MC14555B, MC14556B. Dual Binary to 1 of 4 Decoder/Demultiplexer
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- James Lambert
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1 MC, MC6 Dual inary to of Decoder/Demultiplexer The MC and MC6 are cotructed with complementary MOS (CMOS) enhancement mode devices. ach Decoder/Demultiplexer has two select inputs ( and ), an active low nable input (), and four mutually exclusive outputs (Q, Q, Q, Q). The MC has the selected output go to the high state, and the MC6 has the selected output go to the low state. xpanded decoding such as binarytohexadecimal (of6), etc., can be achieved by using other MC or MC6 devices. pplicatio include code conversion, address decoding, memory selection control, and demultiplexing (using the nable input as a data input) in digital data tramission systems. Features Diode Protection on ll Inputs ctive High or ctive Low Outputs xpandable Supply Voltage Range = to 8 ll Outputs uffered Capable of Driving Two LowPower TTL Loads or One LowPower Schottky TTL Load Over the Rated Temperature Range PbFree Packages are vailable PDIP6 P SUFFIX CS 68 6 SOIC6 D SUFFIX CS 7 SOIJ6 F SUFFIX CS MRKING DIGRMS MCxCP WLYYWWG xg WLYWW MCx LYWG MXIMUM RTINGS (Voltages Referenced to ) Parameter Symbol Value Unit DC Supply Voltage Range. to +8. V Input or Output Voltage Range (DC or Traient) Input or Output Current (DC or Traient) per Pin V in, V out. to +. V I in, I out ± m Power Dissipation, per Package (Note ) P D mw mbient Temperature Range T to + C Storage Temperature Range T stg 6 to + C Lead Temperature (8Second Soldering) T L 6 C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditio is not implied. xtended exposure to stresses above the Recommended Operating Conditio may affect device reliability.. Temperature Derating: Plastic P and D/DW Packages: mw/ C From 6 C To C This device contai protection circuitry to guard agait damage due to high static voltages or electric fields. However, precautio must be taken to avoid applicatio of any voltage higher than maximum rated voltages to this highimpedance circuit. For proper operation, V in and V out should be cotrained to the range (V in or V out ). Unused inputs must always be tied to an appropriate logic voltage level (e.g., either or ). Unused outputs must be left open. For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDRRM/D. Q Q Q Q x = or 6 = ssembly Location WL, L = Wafer Lot YY, Y = Year WW, W = Work Week G = PbFree Package MC PIN SSIGNMNTS 6 Q Q Q Q ORDRING INFORMTION See detailed ordering and shipping information in the package dimeio section on page of this data sheet. Q Q Q Q MC Q Q Q Q Semiconductor Components Industries, LLC, 6 Publication Order Number: MC/D
2 MC, MC6 Inputs TRUTH TL Outputs nable Select MC MC6 Q Q Q Q Q Q Q Q X X X = Don t Care MC Q Q Q 6 Q 7 Q Q Q Q LOCK DIGRM = PIN 6 = PIN 8 MC6 Q Q Q 6 Q 7 Q Q Q Q ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ LCTRICL CHRCTRISTICS (Voltages Referenced to ) Characteristic Output Voltage Level V in = or Symbol V Level V in = or OH C C C Min Max Min Typ (Note ) Max Min Max... Unit Input Voltage Level (V O =. or. ) (V O =. or. ) (V O = or. ) V IL Level (V O =. or. ) (V O =. or. ) (V O =. or ) V IH Output Drive Current ( =. ) Source ( =.6 ) ( =. ) ( = ) I OH mdc ( =. ) Sink ( =. ) ( =. ) I OL mdc Input Current I in ±. ±. ±. ±. dc Input Capacitance, (V in = ) C in 7. pf Quiescent Current (Per Package) I DD... 6 dc Total Supply Current (Notes, ) (Dynamic plus Quiescent, Per Package) (C L = pf on all outputs, all buffers switching) I T I T = (.8 /khz) f + I DD I T = (.7 /khz) f + I DD I T = (.6 /khz) f + I DD. Data labelled Typ is not to be used for design purposes but is intended as an indication of the IC s potential performance.. The formulas given are for the typical characteristics only at C.. To calculate total supply current at loads other than pf: I T (C L ) = I T ( pf) + (C L ) Vfk where: I T is in (per package), C L in pf, V = ( ) in volts, f in khz is input frequency, and k =.. dc
3 MC, MC6 ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ SWITCHING CHRCTRISTICS (Note ) (C L = pf, T = C) Characteristic Symbol Min Output Rise and Fall Time t TLH, t THL = (. /pf) C L + t TLH, t THL = (.7 /pf) C L +. t TLH, t THL = (. /pf) C L +. Propagation Delay Time, to Output t PLH, t PHL = (.7 /pf) C L + t PLH, t PHL = (.66 /pf) C L + 6 t PLH, t PHL = (. /pf) C L + Propagation Delay Time to Output t PLH, t PHL = (.7 /pf) C L + t PLH, t PHL = (.66 /pf) C L + t PLH, t PHL = (. /pf) C L + t TLH, t THL t PLH, t PHL t PLH, t PHL Typ (Note 6) Max Unit. The formulas given are for the typical characteristics only at C. 6. Data labelled Typ is not to be used for design purposes but is intended as an indication of the IC s potential performance INPUTS ( DUTY CYCL) INPUTS ( DUTY CYCL) OUTPUT Q INPUT LOW % % ll 8 outputs connect to respective C L loads. f in respect to a system clock. f INPUT HIGH, INPUT LOW INPUT t PHL OUTPUT Q MC6 t THL t PLH OUTPUT Q MC t TLH % % % % % % t PLH t TLH t PHL tthl Figure. Dynamic Power Dissipation Signal Waveforms Figure. Dynamic Signal Waveforms LOGIC DIGRM (/ of Dual) Q Q Q Q liminated for MC
4 MC, MC6 ORDRING INFORMTION MCCP MCCPG Device Package Shipping PDIP6 PDIP6 (PbFree) Units / Rail MCD MCDG MCDR MCDRG MCFL MCFLG MC6CP MC6CPG SOIC6 SOIC6 (PbFree) SOIC6 SOIC6 (PbFree) SOIJ6 SOIJ6 (PbFree) PDIP6 PDIP6 (PbFree) 8 Units / Rail / Tape & Reel / Tape & Reel Units / Rail MC6D SOIC6 8 Units / Rail MC6DR MC6DRG SOIC6 SOIC6 (PbFree) / Tape & Reel MC6F SOIJ6 Units / Tube MC6FL MC6FLG SOIJ6 SOIJ6 (PbFree) / Tape & Reel For information on tape and reel specificatio, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specificatio rochure, RD8/D.
5 MC, MC6 PCKG DIMNSIONS PDIP6 CS 688 ISSU T 6 8 NOTS:. DIMNSIONING ND TOLRNCING PR NSI Y.M, 8.. CONTROLLING DIMNSION: INCH.. DIMNSION L TO CNTR OF LDS WHN FORMD PRLLL.. DIMNSION DOS NOT INCLUD MOLD FLSH.. ROUNDD CORNRS OPTIONL. H G F S C K STING T PLN D 6 PL. (.) M T M J L M INCHS MILLIMTRS DIM MIN MX MIN MX C D.... F G. SC. SC H SC.7 SC J K...8. L M S.... SOIC6 CS 7 ISSU J 6 8 P 8 PL. (.) M S NOTS:. DIMNSIONING ND TOLRNCING PR NSI Y.M, 8.. CONTROLLING DIMNSION: MILLIMTR.. DIMNSIONS ND DO NOT INCLUD MOLD PROTRUSION.. MXIMUM MOLD PROTRUSION. (.6) PR SID.. DIMNSION D DOS NOT INCLUD DMR PROTRUSION. LLOWL DMR PROTRUSION SHLL.7 (.) TOTL IN XCSS OF TH D DIMNSION T MXIMUM MTRIL CONDITION. T STING PLN G K C D 6 PL. (.) M T S S M R X J F MILLIMTRS INCHS DIM MIN MX MIN MX C D.... F...6. G.7 SC SC J...8. K.... M 7 7 P R....
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