MC74HC32A. Quad 2-Input OR Gate. High Performance Silicon Gate CMOS

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1 MC74C32 Quad 2-Input OR Gate igh Performance Silicon Gate CMOS The MC74C32 is identical in pinout to the S32. The device inputs are compatible with Standard CMOS outputs; with pullup resistors, they are compatible with STT outputs. Features Output Drive Capability: 0 STT oads Outputs Directly Interface to CMOS, NMOS and TT Operating oltage Range: to ow Input Current: igh Noise Immunity Characteristic of CMOS Devices In Compliance With the JEDEC Standard No. 7 Requirements Chip Complexity: 48 FETs or 2 Equivalent Gates N Prefix for utomotive and Other pplications Requiring Unique Site and Control Change Requirements; EC Q00 Qualified and PPP Capable These Devices are Pb Free, alogen Free/FR Free and are RoS Compliant OGIC DIGRM 3 Y 6 Y2 8 Y3 Y = + 4 SOIC 4 N D SUFFIX CSE 75 MRKING DIGRMS C32G WYWW SOIC 4 N PIN SSIGNMENT TSSOP 4 DT SUFFIX CSE 948G CC 4 4 Y4 3 3 Y Y 2 2 Y2 GND 4 ead (Top iew) 4 C 32 YW TSSOP PIN 4 = CC PIN 7 = GND Y4 = ssembly ocation, W = Wafer ot Y, YY = Year W, WW = Work Week G or = Pb Free Package (Note: Microdot may be in either location) FUNCTION TE Inputs Output Y ORDERING INFORMTION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. Semiconductor Components Industries, C, 204 ugust, 204 Rev. 2 Publication Order Number: MC74C32/D

2 MC74C32 MXIMUM RTINGS Symbol Parameter alue Unit CC DC Supply oltage (Referenced to GND) 0.5 to +7.0 in DC Input oltage (Referenced to GND) 0.5 to CC out DC Output oltage (Referenced to GND) 0.5 to CC I in DC Input Current, per Pin ±20 m I out DC Output Current, per Pin ±25 m I CC DC Supply Current, CC and GND Pins ±50 m P D Power Dissipation in Still ir, SOIC Package TSSOP Package T stg Storage Temperature 65 to +50 C T ead Temperature, mm from Case for 0 Seconds Plastic DIP, SOIC or TSSOP Package 260 mw C This device contains protection circuitry to guard against damage due to high static voltages or electric fields. owever, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high impedance circuit. For proper operation, in and out should be constrained to the range GND ( in or out ) CC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or CC ). Unused outputs must be left open. Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. Derating: SOIC Package: 7 mw/ C from 65 to 25 C TSSOP Package: 6. mw/ C from 65 to 25 C RECOMMENDED OPERTING CONDITIONS Symbol Parameter Min Max Unit CC DC Supply oltage (Referenced to GND) in, out DC Input oltage, Output oltage (Referenced to GND) 0 CC T Operating Temperature, ll Package Types C t r, t f Input Rise and Fall Time CC = (Figure ) CC = CC = Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability ns 2

3 MC74C32 DC CRCTERISTICS (oltages Referenced to GND) Guaranteed imit CC Symbol Parameter Condition 55 to 25 C 85 C 25 C Unit I Minimum igh evel Input oltage out = or CC I out 20 I Maximum ow evel Input oltage out = or CC I out 20 O O Minimum igh evel Output oltage Maximum ow evel Output oltage in = I or I I out 20 in = I or I in = I or I I out 20 in = I or I I out 2.4m I out 4.0m I out 5.2m I out 2.4m I out 4.0m I out 5.2m I in Maximum Input eakage Current in = CC or GND ± ±.0 ±.0 I CC Maximum Quiescent Supply Current (per Package) in = CC or GND I out = C CRCTERISTICS (C = 50pF, Input t r = t f = 6ns) Guaranteed imit CC Symbol Parameter 55 to 25 C 85 C 25 C Unit t P, t P t T, t T Maximum Propagation Delay, Input or to Output Y (Figures and 2) Maximum Output Transition Time, ny Output (Figures and 2) C in Maximum Input Capacitance pf C, CC = 5.0, EE = 0 ns ns C PD Power Dissipation Capacitance (Per uffer)* * Used to determine the no load dynamic power consumption: P D = C PD CC 2 f + I CC CC. 20 pf 3

4 MC74C32 t r t f INPUT OR 90% 50% 0% CC GND t P t P OUTPUT Y 90% 50% 0% t T t T Figure. Switching Waveforms TEST POINT DEICE UNDER TEST OUTPUT C * *Includes all probe and jig capacitance Figure 2. Test Circuit Y Figure 3. Expanded ogic Diagram (/4 of the Device) 4

