NL17SZ126. Non-Inverting 3-State Buffer. The NL17SZ126 is a single non inverting buffer in tiny footprint packages.

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Non-Inverting 3-State Buffer The N7SZ6 is a single noninverting buffer in tiny footprint packages. Features Designed for.6 to. Operation.7 ns t PD at = (typ) Inputs/Outputs Overvoltage Tolerant up to.

1 Non-Inverting 3-State Buffer The N7SZ6 is a single noninverting buffer in tiny footprint packages. Features Designed for.6 to. Operation.7 ns t PD at = (typ) Inputs/Outputs Overvoltage Tolerant up to. I OFF Supports Partial Power Down Protection Source/Sink m at 3. vailable in SC88, SC7, SOT3, SOT93 and UDFN6 Packages Chip Complexity < FETs N Prefix for utomotive and Other pplications Requiring Unique Site and Control Change Requirements; ECQ Qualified and PPP Capable These Devices are PbFree, Halogen Free/BFR Free and are RoHS Compliant SC88 DF SUFFIX CSE 9 SC7 DB SUFFIX CSE 38BQ MRKING DIGRMS XX M XXX M IN OUT SOT3 X SUFFIX CSE 63B XX M Figure. ogic Symbol SOT93 P SUFFIX CSE 7E X M UDFN6. x. CSE 7Q XM UDFN6. x. CSE 7BX X M XX = Specific Device Code M = Date Code* = PbFree Package (Note: Microdot may be in either location) *Date Code orientation and/or position may vary depending upon manufacturing location. ORDERING INFORMTION See detailed ordering, marking and shipping information in the package dimensions section on page 7 of this data sheet. Semiconductor Components Industries, C, November, 8 Rev. Publication Order Number: N7SZ6/D

2 6 NC (SC88/SOT3/SC7) SOT93 Figure. Pinout (Top iew) UDFN6 PIN SSIGNMENT (SC88/SOT3/SC7) PIN SSIGNMENT (SOT93) PIN SSIGNMENT (UDFN) Pin Function Pin Function Pin Function NC 6 FUNCTION TBE Input H H X = Don t Care H X Output H Z

3 MXIMUM RTINGS Symbol Characteristics alue Unit DC Supply oltage UDFN6, SOT3, SC88 (N) SC7, SC88, SOT93 IN DC Input oltage UDFN6, SOT3, SC88 (N) SC7, SC88, SOT93 OUT DC Output oltage ctivemode (High or ow State) SC88 (N), TriState Mode (Note ) UDFN6, SOT3 PowerDown Mode ( = ) DC Output oltage ctivemode (High or ow State) SC7, SC88, SOT93 TriState Mode (Note ) PowerDown Mode ( = ). to +7.. to +6.. to +7.. to +6.. to +.. to +7.. to +7.. to +.. to +6.. to +6. I IK DC Input Diode Current IN < m I OK DC Output Diode Current OUT < ± m I OUT DC Output Source/Sink Current ± m I CC or I DC Supply Current per Supply Pin or Ground Pin ± m T STG Storage Temperature Range 6 to + C T ead Temperature, mm from Case for secs 6 C T J Junction Temperature Under Bias + C J Thermal Resistance (Note ) SC88 SC7 SOT3 SOT93 UDFN6 P D Power Dissipation in Still ir SC88 SC7 SOT3 SOT93 UDFN6 MS Moisture Sensitivity evel F R Flammability Rating Oxygen Index: 8 to 3 U in ESD ESD Withstand oltage (Note 3) Human Body Model Charged Device Model I atchup atchup Performance (Note ) m Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.. pplicable to devices with outputs that may be tristated.. Measured with minimum pad spacing on an FR board, using mmbyinch, ounce copper trace no air flow. 3. HBM tested to NSI/ESD/JEDEC JS7. CDM tested to EI/JESDCF. JEDEC recommends that ESD qualification to EI/JESD (Machine Model) be discontinued per JEDEC/JEP7.. Tested to EI/JESD78 Class II C/W mw 3

4 RECOMMENDED OPERTING CONDITIONS Symbol Characteristics Min Max Unit Positive DC Supply oltage.6. IN DC Input oltage. OUT DC Output oltage ctivemode (High or ow State) TriState Mode (Note ) PowerDown Mode ( = ).. T Operating Temperature Range + C t r, t f Input Rise and Fall Time = 3. to 3.6 (SC88 (N), UDFN6, SOT3) =. to. ns/ Input Rise and Fall Time (SC7, SC88, SOT93) =.6 to.9 =.3 to.7 = 3. to 3.6 =. to. Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. DC EECTRIC CHRCTERISTICS Symbol Parameter Condition IH I OH O Highevel Input oltage owevel Input oltage Highevel Output oltage owevel Output oltage IN = IH or I I OH = I OH = m I OH = 8 m I OH = m I OH = 6 m I OH = m I OH = 3 m IN = IH or I I O = I O = m I O = 8 m I O = m I O = 6 m I O = m I O = 3 m () T = C C T C Min Typ Max Min Max.6 to to to to to to I IN Input eakage Current IN =. or.6 to. ±.* ±. I OZ I OFF 3State Output eakage Current Power Off eakage Current OUT = to..6 to. ±. ±. IN =. or OUT =. Units. I CC Quiescent Supply Current IN = or.. Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. *Guaranteed by design.

