MC74HC165A. 8 Bit Serial or Parallel Input/ Serial Output Shift Register. High Performance Silicon Gate CMOS

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1 MC74CA 8 Bi Serial or Parallel Inpu/ Serial Oupu Shif Regiser igh Performance Silicon Gae CMOS The MC74CA is idenical in pinou o he S. The device inpus are compaible wih sandard CMOS oupus; wih pullup resisors, hey are compaible wih STT oupus. This device is an 8 bi shif regiser wih complemenary oupus from he las sage. Daa may be loaded ino he regiser eiher in parallel or in serial form. When he Serial Shif/Parallel oad inpu is low, he daa is loaded asynchronously in parallel. When he Serial Shif/Parallel oad inpu is high, he daa is loaded serially on he rising edge of eiher Clock or Clock Inhibi (see he Funcion Table). The 2 inpu NOR clock may be used eiher by combining wo independen clock sources or by designaing one of he clock inpus o ac as a clock inhibi. Feaures Oupu Drive Capabiliy: 0 STT oads Oupus Direcly Inerface o CMOS, NMOS, and TT Operaing olage Range: 2.0 o 6.0 ow Inpu Curren: A igh Noise Immuniy Characerisic of CMOS Devices In Compliance wih he Requiremens Defined by JEDEC Sandard No. 7A Chip Complexiy: 286 FETs or 7. Equivalen Gaes Pb Free Packages are Available* PDIP N SUFFI CASE 648 SOIC D SUFFI CASE 7B TSSOP DT SUFFI CASE 948F SOEIAJ F SUFFI CASE 966 MARKING DIAGRAMS MC74CAN AWYYWWG CAG AWYWW C A AYW 74CA AYWG A = Assembly ocaion, W = Wafer o Y, YY = Year W, WW = Work Week G = Pb Free Package = Pb Free Package (Noe: Microdo may be in eiher locaion) ORDERING INFORMATION See deailed ordering and shipping informaion in he package dimensions secion on page 2 of his daa shee. *For addiional informaion on our Pb Free sraegy and soldering deails, please download he ON Semiconducor Soldering and Mouning Techniques Reference Manual, SODERRM/D. Semiconducor Componens Indusries, C, 200 Publicaion Order Number: MC74CA/D

2 MC74CA SERIA SIFT/ PARAE OAD CC COCK 2 COCK INIBIT E 3 4 D F 4 3 C G 2 B 6 A Q 7 0 S A GND 8 9 Q Figure. Pin Assignmen PARAE DATA INPUTS SERIA DATA INPUT A 2 B 3 C D 4 E 3 F 4 G 6 S 0 A SERIA SIFT/ PARAE OAD COCK COCK INIBIT Q Q SERIA DATA OUTPUTS PIN = CC PIN 8 = GND Figure 2. ogic Diagram FUNCTION TABE Inpus Inernal Sages Oupu Serial Shif/ Parallel oad Clock Clock Inhibi S A A Q A Q B Q Operaion a h a b h Asynchronous Parallel oad No Change Serial Shif via Clock Serial Shif via Clock Inhibi Inhibied Clock No Change No Clock = don care = Daa shifed from he preceding sage ORDERING INFORMATION Device Package Shipping MC74CAN PDIP 00 Unis / Rail MC74CANG PDIP 00 Unis / Rail MC74CAD SOIC 48 Unis / Rail MC74CADG SOIC 48 Unis / Rail MC74CADR2 SOIC 200 Unis / Reel MC74CADR2G SOIC 200 Unis / Reel MC74CADTR2 TSSOP * 200 Unis / Reel MC74CADTR2G TSSOP * 200 Unis / Reel MC74CAF SOEIAJ 0 Unis / Rail MC74CAFG SOEIAJ 0 Unis / Rail MC74CAFE SOEIAJ 2000 Unis / Reel MC74CAFEG SOEIAJ 2000 Unis / Reel For informaion on ape and reel specificaions, including par orienaion and ape sizes, please refer o our Tape and Reel Packaging Specificaions Brochure, BRD80/D. *This package is inherenly Pb Free. 2

