MC74HC573A. Octal 3 State Noninverting Transparent Latch. High Performance Silicon Gate CMOS

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1 Ocal 3 Sae Noninvering Transparen Lach High Performance Silicon Gae CMOS The MC74HC573A is idenical in pinou o he LS573. The devices are compaible wih sandard CMOS oupus; wih pullup resisors, hey are compaible wih LSTTL oupus. These laches appear ransparen o daa (i.e., he oupus change asynchronously) when Lach Enable is high. When Lach Enable goes low, daa meeing he seup and hold ime becomes lached. The HC573A is idenical in funcion o he HC373A bu has he daa inpus on he opposie side of he package from he oupus o faciliae PC board layou. Feaures Oupu Drive Capabiliy: 5 LSTTL Loads Oupus Direcly Inerface o CMOS, NMOS and TTL Operaing Volage Range: 2.0 o 6.0 V Low Inpu Curren:.0 A In Compliance wih he JEDEC Sandard No. 7.0 A Requiremens Chip Complexiy: 28 FETs or 54.5 Equivalen Gaes Pb Free Packages are Available* hp://onsemi.com PDIP N SUFFIX CASE 738 SOIC DW SUFFIX CASE 75D MARKING DIAGRAMS MC74HC573AN AWLYYWWG 74HC573A AWLYYWWG TSSOP DT SUFFIX CASE 948E HC 573A ALYW SOEIAJ F SUFFIX CASE HC573A AWLYWWG A = Assembly Locaion WL, L = Wafer Lo YY, Y = Year WW, W = Work Week G = Pb Free Package = Pb Free Package (Noe: Microdo may be in eiher locaion) ORDERING INFORMATION See deailed ordering and shipping informaion in he package dimensions secion on page 2 of his daa shee. *For addiional informaion on our Pb Free sraegy and soldering deails, please download he ON Semiconducor Soldering and Mouning Techniques Reference Manual, SOLDERRM/D. Semiconducor Componens Indusries, LLC, 05 July, 05 Rev. Publicaion Order Number: MC74HC573A/D

2 PIN ASSIGNMENT OUTPUT D0 2 D 3 D2 4 D3 5 D4 6 D5 7 D Q0 Q Q2 Q3 Q4 Q5 Q6 Design Crieria Value Unis Inernal Gae Coun* 54.5 ea. Inernal Gae Progaion Delay.5 ns Inernal Gae Power Dissipaion 5.0 W Speed Power Produc pj *Equivalen o a wo inpu NAND gae. D Q7 LATCH LOGIC DIAGRAM FUNCTION TABLE Inpus Oupu Oupu Lach Enable Enable D Q L H H H L H L L L L X No Change H X X Z X = Don Care Z = High Impedance DATA INPUTS D0 D D2 D3 D4 D5 D6 D7 LATCH OUTPUT 2 9 Q0 3 8 Q 4 7 Q2 5 6 Q3 6 5 Q4 7 4 Q5 8 3 Q6 9 2 Q7 PIN = PIN 0 = NONINVERTING OUTPUTS ORDERING INFORMATION Device Package Shipping MC74HC573AN PDIP 8 Unis / Rail MC74HC573ANG SOIC (Pb Free) 8 Unis / Rail MC74HC573ADW SOIC WIDE 38 Unis / Rail MC74HC573ADWG SOIC WIDE (Pb Free) 38 Unis / Rail MC74HC573ADWR2 SOIC WIDE 000 Tape & Reel MC74HC573ADWR2G SOIC WIDE (Pb Free) 000 Tape & Reel MC74HC573ADT TSSOP * 75 Unis / Rail MC74HC573ADTG TSSOP * 75 Unis / Rail MC74HC573ADTR2 TSSOP * 2500 Tape & Reel MC74HC573ADTR2G TSSOP * 2500 Tape & Reel MC74HC573AFEL SOEIAJ 00 Tape & Reel MC74HC573AFELG SOEIAJ (Pb Free) 00 Tape & Reel For informaion on ape and reel specificaions, including par orienaion and ape sizes, please refer o our Tape and Reel Packaging Specificaions Brochure, BRD80/D. *This package is inherenly Pb Free. hp://onsemi.com 2