5 MC74C32 ORDERING INFORMTION MC74C32DG Device Package Shipping SOIC 4 N 55 Units / Rail MC74C32DR2G MC74C32DTR2G N74C32DG* N74C32DR2G* SOIC 4 N TSSOP 4 SOIC 4 N SOIC 4 N 55 Units / Rail N74C32DTR2G* TSSOP 4 For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications rochure, RD80/D. *N Prefix for utomotive and Other pplications Requiring Unique Site and Control Change Requirements; EC Q00 Qualified and PPP Capable 5

6 MC74C32 PCKGE DIMENSIONS TSSOP 4 CSE 948G ISSUE 5 (0.006) T 5 (0.006) T 0 (0.004) T SETING PNE U U S 2X /2 PIN IDENT. S D C 4 4X K REF 0 (0.004) M T U S S N (0.00) M U 7 G N J J F DETI E K K ÇÇÇ ÉÉÉ SECTION N N DETI E W NOTES:. DIMENSIONING ND TOERNCING PER NSI YM, CONTROING DIMENSION: MIIMETER. 3. DIMENSION DOES NOT INCUDE MOD FS, PROTRUSIONS OR GTE URRS. MOD FS OR GTE URRS S NOT EXCEED 5 (0.006) PER SIDE. 4. DIMENSION DOES NOT INCUDE INTERED FS OR PROTRUSION. INTERED FS OR PROTRUSION S NOT EXCEED 0.25 (0.00) PER SIDE. 5. DIMENSION K DOES NOT INCUDE DMR PROTRUSION. OWE DMR PROTRUSION S E 0.08 (0.003) TOT IN EXCESS OF TE K DIMENSION T MXIMUM MTERI CONDITION. 6. TERMIN NUMERS RE SOWN FOR REFERENCE ONY. 7. DIMENSION ND RE TO E DETERMINED T DTUM PNE W. MIIMETERS INCES DIM MIN MX MIN MX C D F G 0.65 SC SC J J K K SC SC M SODERING FOOTPRINT* PITC 4X X.26 DIMENSIONS: MIIMETERS *For additional information on our Pb Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SODERRM/D. 6

7 MC74C32 PCKGE DIMENSIONS SOIC 4 N CSE ISSUE K M M e D 7 3X b E 0.25 M C S S C SETING PNE DETI h X 45 M 3 DETI NOTES:. DIMENSIONING ND TOERNCING PER SME YM, CONTROING DIMENSION: MIIMETERS. 3. DIMENSION b DOES NOT INCUDE DMR PROTRUSION. OWE PROTRUSION S E 3 TOT IN EXCESS OF T MXIMUM MTERI CONDITION. 4. DIMENSIONS D ND E DO NOT INCUDE MOD PROTRUSIONS. 5. MXIMUM MOD PROTRUSION 5 PER SIDE. MIIMETERS INCES DIM MIN MX MIN MX b D E e.27 SC SC h M SODERING FOOTPRINT* X.8.27 PITC 4X 0.58 DIMENSIONS: MIIMETERS *For additional information on our Pb Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SODERRM/D. ON Semiconductor and the are registered trademarks of Semiconductor Components Industries, C (SCIC) or its subsidiaries in the United States and/or other countries. SCIC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. listing of SCIC s product/patent coverage may be accessed at Marking.pdf. SCIC reserves the right to make changes without further notice to any products herein. SCIC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCIC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Typical parameters which may be provided in SCIC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. ll operating parameters, including Typicals must be validated for each customer application by customer s technical experts. SCIC does not convey any license under its patent rights nor the rights of others. SCIC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCIC product could create a situation where personal injury or death may occur. Should uyer purchase or use SCIC products for any such unintended or unauthorized application, uyer shall indemnify and hold SCIC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCIC was negligent regarding the design or manufacture of the part. SCIC is an Equal Opportunity/ffirmative ction Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUICTION ORDERING INFORMTION ITERTURE FUFIMENT: iterature Distribution Center for ON Semiconductor P.O. ox 563, Denver, Colorado 8027 US Phone: or Toll Free US/Canada Fax: or Toll Free US/Canada orderlit@onsemi.com N. merican Technical Support: Toll Free US/Canada Europe, Middle East and frica Technical Support: Phone: Japan Customer Focus Center Phone: ON Semiconductor Website: Order iterature: For additional information, please contact your local Sales Representative MC74C32/D

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