3 MC74CA MAIMUM RATINGS Symbol Parameer Î alue Uni CC DC Supply olage (Referenced o GND) Î 0. o in DC Inpu olage (Referenced o GND) Î 0. o CC + 0. ou DC Oupu olage (Referenced o GND) Î 0. o CC + 0. I in DC Inpu Curren, per Pin Î ± 20 ma I ou DC Oupu Curren, per Pin Î ± 2 ma I CC DC Supply Curren, CC and GND Pins Î ± 0 ma P D Power Dissipaion in Sill Air Plasic DIP Î 70 mw SOIC Package 00 TSSOP Package 40 T sg Sorage Temperaure 6 o + 0 C T ead Temperaure, mm from Case for 0 Seconds Î (Plasic DIP, SOIC or TSSOP Package) Î 260 C Maximum raings are hose values beyond which device damage can occur. Maximum raings applied o he device are individual sress limi values (no normal operaing condiions) and are no valid simulaneously. If hese limis are exceeded, device funcional operaion is no implied, damage may occur and reliabiliy may be affeced. Deraing Plasic DIP: 0 mw/ C from 6 o 2 C SOIC Package: 7 mw/ C from 6 o 2 C TSSOP Package: 6. mw/ C from 6 o 2 C For high frequency or heavy load consideraions, see Chaper 2 of he ON Semiconducor igh Speed CMOS Daa Book (D29/D). RECOMMENDED OPERATING CONDITIONS Symbol Parameer Min Max Uni CC DC Supply olage (Referenced o GND) Î in, ou DC Inpu olage, Oupu olage (Referenced o GND) 0 CC T A Operaing Temperaure, All Package Types + 2 C r, f Inpu Rise and Fall Time CC = ns Î (Figure ) CC = Î CC = CC = 6.0 DC EECTRICA CARACTERISTICS (olages Referenced o GND) Î Symbol Parameer Î Tes Condiions Guaraneed imi CC Î o 2 C 8 C 2 C Î Uni I Minimum igh evel Inpu Î ou = 0. or CC olage I ou 20 A Î 4.Î Î I Maximum ow evel Inpu olage Î ou = 0. or CC I ou 20 A 3.0Î Î 4.Î O Minimum igh evel Oupu olage Î in = I or I I ou 20 A 4.Î Î in = I or I I ou 2.4 ma I ou 4.0 ma I ou.2 ma 6.0Î This device conains proecion circuiry o guard agains damage due o high saic volages or elecric fields. owever, precauions mus be aken o avoid applicaions of any volage higher han maximum raed volages o his high impedance circui. For proper operaion, in and ou should be consrained o he range GND ( in or ou ) CC. Unused inpus mus always be ied o an appropriae logic volage level (e.g., eiher GND or CC ). Unused oupus mus be lef open. 3

4 MC74CA DC EECTRICA CARACTERISTICS (olages Referenced o GND) Guaraneed imi CC Symbol Parameer Î Tes Condiions Î o 2 C 8 C 2 C Uni O Maximum ow evel Oupu Î in = I or I 2.0Î olage I ou 20 A Î in = I or I I ou 2.4 ma I ou 4.0 ma Î I ou.2 ma Î I in Maximum Inpu eakage Curren in = CC or GND 6.0Î ± 0. ±.0 ±.0 A I CC Maximum Quiescen SupplyÎ in = CC or GND Curren (per Package) I ou = 0 A 6.0Î Î A NOTE: Informaion on ypical parameric values can be found in Chaper 2 of he ON Semiconducor igh Speed CMOS Daa Book (D29/D). AC EECTRICA CARACTERISTICS (C = 0 pf, Inpu r = f = 6 ns) Symbol Parameer Guaraneed imi CC Î o 2 C 8 C 2 C Uni f max Maximum Clock Frequency (0% Duy Cycle) 2.0Î Mz (Figures and 8) Î 4.Î Î 6.0Î P, Maximum Propagaion Delay, Clock (or Clock Inhibi) o Q or Q 2.0Î ns P (Figures and 8) Î Î P, Maximum Propagaion Delay, Serial Shif/Parallel oad o Q P or Q ns (Figures 2 and 8) Î 4.Î Î P, Maximum Propagaion Delay, Inpu o Q P or Q ns (Figures 3 and 8) Î 4.Î Î T, Maximum Oupu Transiion Time, Any Oupu ns T (Figures and 8) 3.0Î Î 4.Î Î Maximum Inpu Capaciance pf C in NOTES:. For propagaion delays wih loads oher han 0 pf, see Chaper 2 of he ON Semiconducor igh Speed CMOS Daa Book (D29/D). 2. Informaion on ypical parameric values can be found in Chaper 2 of he ON Semiconducor igh Speed CMOS Daa Book (D29/D). 2 C, CC =.0 C PD Power Dissipaion Capaciance (Per Package)* 40 pf * Used o deermine he no load dynamic power consumpion: P D = C PD 2 CC f + I CC CC. For load consideraions, see Chaper 2 of he ON Semiconducor igh Speed CMOS Daa Book (D29/D). 4

