MC74VHC1G03, MC74VHC1GT03. Single 2-Input NOR Gate with Open Drain Output

Transcription

1 MC7VHCG3, MC7VHCGT3 Single 2-Input NOR Gate with Open Drain Output The MC7VHCG3 / MC7VHCGT3 is a 2input NOR Gate with an open drain output in tiny footprint packages. The input structures provide protection when voltages up to. V are applied, regardless of the supply voltage. This allows the device to be used to interface V circuits to 3 V circuits. The output structures also provide protection when = V and when the output voltage exceeds. These input and output structures help prevent device destruction caused by supply voltage input/output voltage mismatch, battery backup, hot insertion, etc. SC88 DF SUFFIX CSE 9 MRKING DIGRMS XX M Features Designed for 2. V to. V Operation 3. ns t PD at V (typ) Inputs/Outputs OverVoltage Tolerant up to. V I OFF Supports Partial Power Down Protection Source/Sink 8 m at 3. V vailable in SC88, SC7, TSOP, SOT3, SOT93 and UDFN6 Packages Chip Complexity < FETs NV Prefix for utomotive and Other pplications Requiring Unique Site and Control Change Requirements; ECQ Qualified and PPP Capable These Devices are PbFree, Halogen Free/FR Free and are RoHS Compliant IN IN OUT SC7 DV SUFFIX CSE 38Q TSOP DT SUFFIX CSE 83 SOT3 XV SUFFIX CSE 63 SOT93 P SUFFIX CSE 27E XXX M XX M XX M X M Figure. ogic Symbol UDFN6. x. CSE 7Q XM UDFN6. x. CSE 7X X M XX M = Specific Device Code = Date Code* = PbFree Package (Note: Microdot may be in either location) *Date Code orientation and/or position may vary depending upon manufacturing location. ORDERING INFORMTION See detailed ordering, marking and shipping information in the package dimensions section on page 7 of this data sheet. Semiconductor Components Industries, C, 27 November, 28 Rev. Publication Order Number: MC7VHCG3/D

2 MC7VHCG3, MC7VHCGT3 OVT 6 OVT OVT NC (SC88/SOT3/ TSOP/ SC7) SOT93 Figure 2. Pinout (Top View) UDFN6 PIN SSIGNMENT (SC88/SOT3/ TSOP/SC7) PIN SSIGNMENT (SOT93) PIN SSIGNMENT (UDFN) Pin Function Pin Function Pin Function NC 6 FUNCTION TE Input Output Z H H H H 2

3 MC7VHCG3, MC7VHCGT3 MXIMUM RTINGS Symbol Characteristics Value Unit DC Supply Voltage TSOP, SC88 (NV) SC7, SC88, UDFN6, SOT3, SOT93 V IN DC Input Voltage TSOP, SC88 (NV) SC7, SC88, UDFN6, SOT3, SOT93 V OUT DC Output Voltage ctivemode (High or ow State) TSOP, SC88 (NV) TriState Mode (Note ) PowerDown Mode ( = V) DC Output Voltage ctivemode (High or ow State) SC7, SC88, UDFN6, SOT3, SOT93 TriState Mode (Note ) PowerDown Mode ( = V). to +7.. to +6.. to +7.. to +6.. to +.. to +7.. to +7.. to +.. to +6.. to +6. V V V V I IK DC Input Diode Current V IN < 2 m I OK DC Output Diode Current V OUT < +2 m I OUT DC Output Source/Sink Current +2 m I CC or I DC Supply Current per Supply Pin or Ground Pin + m T STG Storage Temperature Range 6 to + C T ead Temperature, mm from Case for secs 26 C T J Junction Temperature Under ias + C J Thermal Resistance (Note 2) SC88 SC7 TSOP SOT3 SOT93 UDFN6 P D Power Dissipation in Still ir SC88 SC7 TSOP SOT3 SOT93 UDFN C/W mw MS Moisture Sensitivity evel F R Flammability Rating Oxygen Index: 28 to 3 U 9 2 in V ESD ESD Withstand Voltage (Note 3) Human ody Model Charged Device Model 2 V I atchup atchup Performance (Note ) m Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.. pplicable to devices with outputs that may be tristated. 2. Measured with minimum pad spacing on an FR board, using mmbyinch, 2 ounce copper trace no air flow. 3. HM tested to NSI/ESD/JEDEC JS27. CDM tested to EI/JESD22CF. JEDEC recommends that ESD qualification to EI/JESD22 (Machine Model) be discontinued per JEDEC/JEP72.. Tested to EI/JESD78 Class II. 3