3 MAXIMUM RATINGS Symbol Parameer Î Value Uni DC Supply Volage (Referenced o ) Î 0.5 o V V in DC Inpu Volage (Referenced o ) 0.5 o V V ou DC Oupu Volage (Referenced o ) 0.5 o V I in DC Inpu Curren, per Pin ± ma I ou DC Oupu Curren, per Pin Î ± 35 ma I CC DC Supply Curren, and Pins Î ± 75 ma P D Power Dissipaion in Sill Air, Plasic DIP Î 750 mw SOIC Package 500 Î TSSOP Package Î 450 T sg Sorage Temperaure Î 65 o + 50 C T L Lead Temperaure, mm from Case for 0 Seconds C Î (Plasic DIP, TSSOP or SOIC Package) 260 Maximum raings are hose values beyond which device damage can occur. Maximum raings applied o he device are individual sress limi values (no normal operaing condiions) and are no valid simulaneously. If hese limis are exceeded, device funcional operaion is no implied, damage may occur and reliabiliy may be affeced. Deraing Plasic DIP: 0 mw/ C from 65 o 25 C SOIC Package: 7 mw/ C from 65 o 25 C TSSOP Package: 6. mw/ C from 65 o 25 C For high frequency or heavy load consideraions, see Chaper 2 of he ON Semiconducor High Speed CMOS Daa Book (DL29/D). RECOMMENDED OPERATING CONDITIONS Symbol Parameer Min Max Uni DC Supply Volage (Referenced o ) V V in, V ou DC Inpu Volage, Oupu Volage (Referenced o ) 0 V T A Operaing Temperaure, All Package Types C r, f Inpu Rise and Fall Time V CC = 2.0 V ns (Figure ) = 4.5 V Î = 6.0 V DC ELECTRICAL CHARACTERISTICS (Volages Referenced o ) Guaraneed Limi 55 o Symbol Parameer Tes Condiions V 25 C 85 C 25 C Uni V IH Minimum High Level Inpu Volage Î V ou = 0. V or 0. V V I Î ou A V IL Maximum Low Level Inpu Volage Î Î V ou = 0. V or 0. V V I ou A V OH Minimum High Level Oupu Î V in = V IH or V IL Î Volage Î I ou A Î V Î V in = V IH or V IL I ou 2.4mA Î I ou 6.0 ma I ou ma V OL Maximum Low Level Oupu Î V ou = 0. V or 0. V Î Volage Î I ou A Î V Î V in = V IH or V IL I ou 2.4mA Î I ou 6.0 ma I ou ma I in Maximum Inpu Leakage Curren Î V in = or 6.0 ± 0. ±.0 ±.0 A I OZ Maximum Three Sae Leakage Î Oupu in High Impedance Sae Curren V Î in = V IL or V IH V ou = or A I CC Maximum Quiescen Supply Î V in = or A Curren (per Package) II ou I = 0 A This device conains proecion circuiry o guard agains damage due o high saic volages or elecric fields. However, precauions mus be aken o avoid applicaions of any volage higher han maximum raed volages o his high impedance circui. For proper operaion, V in and V ou should be consrained o he range (V in or V ou ). Unused inpus mus always be ied o an appropriae logic volage level (e.g., eiher or ). Unused oupus mus be lef open. NOTE: Informaion on ypical parameric values can be found in Chaper 2 of he ON Semiconducor High Speed CMOS Daa Book (DL29/D). hp://onsemi.com 3

