAGE DIMENSION N SUFFIX PLASTIC (MS - 001BB) A 16 1 G F 0.25 (0.0) M T 9 8 D N B -T- C -T- NOTES: 1. imensions A, B do not include mold flash or protrusions. Maximum mold flash or protrusions 0.25 mm (0.0) per side. K SEATING PLANE M L H J Dimensions, mm Symbol MIN MAX A B C 5.33 D F G 2.54 H 7.62 J 0 K L M N 0.38 D SUFFIX SOIC (MS - 012AC) H 16 1 D G A 0.25 (0.0) M T C M 9 8 NOTES: 1.Dimensions A and B do not include mold flash or protrusion. 2.Maximum mold flash or protrusion 0. mm (0.006) per side for A, for B mm (0.0) per side. B K P C SEATING PLANE J R x 45 F M Dimensions, mm Symbol. MIN MAX A B C D F G 1.27 H 5.72 J 0 8 K M P R February, er. 00
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