4 MC7VHCG3, MC7VHCGT3 RECOMMENDED OPERTING CONDITIONS Symbol Characteristics Min Max Unit Positive DC Supply Voltage 2.. V V IN DC Input Voltage. V V OUT DC Output Voltage TSOP, SC88 (NV) V DC Output Voltage SC7, SC88, UDFN6, SOT3, SOT93 ctivemode (High or ow State) TriState Mode (Note ) PowerDown Mode ( = V) T Operating Temperature Range +2 C t r, t f Input Rise and Fall Time TSOP, SC88 (NV) = 3. V to 3.6 V =. V to. V Input Rise and Fall Time SC7, SC88, UDFN6, SOT3, SOT93 =.6 V to.9 V = 2.3 V to 2.7 V = 3. V to 3.6 V =. V to. V Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability ns/v DC EECTRIC CHRCTERISTICS (MC7VHCG3) T Test V = 2 C C T 8 C C T 2 C CC Symbol Parameter Conditions (V) Min Typ Max Min Max Min Max V IH V I V O I IN I OZ I OFF I CC Highevel Input Voltage owevel Input Voltage owevel Output Voltage Input eakage Current 3State Output eakage Current Power Off eakage Current Quiescent Supply Current *Guaranteed by design. V IN = V IH or V I I O = I O = I O = I O = m I O = 8 m V IN =. V or V OUT = V to. V V IN =. V or V OUT =. V V IN = or Unit V V to ±* ±... ± V

5 MC7VHCG3, MC7VHCGT3 DC EECTRIC CHRCTERISTICS (MC7VHCGT3) T Test V = 2 C C T 8 C C T 2 C CC Symbol Parameter Conditions (V) Min Typ Max Min Max Min Max V IH V I V O I IN I OZ I OFF I CC I CCT Highevel Input Voltage owevel Input Voltage owevel Output Voltage Input eakage Current 3State Output eakage Current Power Off eakage Current Quiescent Supply Current Increase in Quiescent Supply Current per Input Pin *Guaranteed by design. V IN = V IH or V I I O = I O = I O = I O = m I O = 8 m V IN =. V or V OUT = V to. V V IN =. V or V OUT =. V V IN = or One Input: V IN = 3. V; Other Input at or Unit V V to ±* ±... ± m V C EECTRIC CHRCTERISTICS (Input t r = t f = 3. ns) T = 2 C C T 8 C C T 2 C Symbol Parameter Conditions (V) Min Typ Max Min Max Min Max Unit t PZ Output Enable C = pf 3. to ns Time, OE to (Figures 3 and ) C = pf C = pf. to t PZ Output Disable Time, OE to (Figures 3 and ) C = pf C = pf 3. to ns C = pf C = pf. to C = pf C IN Input Capacitance. pf C OUT Output Capacitance Output in High Impedance State 6. pf 2 C, =. V C PD Power Dissipation Capacitance (Note ) 8. pf. C PD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. verage operating current can be obtained by the equation: I CC(OPR) = C PD f in + I CC. C PD is used to determine the noload dynamic power consumption; P D = C PD V 2 CC f in + I CC.

6 MC7VHCG3, MC7VHCGT3 OPEN Test Switch Position C, pf R, t PH / t PH Open See C Characteristics Table X R t PZ / t PZ k DUT OUTPUT t PHZ / t PZH k R T C * X = Don t Care C includes probe and jig capacitance R T is Z OUT of pulse generator (typically ) f = MHz Figure 3. Test Circuit t r = 3 ns INPUT % 9% V mi 9% V mi t f = 3 ns % INPUT V mi V mi t PH t PH V OH t PZ t PZ ~ OUTPUT V mo V mo V O OUTPUT V mo V O + V V O t PH t PH V OH t PZH t PHZ V OH V OH V OUTPUT V mo V mo OUTPUT V mo V O ~ V Figure. Switching Waveforms V mo, V, V V mi, V t PH, t PH t PZ, t PZ, t PZH, t PHZ V, V 3. to 3.6 /2 (V OH V O )/2 /2.3. to. /2 (V OH V O )/2 /2.3 6

