MC10EP131, MC100EP V / 5VНECL Quad D Flip Flop with Set, Reset, and Differential Clock
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1 3.3V / 5VНECL Quad D Flip Flop with Set, Reset, and Differential Clock Description The MC10/100EP131 is a Quad Master slaved D flip flop with common set and separate resets. The device is an expansion of the E131 with differential common clock and individual clock enables. With AC performance faster than the E131 device, the EP131 is ideal for applications requiring the fastest AC performance available. Each flip flop may be clocked separately by holding Common Clock (C C ) LOW and C C HIGH, then using the differential Clock Enable inputs for clocking (C 0 3, C 0 3 ). Common clocking is achieved by holding the differential inputs C 0 3 LOW and C 0 3 HIGH while using the differential Common Clock (C C ) to clock all four flip flops. When left floating open, any differential input will disable operation due to input pulldown resistors forcing an output default state. Individual asynchronous resets (R 0 3 ) and an asynchronous set (SET) are provided. Data enters the master when both C C and C 0 3 are LOW, and transfers to the slave when either C C or C 0 3 (or both) go HIGH. The 100 Series contains temperature compensation. Features 460 ps Typical Propagation Delay Maximum Frequency > 3 GHz Typical Differential Individual and Common Clocks Individual Asynchronous Resets Asynchronous Set PECL Mode Operating Range: V CC = 3.0 V to 5.5 V with V EE = 0 V NECL Mode Operating Range: V CC = 0 V with V EE = 3.0 V to 5.5 V Open Input Default State Safety Clamp on Inputs Q Output Will Default LOW with Inputs Open or at V EE Pb Free Packages are Available FA SUFFIX CASE 873A 1 32 QFN32 MN SUFFIX CASE 488AM MARKING DIAGRAM* MCxxx EP131 AWLYYWWG MCxxx EP131 AWLYYWW xxx = 10 or 100 A = Assembly Location WL, L = Wafer Lot YY, Y = Year WW, W = Work Week G or = Pb Free Package (Note: Microdot may be in either location) *For additional marking information, refer to Application Note AND8002/D. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 9 of this data sheet. 1 Semiconductor Components Industries, LLC, Publication Order Number: MC10EP131/D
2 Table 3. ATTRIBUTES Internal Input Pulldown Resistor Internal Input Pullup Resistor ESD Protection Characteristics Human Body Model Machine Model Charged Device Model Value 75 k N/A > 2 kv > 100 V > 2 kv Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1) Pb Pkg Pb Free Pkg Level 2 Level 2 Level 1 Flammability Rating Oxygen Index: 28 to 34 UL 94 V in Transistor Count Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test 1. For additional information, see Application Note AND8003/D. 935 Devices Table 4. MAXIMUM RATINGS Symbol Parameter Condition 1 Condition 2 Rating Unit V CC PECL Mode Power Supply V EE = 0 V 6 V V EE NECL Mode Power Supply V CC = 0 V 6 V V I PECL Mode Input Voltage NECL Mode Input Voltage V EE = 0 V V CC = 0 V I out Output Current Continuous Surge V I V CC 6 V I V EE 6 I BB V BB Sink/Source ± 0.5 ma T A Operating Temperature Range 40 to +85 C T stg Storage Temperature Range 65 to +150 C JA Thermal Resistance (Junction to Ambient) 0 lfpm 500 lfpm 32 LQFP 32 LQFP JC Thermal Resistance (Junction to Case) Standard Board 32 LQFP 12 to 17 JA Thermal Resistance (Junction to Ambient) 0 lfpm 500 lfpm JC Thermal Resistance (Junction to Case) 2S2P 12 T sol Wave Solder Pb Pb Free Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability V V ma ma C 3
3 Table 7. 10EP DC CHARACTERISTICS, NECL V CC = 0 V, V EE = 5.5 V to 3.0 V (Note 8) I EE Power Supply Current ma V OH Output HIGH Voltage (Note 9) mv V OL Output LOW Voltage (Note 9) mv V IH Input HIGH Voltage (Single Ended) mv V IL Input LOW Voltage (Single Ended) mv (Note 10) V EE V EE V EE V 8. Input and output parameters vary 1:1 with V CC. 9. All loading with 50 to V CC 2.0 V. 10. min varies 1:1 with V EE, max varies 1:1 with V CC. The range is referenced to the most positive side of the differential Table EP DC CHARACTERISTICS, PECL V CC = 3.3 V, V EE = 0 V (Note 11) I EE Power Supply Current ma V OH Output HIGH Voltage (Note 12) mv V OL Output LOW Voltage (Note 12) mv V IH Input HIGH Voltage (Single Ended) mv V IL Input LOW Voltage (Single Ended) mv (Note 13) V 11. Input and output parameters vary 1:1 with V CC. V EE can vary +0.3 V to 2.2 V. 12.All loading with 50 to V CC 2.0 V. 13. min varies 1:1 with V EE, max varies 1:1 with V CC. The range is referenced to the most positive side of the differential 5