4 AC ELECTRICAL CHARACTERISTICS (C L = 50 pf, Inpu r = f = 6.0 ns) Guaraneed Limi Symbol Parameer V 55 o 25 C 85 C 25 C Uni Î PLH, Maximum Propagaion Delay, Inpu D o Q ns PHL Î (Figures and 5) 3.0Î Î PLH, Î Maximum Propagaion Delay, Lach Enable o Q 2.0Î ns PHL Î (Figures 2 and 5) 3.0Î Î PLZ, Î Maximum Propagaion Delay, Oupu Enable o Q 2.0Î ns PHZ (Figures 3 and 6) Î PZL, Î Maximum Propagaion Delay, Oupu Enable o Q 2.0Î ns PZH (Figures 3 and 6) Î Î TLH, Maximum Oupu Transiion Time, Any Oupu ns THL (Figures and 5) Î Î C in Maximum Inpu Capaciance pf C ou Î Maximum 3 Sae Oupu Capaciance (Oupu in High Impedance Sae) pf NOTE: For propagaion delays wih loads oher han 50 pf, and informaion on ypical parameric values, see Chaper 2 of he ON Semiconducor High Speed CMOS Daa Book (DL29/D). 25 C, = 5.0 V C PD Power Dissipaion Capaciance (Per Enabled Oupu)* 23 pf * Used o deermine he no load dynamic power consumpion: P D = C PD V 2 CC f + I CC. For load consideraions, see Chaper 2 of he ON Semiconducor High Speed CMOS Daa Book (DL29/D). Î TIMING REQUIREMENTS (C L = 50 pf, Inpu r = f = 6.0 ns) Guaraneed Limi Î 55 o 25 C Î 85 C 25 C Symbol Parameer Figure V Min Max Min Max Min Max Uni Î su Minimum Seup Time, Inpu D o Lach Enable ns Î h Minimum Hold Time, Lach Enable o Inpu D ns Î Î w Minimum Pulse Widh, Lach Enable ns Î Î r, f Maximum Inpu Rise and Fall Times ns Î Î hp://onsemi.com 4

5 SWITCHING WAVEFORMS INPUT D r 0% 90% f LATCH w Q PLH 0% 90% PHL PLH PHL TLH THL Q Figure. Figure 2. OUTPUT Q Q.3 V PZL PZH PLZ PHZ 0% 90% 3.0 V HIGH IMPEDANCE V OL V OH HIGH IMPEDANCE INPUT D LATCH Figure 3. Figure 4. SU VALID h TEST POINT D0 2 D 9 Q0 DEVICE UNDER TEST OUTPUT C L * D 3 D 8 Q D2 4 D 7 Q2 *Includes all probe and jig capaciance Figure 5. Tes Circui D3 5 D 6 Q3 D4 6 D 5 Q4 D5 7 D 4 Q5 DEVICE UNDER TEST TEST POINT OUTPUT k C L * CONNECT TO WHEN TESTING PLZ AND PZL. CONNECT TO WHEN TESTING PHZ AND PZH. D6 8 D 3 Q6 D7 9 D 2 Q7 LATCH *Includes all probe and jig capaciance OUTPUT Figure 6. Tes Circui Figure 7. EXPANDED LOGIC DIAGRAM hp://onsemi.com 5

6 PACKAGE DIMENSIONS PDIP N SUFFIX PLASTIC DIP PACKAGE CASE ISSUE E A 0 B NOTES:. DIMENSIONING AND TOLERANCING PER ANSI Y4.5M, CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. T SEATING PLANE G E F N K C D PL 0.25 (0.00) M T A M L M J PL 0.25 (0.00) M T B M INCHES MILLIMETERS DIM MIN MAX MIN MAX A B C D E BSC.27 BSC F G 0.00 BSC 2.54 BSC J K L BSC 7.62 BSC M N SOIC DW SUFFIX CASE 75D 05 ISSUE G H 0X 0.25 M B M D E A h X 45 NOTES:. DIMENSIONS ARE IN MILLIMETERS. 2. INTERPRET DIMENSIONS AND TOLERANCES PER ASME Y4.5M, DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.5 PER SIDE. 5. DIMENSION B DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.3 TOTAL IN EXCESS OF B DIMENSION AT MAXIMUM MATERIAL CONDITION. X B 0.25 M T A S 8X e 0 B B S A A T SEATING PLANE C L MILLIMETERS DIM MIN MAX A A B C D E e.27 BSC H h L hp://onsemi.com 6