5 C EECTRIC CHRCTERISTICS (t R = t F = 3. ns) Symbol Parameter Condition t PH t PH t PZH t PZ t PHZ t PZ Propagation Delay, to (Figures 3 and ) Output Enable Time, to (Figures 3 and ) Output Disable Time, to (Figures 3 and ) () T = C C T C Min Typ Max Min Max R = M, C = pf.6 to ns R = M, C = pf.3 to R = M, C = pf 3. to R =, C = pf R = M, C = pf. to....8 R =, C = pf.3..3 Units.6 to ns.3 to to to to.9.. ns.3 to to to CPCITIE CHRCTERISTICS (t R = t F = 3. ns) Symbol Parameter Condition Typical Units C IN Input Capacitance =., IN = or. pf C OUT Output Capacitance =., IN = or. pf C PD Power Dissipation Capacitance (Note ) MHz, = 3.3, IN = or 9 MHz, =., IN = or pf. C PD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. verage operating current can be obtained by the equation: I CC(OPR) = C PD f in + I CC. C PD is used to determine the noload dynamic power consumption; P D = C PD f in + I CC.

6 x OPEN Test Switch Position C, pf R, R, t PH / t PH Open See C Characteristics Table R t PZ / t PZ x DUT OUTPUT t PHZ / t PZH R T R C * X = Don t Care C includes probe and jig capacitance R T is Z OUT of pulse generator (typically ) f = MHz Figure 3. Test Circuit t r = 3 ns INPUT % 9% mi 9% mi t f = 3 ns % INPUT mi mi t PH t PH OH t PZ t PZ ~ OUTPUT mo mo O OUTPUT mo O + O t PH t PH OH t PZH t PHZ OH OH OUTPUT mo mo OUTPUT mo O ~ Figure. Switching Waveforms mo,, mi, t PH, t PH t PZ, t PZ, t PZH, t PHZ,.6 to.9 / ( OH O )/ /..3 to.7 / ( OH O )/ /. 3. to 3.6 / ( OH O )/ /.3. to. / ( OH O )/ /.3 6

7 DEICE ORDERING INFORMTION Device Packages Specific Device Code Pin Orientation (See below) Shipping N7SZ6DFTG SC88 M Q 3 / Tape & Reel N7SZ6DFTG* SC88 M Q 3 / Tape & Reel N7SZ6DBTG (In Development) SC7 TBD Q 3 / Tape & Reel N7SZ6XTG SOT3 M Q 3 / Tape & Reel N7SZ6PTG SOT93 R (Rotated 8 CW) Q / Tape & Reel N7SZ6MUTCG (In Development) N7SZ6MU3TCG (In Development) UDFN6,. x. x.3p TBD Q 3 / Tape & Reel UDFN6,. x. x.3p TBD Q 3 / Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8/D. *N Prefix for utomotive and Other pplications Requiring Unique Site and Control Change Requirements; ECQ Qualified and PPP Capable. Pin Orientation in Tape and Reel 7

8 PCKGE DIMENSIONS SC88 (SC7/SOT33) CSE 9 ISSUE S G B 3 D P. (.8) M B M N NOTES:. DIMENSIONING ND TOERNCING PER NSI.M, 98.. CONTROING DIMENSION: INCH OBSOETE. NEW STNDRD 9.. DIMENSIONS ND B DO NOT INCUDE MOD FSH, PROTRUSIONS, OR GTE BURRS. INCHES MIIMETERS DIM MIN MX MIN MX B C D....3 G.6 BSC.6 BSC H J.... K....3 N.8 REF. REF S C J H K SODER FOOTPRINT* SCE : mm inches *For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SODERRM/D. 8

9 PCKGE DIMENSIONS SC7 CSE 38BQ ISSUE B E 3 B D TOP IEW SIDE IEW e X b. C B E C SETING PNE. c DETI END IEW DETI M RECOMMENDED SODERING FOOTPRINT*.9 PITCH NOTES:. DIMENSIONING ND TOERNCING PER SME.M, 99.. CONTROING DIMENSION: MIIMETERS. 3. MXIMUM ED THICKNESS INCUDES ED FINISH THICKNESS. MINIMUM ED THICKNESS IS THE MINIMUM THICKNESS OF BSE MTERI.. DIMENSIONS ND B DO NOT INCUDE MOD FSH, PROTRUSIONS, OR GTE BURRS. MOD FSH, PROTRUSIONS, OR GTE BURRS SH NOT EXCEED. PER SIDE. MIIMETERS DIM MIN MX.9... b.. c..6 D E E.3.6 e.9 BSC..6 M. X. X.7 DIMENSIONS: MIIMETERS *For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SODERRM/D. 9

