NL27WZ00. Dual 2-Input NAND Gate. The NL27WZ00 is a high performance dual 2 input NAND Gate operating from a 1.65 V to 5.5 V supply.
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1 Dual 2-Input NAND Gate The N27WZ00 is a high performance dual 2 input NAND Gate operating from a.65 to 5.5 supply. Features Extremely igh Speed: t PD ns (typical) at = 5.0 Designed for.65 to 5.5 Operation Over oltage Tolerant Inputs TT Compatible Interface Capability With 5.0 TT ogic with = CMOS Compatible 24 ma Balanced Output Sink and Source Capability Near Zero Static Supply Current Substantially Reduces System Power Requirements Replacement for NC7WZ00 Chip Complexity: FET = 2 N Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC Q00 Qualified and PPAP Capable These Devices are Pb Free and are RoS Compliant US US SUFFIX CASE 493 M MARKING DIAGRAM M = Specific Device Code = Date Code* = Pb Free Package (Note: Microdot may be in either location) *Date Code orientation may vary depending upon manufacturing location. PIN ASSIGNMENT Pin Function A A 2 B 3 Y2 B 2 7 Y 4 5 GND A2 Y2 3 6 B2 6 7 B2 Y GND 4 5 A2 FUNCTION TABE Y = AB Figure. Pinout A Inputs B Output Y A B A2 B2 IEEE/IEC & Figure 2. ogic Symbol Y Y2 = IG ogic evel = OW ogic evel ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. Semiconductor Components Industries, C, 203 July, 203 Rev. 2 Publication Order Number: N27WZ00/D
2 MAXIMUM RATINGS Parameter Symbol alue Units DC Supply oltage 0.5 to +7.0 DC Input oltage I 0.5 to +7.0 DC Output oltage O 0.5 to +7.0 DC Input Diode Current I < GND I IK 50 ma DC Output Diode Current O < GND I OK 50 ma DC Output Sink Current I O ±50 ma DC Supply Current per Supply Pin I CC ±00 ma DC Ground Current per Ground Pin I GND ±00 ma Storage Temperature Range T STG 65 to +50 C ead Temperature, mm from Case for 0 Seconds T 260 C Junction Temperature under Bias T J +50 C Thermal Resistance (Note ) JA 250 C/W Power Dissipation in Still Air at 5 C P D 250 mw Moisture Sensitivity MS evel Flammability Rating Oxygen Index: 2 to 34 F R U in ESD Withstand oltage uman Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) atchup Performance Above and Below GND at 5 C (Note 5) ESD > 2000 > 200 N/A I atchup ±500 Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.. Measured with minimum pad spacing on an FR4 board, using 0 mm by inch, 2 ounce copper trace with no air flow. 2. Tested to EIA/JESD22 A4 A. 3. Tested to EIA/JESD22 A5 A. 4. Tested to JESD22 C0 A. 5. Tested to EIA/JESD7. ma RECOMMENDED OPERATING CONDITIONS Supply oltage Operating Data Retention Only Parameter Symbol Min Max Units Input oltage (Note 6) I Output oltage (IG or OW State) O Operating Free Air Temperature T A C Input Transition Rise or Fall Rate = 2.5 ±0.2 = ±0.3 = 5.0 ±0.5 t/ ns/ 6. Unused inputs may not be left open. All inputs must be tied to a high or low logic input voltage level. 2
3 DC EECTRICA CARACTERISTICS Parameter Condition Symbol igh evel Input oltage () I.65 to 5.5 T A = 25 C 55 C T A 25 C Min Typ Max Min Max Units ow evel Input oltage I.65 to igh evel Output oltage IN = I or I ow evel Output oltage IN = I or O Input eakage Current Quiescent Supply Current I O = 00 A I O = 4 ma I O = ma I O = 2 ma I O = 6 ma I O = 24 ma I O = 32 ma I O = 00 A I O = 4 ma I O = ma I O = 2 ma I O = 6 ma I O = 24 ma I O = 32 ma O.65 to O.65 to IN = 5.5 or GND I IN 0 to 5.5 ±0. ±.0 A IN = 5.5 or GND I CC A Power Off eakage Current IN = 5.5 or OUT = 5.5 I OFF A AC EECTRICA CARACTERISTICS t R = t F = ns Parameter Condition Symbol Propagation Delay (Figure 3 and 4) R = M C = 5 pf R = M C = 5 pf R = 500 C = 50 pf () T A = 25 C 55 C T A 25 C Min Typ Max Min Max Units t P. ± ns t P 2.5 ± ± R = M C = 5 pf R = 500 C = 50 pf 5.0 ± CAPACITIE CARACTERISTICS Parameter Condition Symbol Typical Units Input Capacitance = 5.5, I = 0 or C IN 2.5 pf Power Dissipation Capacitance (Note 7) 0 Mz, = 3.3, I = 0 or C PD 9 0 Mz, = 5.5, I = 0 or 7. C PD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: I CC(OPR) = C PD f in + I CC. C PD is used to determine the no load dynamic power consumption; P D = C PD 2 f in + I CC. pf 3