4 Table EP DC CHARACTERISTICS, PECL V CC = 5.0 V, V EE = 0 V (Note 14) I EE Power Supply Current ma V OH Output HIGH Voltage (Note 15) mv V OL Output LOW Voltage (Note 15) mv V IH Input HIGH Voltage (Single Ended) mv V IL Input LOW Voltage (Single Ended) mv (Note 16) V 14.Input and output parameters vary 1:1 with V CC. V EE can vary +2.0 V to 0.5 V. 15.All loading with 50 to V CC 2.0 V. 16. min varies 1:1 with V EE, max varies 1:1 with V CC. The range is referenced to the most positive side of the differential Table EP DC CHARACTERISTICS, NECL V CC = 0 V, V EE = 5.5 V to 3.0 V (Note 17) I EE Power Supply Current ma V OH Output HIGH Voltage (Note 18) mv V OL Output LOW Voltage (Note 18) mv V IH Input HIGH Voltage (Single Ended) mv V IL Input LOW Voltage (Single Ended) mv (Note 19) V EE V EE V EE V 17.Input and output parameters vary 1:1 with V CC. 18.All loading with 50 to V CC 2.0 V. 19. min varies 1:1 with V EE, max varies 1:1 with V CC. The range is referenced to the most positive side of the differential 6
5 Table 11. AC CHARACTERISTICS V CC = 0 V; V EE = 3.0 V to 5.5 V or V CC = 3.0 V to 5.5 V; V EE = 0 V (Note 20) f max Maximum Frequency (See Figure 4. Frequency vs. V OUTpp and JITTER) t PLH, Propagation Delay to C 0 3 t PHL Output Differential C C R 0 3 SET > 3 > 3 > 3 GHz t RR Set/R0 3 Recovery ps t S t H Setup Time Hold Time ps t PW Minimum Pulse Rate SET, R ps t JITTER Cycle to Cycle Jitter (See Figure 4. Frequency vs. V OUTpp and JITTER) t r Output Rise/Fall Times Q, Q t f (20% 80%) 0.2 < < < 1 ps ps 20.Measured using a 750 mv source, 50% duty cycle clock source. All loading with 50 to V CC 2.0 V. 7
6 ORDERING INFORMATION Device Package Shipping MC10EP131FA 250 Units / Tray MC10EP131FAG 250 Units / Tray MC10EP131FAR / Tape & Reel MC10EP131FAR2G 2000 / Tape & Reel MC100EP131FA 250 Units / Tray MC100EP131FAG 250 Units / Tray MC100EP131FAR / Tape & Reel MC100EP131FAR2G 2000 / Tape & Reel MC10EP131MNG MC10EP131MNR4G MC100EP131MNG MC100EP131MNR4G 74 Units / Tray 1000 / Tape & Reel 74 Units / Tray 1000 / Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Resource Reference of Application Notes AN1405/D ECL Clock Distribution Techniques AN1406/D Designing with PECL (ECL at +5.0 V) AN1503/D ECLinPS I/O SPiCE Modeling Kit AN1504/D Metastability and the ECLinPS Family AN1568/D Interfacing Between LVDS and ECL AN1672/D The ECL Translator Guide AND8001/D Odd Number Counters Design AND8002/D Marking and Date Codes AND8020/D Termination of ECL Logic Devices AND8066/D Interfacing with ECLinPS AND8090/D AC Characteristics of ECL Devices 9
7 PACKAGE DIMENSIONS A1 32 A 25 4X 32 LEAD LQFP CASE 873A 02 ISSUE C 0.20 (0.008) AB T U Z T, U, Z T 1 U P AE B 9 SEATING PLANE B1 AB AC 8 9 S1 DETAIL Y Z S G 0.10 (0.004) AC 17 4X V1 V 0.20 (0.008) AC T U Z DETAIL AD C E 8X M DETAIL Y AE R BASE METAL N FÉÉ ÉÉ J D 0.20 (0.008) M AC T U Z SECTION AE AE H W DETAIL AD X K Q GAUGE PLANE (0.010) NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, CONTROLLING DIMENSION: MILLIMETER. 3. DATUM PLANE AB IS LOCATED AT BOTTOM OF LEAD AND IS COINCIDENT WITH THE LEAD WHERE THE LEAD EXITS THE PLASTIC BODY AT THE BOTTOM OF THE PARTING LINE. 4. DATUMS T, U, AND Z TO BE DETERMINED AT DATUM PLANE AB. 5. DIMENSIONS S AND V TO BE DETERMINED AT SEATING PLANE AC. 6. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS (0.010) PER SIDE. DIMENSIONS A AND B DO INCLUDE MOLD MISMATCH AND ARE DETERMINED AT DATUM PLANE AB. 7. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. DAMBAR PROTRUSION SHALL NOT CAUSE THE D DIMENSION TO EXCEED (0.020). 8. MINIMUM SOLDER PLATE THICKNESS SHALL BE (0.0003). 9. EXACT SHAPE OF EACH CORNER MAY VARY FROM DEPICTION. MILLIMETERS INCHES DIM MIN MAX MIN MAX A BSC BSC A BSC BSC B BSC BSC B BSC BSC C D E F G BSC BSC H J K M 12 REF 12 REF N P BSC BSC Q R S BSC BSC S BSC BSC V BSC BSC V BSC BSC W REF REF X REF REF 10
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