MC74VHC1G05. Single Inverter with Open Drain Output

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1 Single Inverter with Open Drain Output The is an advanced high speed MOS inverter with open drain output fabricated with silicon gate MOS technology. The internal circuit is composed of three stages, including an open drain output which provides the capability to set output switching level. This allows the to be used to interface circuits to circuits of any voltage between and 7 using an external resistor and power supply. The input structure provides protection when voltages up to 7 are applied, regardless of the supply voltage. Features High Speed: t PD = 3.8 ns (Typ) at = Low Internal Power Dissipation: I = (Max) at T = 2 Power Down Protection Provided on Inputs Pin and Function ompatible with Other Standard Logic Families hip omplexity: FET = 0 Pb Free Packages are vailable S 88 / SOT 33 / S 70 DF SUFFIX SE 9 TSOP / SOT 23 / S 9 DT SUFFIX SE 83 MRKING DIGRMS M F M F M N OT F = Device ode M = Date ode* = Pb Free Package (Note: Microdot may be in either location) *Date ode orientation and/or position may vary depending upon manufacturing location. IN 2 PIN SSIGNMENT GND 3 OUT Y N 2 IN Figure. Pinout (Top iew) 3 GND OUT Y FUNTION TBLE IN OUT Y Input Y Output Figure 2. Logic Symbol L H Z L ORDERING INFORMTION See detailed ordering and shipping information in the package dimensions section on page of this data sheet. Semiconductor omponents Industries, LL, 2007 February, 2007 Rev. Publication Order Number: /D

2 MXIMUM RTINGS Symbol haracteristics alue Unit D Supply oltage 0. to +7.0 IN D Input oltage 0. to +7.0 OUT D Output oltage 0. to 7.0 I IK Input Diode urrent 20 m I OK Output Diode urrent OUT < GND; OUT > +20 m I OUT D Output urrent, per Pin +2 m I D Supply urrent, and GND +0 m T STG Storage Temperature Range 6 to 0 T L Lead Temperature, mm from ase for 0 Seconds 260 T J Junction Temperature Under Bias 0 J Thermal Resistance S70 /S 88/SOT 33 (Note ) SOT23 /TSOP /S9 P D Power Dissipation in Still ir at 8 S70 /S 88/SOT 33 SOT23 /TSOP /S /W mw MSL Moisture Sensitivity Level F R Flammability Rating Oxygen Index: 28 to 3 UL in ESD ESD Withstand oltage Human Body Model (Note 2) Machine Model (Note 3) harged Device Model (Note ) N/ I LTHUP Latchup Performance bove and Below GND at 2 (Note ) 00 m Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating onditions is not implied. Extended exposure to stresses above the Recommended Operating onditions may affect device reliability.. Measured with minimum pad spacing on an FR board, using 0 mm by inch, 2 ounce copper trace with no air flow. 2. Tested to EI/JESD Tested to EI/JESD22.. Tested to JESD Tested to EI/JESD78. REOMMENDED OPERTING ONDITIONS Symbol haracteristics Min Max Unit D Supply oltage 2.0. IN D Input oltage 0.0. OUT D Output oltage T Operating Temperature Range +2 t r, t f Input Rise and Fall Time = 3.3 ± 0.3 =.0 ± ns/ DEIE JUNTION TEMPERTURE ERSUS TIME TO 0.% BOND FILURES Junction Temperature Time, Hours Time, Years 80,032, , , , , , ,900.0 NORMLIZED FILURE RTE FILURE RTE OF PLSTI = ERMI UNTIL INTERMETLLIS OUR T J = 30 T J = 20 T J = 0 T J = TIME, YERS Figure 3. Failure Rate vs. Time Junction Temperature T J = 90 T J = 80 2

3 D ELETRIL HRTERISTIS T = 2 T 8 T 2 Symbol Parameter Test onditions () Min Typ Max Min Max Min Max Unit IH IL OL I LKG I IN Minimum High Level Input oltage Maximum Low Level Input oltage Maximum Low Level Output oltage IN = IH or IL Z State Output Leakage urrent Maximum Input Leakage urrent IN = IH I OL = 0 IN = IH I OL = m I OL = 8 m IN = IL OUT = or GND IN =. or GND to. ±0. ±.0 ±.0 I Maximum Quiescent Supply urrent IN = or GND I OFF Power Off Output Leakage urrent OUT =. IN = Î ELETRIL HRTERISTIS Input t r = t f = ns Î T = 2 Î T 8 T 2 Symbol Parameter Test onditions Î Min Typ Max Î Min Î Max Î Min Max Unit t PZL Maximum Output = 3.3 ± 0.3 L = pf Î Enable Time, R L = R I = 00 L = 0 pf Î Î Î ns Input to Y =.0 ± 0. L = pf R L = R I = 00 L 3.8.Î = 0 pf t PLZ Î Maximum Output = 3.3 ± 0.3 L Î = 0 pf Î Disable Time R L = R I = 00 Î Î Î Î Î 2.0Î Î. ns =.0 ± 0. L = 0 pf.3 7.Î R L = R I = 00 Î IN Maximum Input 0 Î Î 0 0 Î pf apacitance 2, =.0 PD Power Dissipation apacitance (Note 6) 8 pf 6. PD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. verage operating current can be obtained by the equation: I (OPR) = PD f in + I. PD is used to determine the no load dynamic power consumption; P D = PD 2 f in + I. 3

