NL17SZ16. Single Input Buffer

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1 Single Input Buffer The NL7SZ6 is a single input Buffer in two tiny footprint packages. The device performs much as LCX multi-gate products in speed and drive. Tiny SOT- 33 and SOT- 3 Packages Source/Sink 24 m at 3.0 olts Over-oltage Tolerant Inputs and Outputs Chip Complexity: FETs = 20 Designed for.6 to. Operation MRKING DIGRMS LR d SOT-33/SC70-/SC-88 DF SUFFIX CSE 49 NC d = Date Code 2 LR D GND 3 4 Y SOT-3 X SUFFIX CSE 463B Figure. Pinout (Top iew) LR D = Device Marking = One Digit Date Code Y Figure 2. Logic Symbol PIN SSIGNMENT Pin Function NC 2 IN 3 GND 4 OUT Y FUNCTION TBLE Input L H Y Output L H ORDERING INFORMTION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. Semiconductor Components Industries, LLC, 2003 February, Rev. 4 Publication Order Number: NL7SZ6/D

2 MXIMUM RTINGS Symbol Parameter alue Unit DC Supply oltage 0. to 7.0 I DC Input oltage Output in High or Low State (Note 2) 0. I 7.0 O DC Output oltage I < GND 0. O 7.0 I IK DC Input Diode Current O < GND 0 m I OK DC Output Diode Current 0 m I OUT DC Output Sink Current 0 m I CC DC Supply Current per Supply Pin 00 m I GND DC Ground per Supply Pin 00 m T STG Storage Temperature Range 6 to 0 C T L Lead Temperature, mm from Case for 0 Seconds 260 C T J Junction Temperature Under Bias 0 C J Thermal Resistance SOT- 33 SOT- 3 P D Power Dissipation in Still ir at 8 C SOT- 33 SOT C/W mw MSL Moisture Sensitivity Level F R Flammability Rating Oxygen Index: 28 to 34 UL 0.2 in ESD ESD Classification Human Body Model (Note 3) Machine Model (Note 4) Charged Device Model (Note ) Class IC Class N/ I LTCH- UP Latch-Up Performance bove and Below GND at 8 C (Note 6) 00 m Maximum Ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute maximum-rated conditions is not implied. Functional operation should be restricted to the Recommended Operating Conditions.. Measured with minimum pad spacing on an FR4 board, using 0 mm-by- inch, 2-ounce copper trace with no air flow. 2. I O bsolute Maximum Rating Must be Obtained. 3. Tested to EI/JESD22-4-, rated to EI/JESD22-4-B. 4. Tested to EI/JESD22--, rated to EI/JESD Tested to JESD22-C Tested to EI/JESD78. RECOMMENDED OPERTING CONDITIONS Symbol Parameter Min Max Unit DC Supply oltage Operations Only Data Retention IN DC Input oltage 0. OUT DC Output oltage 0. T Operating Temperature Range 40 8 C.6... t r, t f Input Rise and Fall Time = = = ns/ 2

3 DEICE JUNCTION TEMPERTURE ERSUS TIME TO 0.% BOND FILURES Junction Temperature C Time, Hours Time, Years 80,032, , , , , , ,900.0 NORMLIZED FILURE RTE FILURE RTE OF PLSTIC = CERMIC UNTIL INTERMETLLICS OCCUR T J = 30 C T J = 20 C T J = 0 C T J = 00 C TIME, YERS Figure 3. Failure Rate vs. Time Junction Temperature T J = 90 C T J = 80 C DC ELECTRICL CHRCTERISTICS Symbol Parameter Condition IH High-Level Input oltage.6 to to. IL Low-Level Input oltage.6 to to. OH OL High- Level Output oltage IN = IL or IH Low- Level Output oltage IN = IH or OH I OH = -00 I OH = -3 m I OH = -8 m I OH = -2 m I OH = -6 m I OH = -24 m I OH = -32 m I OL = 00 I OL = 4 m I OL = 8 m I OL = 2 m I OL = 6 m I OL = 24 m I OL = 32 m T = 2 C 40 C T 8 C () Min Typ Max Min Max Unit.6 to to I IN Input Leakage Current IN = or GND 0 to I OFF Power Off- Output Leakage Current OUT =. 0 0 I CC Quiescent Supply Current IN = or GND. 0 3

