MC74AC00, MC74ACT00. Quad 2 Input NAND Gate. High Performance Silicon Gate CMOS
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1 Quad 2Input NAND Gate ighperformance SiliconGate CMOS Features Output Drive Capability: 24 ma Operating oltage Range: 2 to 6 AC00; to ACT00 ow Input Current:.0 A igh Noise Immunity Characteristic of CMOS Devices In Compliance With the JEDEC Standard No. 7A Requirements Chip Complexity: 32 FETs PbFree Packages are Available A B A2 B2 A3 B3 A4 B Y 6 Y2 8 Y3 Y4 Y = AB PDIP4 N SUFFIX CASE 646 SOIC4 D SUFFIX CASE 75A TSSOP4 DT SUFFIX CASE 948G 4 4 MARKING DIAGRAMS MC74xxx00N AWYYWWG 4 4 xxx00 AWYWWG xxx 00 AYW PIN 4 = CC PIN 7 = GND Figure. ogic Diagram CC B4 A4 Y4 B3 A3 Y SOEIAJ4 M SUFFIX CASE 965 xxx = AC or ACT A = Assembly ocation W or = Wafer ot YY or Y = Year WW or W = Work Week G = PbFree Package 74xxx00 AYWG A B Y A2 B2 Y2 GND Figure 2. Pinout: 4ead Packages (Top iew) FUNCTION TABE Inputs Output A B Y ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet. Semiconductor Components Industries, C, 2006 Publication Order Number: MC74AC00/D
2 MAXIMUM RATINGS Symbol Parameter alue Unit CC DC Supply oltage 0.5 to 7.0 I DC Input oltage 0.5 I CC 0.5 O DC Output oltage (Note ) 0.5 O CC 0.5 I IK DC Input Diode Current 20 ma I OK DC Output Diode Current 50 ma I O DC Output Sink/Source Current 50 ma I CC DC Supply Current per Output Pin 50 ma I GND DC Ground Current per Output Pin 50 ma T STG Storage Temperature Range 65 to 50 C T ead temperature, mm from Case for 0 Seconds 260 C T J Junction temperature under Bias 50 C JA Thermal resistance PDIP SOIC TSSOP P D Power Dissipation in Still Air at 85 C PDIP SOIC TSSOP MS Moisture Sensitivity evel F R Flammability Rating Oxygen Index: 30% 35% U in ESD ESD Withstand oltage uman Body Model (Note 2) Machine Model (Note 3) Charged Device Model (Note 4) > 2000 > 200 > 000 I atchup atchup Performance Above CC and Below GND at 85 C (Note 5) 00 ma Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.. I O absolute maximum rating must be observed. 2. Tested to EIA/JESD22A4A. 3. Tested to EIA/JESD22A5A. 4. Tested to JESD22C0A. 5. Tested to EIA/JESD78. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Typ Max Unit CC Supply oltage MC74AC00 in, out DC Input oltage, Output oltage (Ref. to GND) 0 CC C/W mw t r, t f Input Rise and Fall Time (Note 6) 3.0 MC74AC ns/ t r, t f Input Rise and Fall Time (Note 7) ns/ T J Junction Temperature 50 C T A Operating Ambient Temperature Range C I O Output Current igh 24 ma I O Output Current ow 24 ma 6. in from 30% to 70% CC. 7. in from to. 2
3 DC CARACTERISTICS Symbol Parameter CC () T A = +25 C T A = 40 C to +85 C T A = 55 C to + 25 C Typ Guaranteed imits Unit Conditions I Minimum igh evel Input oltage.5.5 OUT = 0. or CC 0. I Maximum ow evel Input oltage.5.5 OUT = 0. or CC 0. O Minimum igh evel Output oltage I OUT = 50 A * IN = I or I I O 24 ma 24 ma O Maximum ow evel Output oltage I OUT = 50 A I IN Maximum Input eakage Current * IN = I or I I O 24 ma 24 ma A I = CC, GND I CCT Additional Max. I CC /Input ma I = CC 2. I OD Minimum Dynamic ma OD =.65 Max I OD Output Current ma OD = 3.85 Min I CC Maximum Quiescent Supply Current *All outputs loaded; thresholds on input associated with output under test. Maximum test duration ms, one output loaded at a time A IN = CC or GND AC CARACTERISTICS (t r = t f = 3.0 ns; C = 50 pf; see Figures 3 and 4 for Waveforms) Symbol Parameter CC * () T A = +25 C T A = 40 C to +85 C T A = 55 C to +25 C Min Typ Max Min Max Min Max t P Propagation Delay ns t P Propagation Delay ns *oltage Range 5.0 is Unit CAPACITANCE Symbol Parameter alue Typ Test Conditions Unit C IN Input Capacitance CC = 5.0 pf C PD Power Dissipation Capacitance 30 CC = 5.0 pf 4
4 ORDER INFORMATION MC74AC00D MC74AC00DG Device Package Shipping SOIC4 SOIC4 (PbFree) 55 Units / Rail MC74AC00N MC74AC00NG MC74AC00DR2 MC74AC00DR2G MC74AC00DTR2 MC74AC00DTR2G MC74AC00ME MC74AC00MEG N NG D DG PDIP4 PDIP4 (PbFree) SOIC4 SOIC4 (PbFree) TSSOP4* TSSOP4* SOEIAJ4 SOEIAJ4 (PbFree) PDIP4 PDIP4 (PbFree) SOIC4 SOIC4 (PbFree) 25 Units / Rail 2500 / Tape and Reel 2000 / Tape and Reel 25 Units / Rail 55 Units / Rail DR2 DR2G DTR2 DTR2G ME MEG SOIC4 SOIC4 (PbFree) TSSOP4* TSSOP4* SOEIAJ4 SOEIAJ4 (PbFree) 2500 / Tape and Reel 2000 / Tape and Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD80/D. *This package is inherently PbFree. 6
5 PACKAGE DIMENSIONS SOIC4 CASE 75A03 ISSUE T SEATING PANE A 4 8 G 7 B P 7 P 0.25 (0.00) M B M NOTES:. DIMENSIONING AND TOERANCING PER ANSI YM, CONTROING DIMENSION: MIIMETER. 3. DIMENSIONS A AND B DO NOT INCUDE MOD PROTRUSION. 4. MAXIMUM MOD PROTRUSION 0.5 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCUDE DAMBAR PROTRUSION. AOWABE DAMBAR PROTRUSION SA BE 0.27 (0.005) TOTA IN EXCESS OF TE D DIMENSION AT MAXIMUM MATERIA CONDITION. MIIMETERS INCES C R X 45 F DIM MIN MAX MIN MAX A B C D D 4 P K M J F G.27 BSC BSC 0.25 (0.00) M T B S A S J K M P R SODERING FOOTPRINT* 4X X X PITC DIMENSIONS: MIIMETERS *For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SODERRM/D. 7
6 PDIP4 CASE ISSUE P B NOTES:. DIMENSIONING AND TOERANCING PER ANSI YM, CONTROING DIMENSION: INC. 3. DIMENSION TO CENTER OF EADS WEN FORMED PARAE. 4. DIMENSION B DOES NOT INCUDE MOD FAS. 5. ROUNDED CORNERS OPTIONA. N T SEATING PANE A INCES MIIMETERS DIM MIN MAX MIN MAX A B F C D C F G 0.00 BSC 2.54 BSC J K K J M 0 0 G D 4 P M N (0.005) M 8
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