4 OT 7 R L Y 0% t PZL 0% t PLZ GND OL +0.3 HIGH IMPEDNE Figure. Output oltage Mismatch pplication Figure. Switching Waveforms PULSE GENERTOR DUT R x 2 R T L R L L = 0 pf equivalent (Includes jig and probe capacitance) R L = R = 00 or equivalent R T = Z OUT of pulse generator (typically 0 ) Figure 6. Test ircuit M7HG0 B 2.2 k M7HG03. D R 2 LED 3.3 F = ( B) + (+D) + E E GTL Figure 7. omplex Boolean Functions Figure 8. LED Driver Figure 9. GTL Driver ORDERING INFORMTION DFT DFTG Device Package Shipping S70 / S 88 / SOT 33 S70 / S 88 / SOT 33 (Pb Free) DFT2 DFT2G S70 / S 88 / SOT 33 S70 / S 88 / SOT 33 (Pb Free) 3000/Tape & Reel DTT DTTG SOT23 / TSSOP / S9 SOT23 / TSSOP / S9 (Pb Free) For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD80/D.

5 PKGE DIMENSIONS S 88, SOT 33, S 70 SE 9 02 ISSUE J S G B 2 3 D PL 0.2 (0.008) M B M N NOTES:. DIMENSIONING ND TOLERNING PER NSI Y.M, ONTROLLING DIMENSION: INH OBSOLETE. NEW STNDRD DIMENSIONS ND B DO NOT INLUDE MOLD FLSH, PROTRUSIONS, OR GTE BURRS. INHES MILLIMETERS DIM MIN MX MIN MX B D G BS 0.6 BS H J K N REF 0.20 REF S J H K SOLDERING FOOTPRINT* SLE 20: mm inches *For additional information on our Pb Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.

6 PKGE DIMENSIONS TSOP SE ISSUE F 2X 2X NOTE 0.0 T 0.20 T L H G B D X 0.20 B T S SETING PLNE J K DETIL Z M DETIL Z NOTES:. DIMENSIONING ND TOLERNING PER SME Y.M, ONTROLLING DIMENSION: MILLIMETERS. 3. MXIMUM LED THIKNESS INLUDES LED FINISH THIKNESS. MINIMUM LED THIKNESS IS THE MINIMUM THIKNESS OF BSE MTERIL.. DIMENSIONS ND B DO NOT INLUDE MOLD FLSH, PROTRUSIONS, OR GTE BURRS.. OPTIONL ONSTRUTION: N DDITIONL TRIMMED LED IS LLOWED IN THIS LOTION. TRIMMED LED NOT TO EXTEND MORE THN 0.2 FROM BODY. MILLIMETERS DIM MIN MX 0 BS B.0 BS D G 0.9 BS H J K L.2. M 0 0 S SOLDERING FOOTPRINT* SLE 0: mm inches *For additional information on our Pb Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor omponents Industries, LL (SILL). SILL reserves the right to make changes without further notice to any products herein. SILL makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SILL assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Typical parameters which may be provided in SILL data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. ll operating parameters, including Typicals must be validated for each customer application by customer s technical experts. SILL does not convey any license under its patent rights nor the rights of others. SILL products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SILL product could create a situation where personal injury or death may occur. Should Buyer purchase or use SILL products for any such unintended or unauthorized application, Buyer shall indemnify and hold SILL and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SILL was negligent regarding the design or manufacture of the part. SILL is an Equal Opportunity/ffirmative ction Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLITION ORDERING INFORMTION LITERTURE FULFILLMENT: Literature Distribution enter for ON Semiconductor P.O. Box 63, Denver, olorado 8027 US Phone: or Toll Free US/anada Fax: or Toll Free US/anada orderlit@onsemi.com N. merican Technical Support: Toll Free US/anada Europe, Middle East and frica Technical Support: Phone: Japan ustomer Focus enter Phone: ON Semiconductor Website: Order Literature: For additional information, please contact your local Sales Representative /D

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