4 C ELECTRICL CHRCTERISTICS t R = t F = 3.0 ns Symbol Parameter Condition t PLH t PHL Propagation Delay (Figure 4 and ) R L = M C L = pf T = 2 C 40 C T 8 C () Min Typ Max Min Max Unit R L = 00 C L = 0 pf ns CPCITIE CHRCTERISTICS Symbol Parameter Condition Typical Unit C IN Input Capacitance =., I = 0 or 4 pf C PD Power Dissipation Capacitanceacitance 0 MHz, = 3.3, I = 0 or 2 pf (Note 7) 0 MHz, =., I = 0 or C PD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. verage operating current can be obtained by the equation: I CC(OPR) = C PD f in + I CC. C PD is used to determine the no-load dynamic power consumption; P D = C PD 2 f in + I CC. t f = 3 ns t f = 3 ns INPUT and B 90% 0% 0% 90% 0% 0% GND INPUT R L C L OUTPUT t PHL t PLH OL OUTPUT Y 0% 0% OH - MHz square input wave is recommended for propagation delay tests. Figure 4. Switching Waveform Figure. Test Circuit DEICE ORDERING INFORMTION Device Order Number Logic Circuit Indicator No. of Gates per Package Temp Range Identifier Device Nomenclature Technology Device Function Package Suffix Tape and Reel Suffix Package Type NL7SZ6DFT2 NL 7 SZ 6 DF T2 SOT-33/ SC70-/ SC-88 Tape and Reel Size 78 mm, 3000 Unit NL7SZ6XT2 NL 7 SZ 6 X T2 SOT-3 78 mm, 4000 Unit 4

5 CITY TPE TOP TPE TPE TRILER (Connected to Reel Hub) NO COMPONENTS 60 mm MIN COMPONENTS DIRECTION OF FEED TPE LEDER NO COMPONENTS 400 mm MIN Figure 6. Tape Ends for Finished Goods T2 Pin One Opposing Sprocket Hole (3k Reel) Figure 7. SOT-33/SC70-/SC-88 Reel Configuration/Orientation T2 Pin One Opposing Sprocket Hole (4k Reel) Figure 8. SOT-3 XT2 Reel Configuration/Orientation

6 t MX. mm MIN (0.06 in) 3.0 mm 0.2 mm (0.2 in in) 20.2 mm MIN (0.79 in) 0 mm MIN (.969 in) FULL RDIUS G Figure 9. Reel Dimensions REEL DIMENSIONS Tape Size T and R Suffix Max G t Max 8 mm T2 78 mm (7 in) 8.4 mm, +. mm, -0.0 (0.33 in in, -0.00) 4.4 mm (0.6 in) For additional tape and reel information, refer to Brochure BRD80/D. DIRECTION OF FEED BRCODE LBEL POCKET HOLE Figure 0. Reel Winding Direction 6

7 PCKGE DIMENSIONS SOT-33 DF SUFFIX -LED PCKGE CSE ISSUE F G NOTES:. DIMENSIONING ND TOLERNCING PER NSI Y4.M, CONTROLLING DIMENSION: INCH OBSOLETE. NEW STNDRD S 4 -B- 2 3 D PL 0.2 (0.008) M B M INCHES MILLIMETERS DIM MIN MX MIN MX B C D G BSC 0.6 BSC H J K N REF 0.20 REF S N C J H K mm inches 7

8 PCKGE DIMENSIONS SOT-3 X SUFFIX -LED PCKGE CSE 463B-0 ISSUE O -X- C K NOTES:. DIMENSIONING ND TOLERNCING PER NSI Y4.M, CONTROLLING DIMENSION: MILLIMETERS 3. MXIMUM LED THICKNESS INCLUDES LED FINISH THICKNESS. MINIMUM LED THICKNESS IS THE MINIMUM THICKNESS OF BSE MTERIL G B -Y- D PL 0.08 (0.003) M X Y S J MILLIMETERS INCHES DIM MIN MX MIN MX B C D G 0.0 BSC BSC J K S STYLE : PIN. BSE 2. EMITTER /2 3. BSE 2 4. COLLECTOR 2. COLLECTOR STYLE 2: PIN. CTHODE 2. NODE 3. CTHODE 4. CTHODE. CTHODE mm inches ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Typical parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. ll operating parameters, including Typicals must be validated for each customer application by customer s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/ffirmative ction Employer. PUBLICTION ORDERING INFORMTION Literature Fulfillment: Literature Distribution Center for ON Semiconductor P.O. Box 63, Denver, Colorado 8027 US Phone: or Toll Free US/Canada Fax: or Toll Free US/Canada ONlit@hibbertco.com N. merican Technical Support: Toll Free US/Canada JPN: ON Semiconductor, Japan Customer Focus Center 2-9- Kamimeguro, Meguro-ku, Tokyo, Japan 3-00 Phone: ON Semiconductor Website: For additional information, please contact your local Sales Representative. 8 NL7SZ6/D

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