5 MC74CA TIMING REQUIREMENTS (Inpu r = f = 6 ns) SymbolÎ Parameer Guaraneed imi CC Î o 2 C 8 C 2 C Uni su Minimum Seup Time, Parallel Daa Inpus o Serial Shif/Parallel oad ns (Figure 4) Î Î su Minimum Seup Time, Inpu SA o Clock (or Clock Inhibi) ns Î (Figure ) 3.0Î Î Î su Minimum Seup Time, Serial Shif/Parallel oad o Clock (or Clock Inhibi) ns Î (Figure 6) 3.0Î Î su Minimum Seup Time, Clock o Clock Inhibi ns (Figure 7) 3.0Î Î h Î Minimum old Time, Serial Shif/Parallel oad o Parallel Daa Inpus 2.0Î ns (Figure 4) 3.0Î Î h Î Minimum old Time, Clock (or Clock Inhibi) o Inpu SA 2.0Î ns (Figure ) 3.0Î Î h Î Minimum old Time, Clock (or Clock Inhibi) o Serial Shif/Parallel oad 2.0Î ns (Figure 6) 3.0 Î Î rec Î Minimum Recovery Time, Clock o Clock Inhibi 2.0Î ns (Figure 7) Î Î 3 9 w Î Minimum Pulse Widh, Clock (or Clock Inhibi) 2.0Î ns (Figure ) Î Î 3 9 w Minimum Pulse widh, Serial Shif/Parallel oad ns (Figure 2) Î Î r, f Maximum Inpu Rise and Fall Times ns Î (Figure ) 3.0Î Î NOTE: Informaion on ypical parameric values can be found in Chaper 2 of he ON Semiconducor igh Speed CMOS Daa Book (D29/D). 6.0

6 MC74CA PACKAGE DIMENSIONS PDIP N SUFFI CASE ISSUE T A 8 9 B NOTES:. DIMENSIONING AND TOERANCING PER ANSI Y4.M, CONTROING DIMENSION: INC. 3. DIMENSION TO CENTER OF EADS WEN FORMED PARAE. 4. DIMENSION B DOES NOT INCUDE MOD FAS.. ROUNDED CORNERS OPTIONA. G F S C K T SEATING PANE D P 0.2 (0.00) M T A M J M INCES MIIMETERS DIM MIN MA MIN MA A B C D F G 0.00 BSC 2.4 BSC 0.00 BSC.27 BSC J K M S SOIC D SUFFI CASE 7B 0 ISSUE J A 9 8 B P 8 P 0.2 (0.00) M B S NOTES:. DIMENSIONING AND TOERANCING PER ANSI Y4.M, CONTROING DIMENSION: MIIMETER. 3. DIMENSIONS A AND B DO NOT INCUDE MOD PROTRUSION. 4. MAIMUM MOD PROTRUSION 0. (0.006) PER SIDE.. DIMENSION D DOES NOT INCUDE DAMBAR PROTRUSION. AOWABE DAMBAR PROTRUSION SA BE 0.27 (0.00) TOTA IN ECESS OF TE D DIMENSION AT MAIMUM MATERIA CONDITION. T SEATING PANE G K C D P 0.2 (0.00) M T B S A S M R 4 J F MIIMETERS INCES DIM MIN MA MIN MA A B C D F G.27 BSC 0.00 BSC J K M P R

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