7 MC7VHCG3, MC7VHCGT3 ORDERING INFORMTION Device Packages Specific Device Code Pin Orientation (See below) Shipping MC7VHCG3DFTG SC88 VP Q2 3 / Tape & Reel MC7VHCG3DFT2G SC88 VP Q 3 / Tape & Reel NVVHCG3DFTG* SC88 VP Q2 3 / Tape & Reel MC7VHCGT3DFTG SC88 TD Q2 3 / Tape & Reel MC7VHCGT3DFT2G MC7VHCG3DVTG MC7VHCGT3DVTG SC88 TD Q 3 / Tape & Reel SC7 TD Q 3 / Tape & Reel SC7 TD Q 3 / Tape & Reel MC7VHCG3DTTG TSOP VP Q 3 / Tape & Reel MC7VHCGT3DTTG MC7VHCG3XVT2G MC7VHCGT3XVT2G MC7VHCG3PTG MC7VHCGT3PTG MC7VHCG3MUTCG MC7VHCGT3MUTCG MC7VHCG3MU3TCG MC7VHCGT3MU3TCG TSOP TD Q 3 / Tape & Reel SOT3 TD Q 3 / Tape & Reel SOT3 TD Q 3 / Tape & Reel SOT93 TD Q2 / Tape & Reel SOT93 TD Q2 / Tape & Reel UDFN6,. x.,.p TD Q 3 / Tape & Reel UDFN6,. x.,.p TD Q 3 / Tape & Reel UDFN6,. x.,.3 TD Q 3 / Tape & Reel UDFN6,. x.,.3 TD Q 3 / Tape & Reel For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications rochure, RD8/D. *NV Prefix for utomotive and Other pplications Requiring Unique Site and Control Change Requirements; ECQ Qualified and PPP Capable. Pin Orientation in Tape and Reel 7

8 MC7VHCG3, MC7VHCGT3 PCKGE DIMENSIONS SC88 (SC7/SOT33) CSE 92 ISSUE S G 2 3 D P.2 (.8) M M N NOTES:. DIMENSIONING ND TOERNCING PER NSI.M, CONTROING DIMENSION: INCH OSOETE. NEW STNDRD 92.. DIMENSIONS ND DO NOT INCUDE MOD FSH, PROTRUSIONS, OR GTE URRS. INCHES MIIMETERS DIM MIN MX MIN MX C D..2.3 G.26 SC.6 SC H J...2 K..2.3 N.8 REF.2 REF S C J H K SODER FOOTPRINT* SCE 2: mm inches *For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SODERRM/D. 8

9 MC7VHCG3, MC7VHCGT3 PCKGE DIMENSIONS SC7 CSE 38Q ISSUE E 2 3 D TOP VIEW SIDE VIEW e X b.2 C E C SETING PNE. c DETI END VIEW DETI M RECOMMENDED SODERING FOOTPRINT*.9 PITCH NOTES:. DIMENSIONING ND TOERNCING PER SME.M, CONTROING DIMENSION: MIIMETERS. 3. MXIMUM ED THICKNESS INCUDES ED FINISH THICKNESS. MINIMUM ED THICKNESS IS THE MINIMUM THICKNESS OF SE MTERI.. DIMENSIONS ND DO NOT INCUDE MOD FSH, PROTRUSIONS, OR GTE URRS. MOD FSH, PROTRUSIONS, OR GTE URRS SH NOT EXCEED PER SIDE. MIIMETERS DIM MIN MX.9.. b.2. c.26 D E E.3.6 e.9 SC.2.6 M 2. X. X.7 DIMENSIONS: MIIMETERS *For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SODERRM/D. 9

10 MC7VHCG3, MC7VHCGT3 PCKGE DIMENSIONS TSOP CSE 832 ISSUE M 2X 2X.2 NOTE T. T 2 3 H G TOP VIEW SIDE VIEW C D X S.2 C SETING PNE C J K DETI Z END VIEW M DETI Z NOTES:. DIMENSIONING ND TOERNCING PER SME.M, CONTROING DIMENSION: MIIMETERS. 3. MXIMUM ED THICKNESS INCUDES ED FINISH THICKNESS. MINIMUM ED THICKNESS IS THE MINIMUM THICKNESS OF SE MTERI.. DIMENSIONS ND DO NOT INCUDE MOD FSH, PROTRUSIONS, OR GTE URRS. MOD FSH, PROTRUSIONS, OR GTE URRS SH NOT EXCEED PER SIDE. DIMENSION.. OPTION CONSTRUCTION: N DDITION TRIMMED ED IS OWED IN THIS OCTION. TRIMMED ED NOT TO EXTEND MORE THN.2 FROM OD. MIIMETERS DIM MIN MX C D.2. G.9 SC H. J.26 K.2.6 M S SODERING FOOTPRINT* SCE : mm inches *For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SODERRM/D.