10 PCKGE DIMENSIONS SOT3, ED CSE 63B ISSUE C D X 3 e E b P.8 (.3) M X H E c NOTES:. DIMENSIONING ND TOERNCING PER NSI.M, 98.. CONTROING DIMENSION: MIIMETERS 3. MXIMUM ED THICKNESS INCUDES ED FINISH THICKNESS. MINIMUM ED THICKNESS IS THE MINIMUM THICKNESS OF BSE MTERI. MIIMETERS INCHES DIM MIN NOM MX MIN NOM MX b c D E e. BSC. BSC H E SODERING FOOTPRINT* SCE : mm inches *For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SODERRM/D.

11 PCKGE DIMENSIONS SOT93 CSE 7E ISSUE E PIN ONE INDICTOR D 3 TOP IEW e X E X C SIDE IEW H E NOTES:. DIMENSIONING ND TOERNCING PER SME.M, 99.. CONTROING DIMENSION: MIIMETERS 3. MXIMUM ED THICKNESS INCUDES ED FINISH. MINIMUM ED THICKNESS IS THE MINIMUM THICKNESS OF THE BSE MTERI.. DIMENSIONS D ND E DO NOT INCUDE MOD FSH, PROTRUSIONS, OR GTE BURRS. MIIMETERS DIM MIN NOM MX b... C.7..7 D.9.. E e.3 BSC H E REF X 3 X SODERING FOOTPRINT* X b BOTTOM IEW.8 X PCKGE OUTINE. X. X.3.3 PITCH DIMENSIONS: MIIMETERS *For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SODERRM/D.

12 PCKGE DIMENSIONS UDFN6,.x.,.P CSE 7Q ISSUE O 6X PIN ONE REFERENCE. C. C. C. C D ÉÉÉ TOP IEW DETI B SIDE IEW B E C SETING PNE EXPOSED Cu DETI OPTION CONSTRUCTIONS ÉÉÉ MOD CMPD DETI B OPTION CONSTRUCTIONS NOTES:. DIMENSIONING ND TOERNCING PER SME.M, 99.. CONTROING DIMENSION: MIIMETERS. 3. DIMENSION b PPIES TO PTED TERMIN ND IS MESURED BETWEEN. ND.3 mm FROM THE TERMIN TIP. MIIMETERS DIM MIN MX REF b..3 D. BSC E. BSC e. BSC.3.. MOUNTING FOOTPRINT PCKGE OUTINE 6X.3 e 3 6X. DETI 6 BOTTOM IEW 6X b. C B. C NOTE 3 6X.3. PITCH DIMENSIONS: MIIMETERS *For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SODERRM/D.

13 PCKGE DIMENSIONS PIN ONE REFERENCE X X.8 C.8 C. C. C D ÉÉÉ e DETI TOP IEW DETI B SIDE IEW 3 B E 3 6X C SETING PNE UDFN6, x,.3p CSE 7BX ISSUE O 3 DETI TERNTE TERMIN CONSTRUCTION EXPOSED Cu ÉÉ MOD CMPD DETI B TERNTE CONSTRUCTION 6X. NOTES:. DIMENSIONING ND TOERNCING PER SME.M, 99.. CONTROING DIMENSION: MIIMETERS. 3. DIMENSION b PPIES TO PTED TERMIN ND IS MESURED BETWEEN. ND. MM FROM TERMIN TIP.. PCKGE DIMENSIONS EXCUSIE OF BURRS ND MOD FSH. MIIMETERS DIM MIN MX REF b.7.3 D. BSC E. BSC e RECOMMENDED SODERING FOOTPRINT* 6X.. 6 BOTTOM IEW 6X b.7 M C B. M C NOTE 3 PCKGE OUTINE.3 PITCH DIMENSION: MIIMETERS *For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SODERRM/D. ON Semiconductor and are trademarks of Semiconductor Components Industries, C dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. listing of ON Semiconductor s product/patent coverage may be accessed at /site/pdf/patentmarking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. Typical parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. ll operating parameters, including Typicals must be validated for each customer application by customer s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FD Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/ffirmative ction Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBICTION ORDERING INFORMTION ITERTURE FUFIMENT: iterature Distribution Center for ON Semiconductor 9 E. 3nd Pkwy, urora, Colorado 8 US Phone: or Toll Free US/Canada Fax: or Toll Free US/Canada orderlit@onsemi.com N. merican Technical Support: 8898 Toll Free US/Canada Europe, Middle East and frica Technical Support: Phone: ON Semiconductor Website: Order iterature: For additional information, please contact your local Sales Representative N7SZ6/D

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