4 t f = 3 ns t f = 3 ns INPUT A and B 90% 0% 90% 0% GND INPUT R C * OUTPUT t P t P OUTPUT Y O *C includes all probe and jig capacitances. A Mz square input wave is recommended for propagation delay tests. O Figure 3. Switching Waveform Figure 4. Test Circuit CAITY TAPE TOP TAPE TAPE TRAIER (Connected to Reel ub) NO COMPONENTS 60 mm MIN COMPONENTS DIRECTION OF FEED TAPE EADER NO COMPONENTS 400 mm MIN Figure 5. Tape Ends for Finished Goods TAPE DIMENSIONS mm TYP ± 0.25 TYP DIRECTION OF FEED Figure 6. US Reel Configuration/Orientation 4
5 t MAX.5 mm MIN (0.06 in) mm 0.2 mm (0.52 in 0.00 in) A 20.2 mm MIN (0.795 in) 50 mm MIN (.969 in) FU RADIUS G Figure 7. Reel Dimensions REE DIMENSIONS Tape Size T and R Suffix A Max G t Max mm US 7 mm (7 in).4 mm, +.5 mm, 0.0 (0.33 in in, 0.00) 4.4 mm (0.56 in) DIRECTION OF FEED BARCODE ABE POCKET OE ORDERING INFORMATION Figure. Reel Winding Direction Device Package Shipping N27WZ00USG US (Pb Free) 3000 / Tape & Reel N27WZ00USG* US (Pb Free) 3000 / Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD0/D. *N Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC Q00 Qualified and PPAP Capable. 5
6 PACKAGE DIMENSIONS X A 5 Y B 4 G P C T K SEATING D PANE 0.0 (0.004) M T X Y R 0.0 (0.004) J T S U DETAI E US CASE ISSUE B DETAI E N F R 0.0 TYP M NOTES:. DIMENSIONING AND TOERANCING PER ANSI Y4.5M, CONTROING DIMENSION: MIIMETERS. 3. DIMENSION A DOES NOT INCUDE MOD FAS, PROTRUSION OR GATE BURR. MOD FAS. PROTRUSION AND GATE BURR SA NOT EXCEED 0 MM ( ) PER SIDE. 4. DIMENSION B DOES NOT INCUDE INTER EAD FAS OR PROTRUSION. INTER EAD FAS AND PROTRUSION SA NOT E3XCEED 0 ( ) PER SIDE. 5. EAD FINIS IS SODER PATING WIT TICKNESS OF MM. ( ). 6. A TOERANCE UNESS OTERWISE SPECIFIED ±0.050 ( ). MIIMETERS INCES DIM MIN MAX MIN MAX A B C D F G 0.50 BSC BSC 0 REF 0.06 REF J K M N P R S U BSC BSC SODERING FOOTPRINT* SCAE : *For additional information on our Pb Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SODERRM/D. mm inches ON Semiconductor and are registered trademarks of Semiconductor Components Industries, C (SCIC). SCIC reserves the right to make changes without further notice to any products herein. SCIC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCIC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Typical parameters which may be provided in SCIC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customer s technical experts. SCIC does not convey any license under its patent rights nor the rights of others. SCIC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCIC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCIC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCIC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCIC was negligent regarding the design or manufacture of the part. SCIC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBICATION ORDERING INFORMATION ITERATURE FUFIMENT: iterature Distribution Center for ON Semiconductor P.O. Box 563, Denver, Colorado 027 USA Phone: or Toll Free USA/Canada Fax: or Toll Free USA/Canada orderlit@onsemi.com N. American Technical Support: Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: Japan Customer Focus Center Phone: ON Semiconductor Website: Order iterature: For additional information, please contact your local Sales Representative N27WZ00/D
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