7 PACKAGE DIMENSIONS TSSOP DT SUFFIX CASE 948E 02 ISSUE B 0.5 (0.006) T L U 2X L/2 0.5 (0.006) T U S PIN IDENT S C 0.00 (0.004) T SEATING PLANE X K REF 0.0 (0.004) M T U S V S 0 A V D G H B U J J N N K K ÍÍÍÍ ÍÍÍÍ SECTION N N F DETAIL E 0.25 (0.00) DETAIL E M W NOTES:. DIMENSIONING AND TOLERANCING PER ANSI Y4.5M, CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.5 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.00) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE W. MILLIMETERS INCHES DIM MIN MAX MIN MAX A B C D F G 0.65 BSC BSC H J J K K L 6.40 BSC BSC M hp://onsemi.com 7

8 PACKAGE DIMENSIONS SOEIAJ F SUFFIX CASE ISSUE O e E H E 0 Z D A L E Q M L DETAIL P VIEW P c NOTES:. DIMENSIONING AND TOLERANCING PER ANSI Y4.5M, CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.5 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.08). b A 0.3 (0.005) M 0.0 (0.004) MILLIMETERS INCHES DIM MIN MAX MIN MAX A A b c D E e.27 BSC BSC H E L L E M Q Z ON Semiconducor and are regisered rademarks of Semiconducor Componens Indusries, LLC (SCILLC). SCILLC reserves he righ o make changes wihou furher noice o any producs herein. SCILLC makes no warrany, represenaion or guaranee regarding he suiabiliy of is producs for any paricular purpose, nor does SCILLC assume any liabiliy arising ou of he applicaion or use of any produc or circui, and specifically disclaims any and all liabiliy, including wihou limiaion special, consequenial or incidenal damages. Typical parameers which may be provided in SCILLC daa shees and/or specificaions can and do vary in differen applicaions and acual performance may vary over ime. All operaing parameers, including Typicals mus be validaed for each cusomer applicaion by cusomer s echnical expers. SCILLC does no convey any license under is paen righs nor he righs of ohers. SCILLC producs are no designed, inended, or auhorized for use as componens in sysems inended for surgical implan ino he body, or oher applicaions inended o suppor or susain life, or for any oher applicaion in which he failure of he SCILLC produc could creae a siuaion where personal injury or deah may occur. Should Buyer purchase or use SCILLC producs for any such uninended or unauhorized applicaion, Buyer shall indemnify and hold SCILLC and is officers, employees, subsidiaries, affiliaes, and disribuors harmless agains all claims, coss, damages, and expenses, and reasonable aorney fees arising ou of, direcly or indirecly, any claim of personal injury or deah associaed wih such uninended or unauhorized use, even if such claim alleges ha SCILLC was negligen regarding he design or manufacure of he par. SCILLC is an Equal Opporuniy/Affirmaive Acion Employer. This lieraure is subjec o all applicable copyrigh laws and is no for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Lieraure Disribuion Cener for ON Semiconducor P.O. Box 632, Phoenix, Arizona USA Phone: or Toll Free USA/Canada Fax: or Toll Free USA/Canada orderli@onsemi.com N. American Technical Suppor: Toll Free USA/Canada Japan: ON Semiconducor, Japan Cusomer Focus Cener 2 9 Kamimeguro, Meguro ku, Tokyo, Japan Phone: hp://onsemi.com 8 ON Semiconducor Websie: hp://onsemi.com Order Lieraure: hp:// For addiional informaion, please conac your local Sales Represenaive. MC74HC573A/D

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