11 MC7VHCG3, MC7VHCGT3 PCKGE DIMENSIONS SOT3, ED CSE 63 ISSUE C D X 2 3 e E b P.8 (.3) M X H E c NOTES:. DIMENSIONING ND TOERNCING PER NSI.M, CONTROING DIMENSION: MIIMETERS 3. MXIMUM ED THICKNESS INCUDES ED FINISH THICKNESS. MINIMUM ED THICKNESS IS THE MINIMUM THICKNESS OF SE MTERI. MIIMETERS INCHES DIM MIN NOM MX MIN NOM MX b c D E e. SC.2 SC H E SODERING FOOTPRINT* SCE 2: mm inches *For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SODERRM/D.

12 MC7VHCG3, MC7VHCGT3 PCKGE DIMENSIONS SOT93 CSE 27E ISSUE E PIN ONE INDICTOR D 2 3 TOP VIEW e X E X C SIDE VIEW H E NOTES:. DIMENSIONING ND TOERNCING PER SME.M, CONTROING DIMENSION: MIIMETERS 3. MXIMUM ED THICKNESS INCUDES ED FINISH. MINIMUM ED THICKNESS IS THE MINIMUM THICKNESS OF THE SE MTERI.. DIMENSIONS D ND E DO NOT INCUDE MOD FSH, PROTRUSIONS, OR GTE URRS. MIIMETERS DIM MIN NOM MX b.2 C D.9.. E e.3 SC H E REF 2. 3 X 3 X 2 SODERING FOOTPRINT* X b OTTOM VIEW.8 X PCKGE OUTINE.2 X.2 X.3.3 PITCH DIMENSIONS: MIIMETERS *For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SODERRM/D. 2

13 MC7VHCG3, MC7VHCGT3 PCKGE DIMENSIONS UDFN6,.x.,.P CSE 7Q ISSUE O 6X PIN ONE REFERENCE C. C. C C D ÉÉÉ TOP VIEW DETI SIDE VIEW E 2 C SETING PNE EXPOSED Cu DETI OPTION CONSTRUCTIONS ÉÉÉ MOD CMPD DETI OPTION CONSTRUCTIONS NOTES:. DIMENSIONING ND TOERNCING PER SME.M, CONTROING DIMENSION: MIIMETERS. 3. DIMENSION b PPIES TO PTED TERMIN ND IS MESURED ETWEEN ND.3 mm FROM THE TERMIN TIP. MIIMETERS DIM MIN MX REF b.2.3 D. SC E. SC e. SC.3. MOUNTING FOOTPRINT PCKGE OUTINE 6X.3 e 3 6X.2 DETI 6 OTTOM VIEW 6X b C. C NOTE 3 6X.3. PITCH DIMENSIONS: MIIMETERS *For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SODERRM/D. 3

14 MC7VHCG3, MC7VHCGT3 PCKGE DIMENSIONS UDFN6, x,.3p CSE 7X ISSUE O PIN ONE REFERENCE 2X 2X.8 C.8 C. C. C D ÉÉÉ e DETI TOP VIEW DETI SIDE VIEW 3 E 3 6X C SETING PNE 3 DETI TERNTE TERMIN CONSTRUCTION EXPOSED Cu ÉÉ MOD CMPD DETI TERNTE CONSTRUCTION 6X.2 NOTES:. DIMENSIONING ND TOERNCING PER SME.M, CONTROING DIMENSION: MIIMETERS. 3. DIMENSION b PPIES TO PTED TERMIN ND IS MESURED ETWEEN ND.2 MM FROM TERMIN TIP.. PCKGE DIMENSIONS EXCUSIVE OF URRS ND MOD FSH. MIIMETERS DIM MIN MX REF b 7.23 D. SC E. SC e RECOMMENDED SODERING FOOTPRINT* 6X OTTOM VIEW 6X b.7 M C. M C NOTE 3 PCKGE OUTINE.3 PITCH DIMENSION: MIIMETERS *For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SODERRM/D. ON Semiconductor and are trademarks of Semiconductor Components Industries, C dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. listing of ON Semiconductor s product/patent coverage may be accessed at /site/pdf/patentmarking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. uyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. Typical parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. ll operating parameters, including Typicals must be validated for each customer application by customer s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FD Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should uyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, uyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/ffirmative ction Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUICTION ORDERING INFORMTION ITERTURE FUFIMENT: iterature Distribution Center for ON Semiconductor 92 E. 32nd Pkwy, urora, Colorado 8 US Phone: or Toll Free US/Canada Fax: or Toll Free US/Canada orderlit@onsemi.com N. merican Technical Support: Toll Free US/Canada Europe, Middle East and frica Technical Support: Phone: ON Semiconductor Website: Order iterature: For additional information, please contact your local Sales Representative MC7VHCG3/D