MC74VHC257. Quad 2-Channel Multiplexer with 3-State Outputs

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1 MC74HC257 Quad 2-Channel Muliplexer wih 3-ae Oupus The MC74HC257 is an advanced high speed CMO quad 2 channel muliplexer fabricaed wih silicon gae CMO echnology. I achieves high speed operaion similar o equivalen Bipolar choky TTL while mainaining CMO low power dissipaion. I consiss of four 2 inpu digial muliplexers wih common selec () and enable (OE) inpus. When (OE) is held High, selecion of daa is inhibied and all he oupus go Low. The selec decoding deermines wheher he A or B inpus ge roued o he corresponding Y oupus. The inpus olerae volages up o 7, allowing he inerface of 5 sysems o 3 sysems. High peed: PD = 4. ns (Typ) a CC = 5.0 Low Power Dissipaion: I CC = 4.0 A (Max) a T A = 25 C High Noise Immuniy: NIH = NIL = 28% CC Power Down Proecion Provided on Inpus Balanced Propagaion Delays Designed for o 5.5 Operaing Range Low Noise: OLP = 0.8 (Max) Pin and Funcion Compaible wih Oher andard Logic Families Lachup Performance Exceeds 300 ma ED Performance: HBM > 2000 ; Machine Model > 200 Chip Complexiy: FETs = 00; Equivalen Gaes = 25 These Devices are Pb Free and are RoH Complian O 6 D UFFIX CAE 75B TOP 6 DT UFFIX CAE 948F MARKING DIAGRAM 6 9 HC257G AWLYWW HC 257 ALYW A = Assembly Locaion L, WL = Wafer Lo Y, YY = Year W, WW = Work Week G or = Pb Free Package 8 A CC OE ORDERING INFORMATION Device Package hipping MC74HC257DG O 6 48 Unis/Rail B0 3 4 A3 MC74HC257DR2G O Unis/Reel Y0 A B3 Y3 MC74HC257DTG TOP 6 96 Unis/Rail MC74HC257DTR2G TOP Unis/Reel B 6 A2 Y 7 0 B2 GND 8 9 Y2 Figure. Pin Assignmen emiconducor Componens Indusries, LLC, 204 epember, 204 Rev. 6 Publicaion Order Number: MC74HC257/D

2 MC74HC257 OE I 0a I a I 0b I b I 0c I c I 0d I d Z a Z b Z c Z d Figure 2. Expanded Logic Diagram OE 5 EN G A0 B0 A B A2 B2 A3 B MUX Y0 Y Y2 Y3 Figure 3. IEC Logic ymbol FUNCTION TABLE Inpus Oupus OE Y0 Y3 H L X L Z A0 A3 L H B0 B3 A0 A3, B0 B3 = he levels of he respecive Daa Word Inpus. This device conains proecion circuiry o guard agains damage due o high saic volages or elecric fields. However, precauions mus be aken o avoid applicaions of any volage higher han maximum raed volages o his high impedance circui. For proper operaion, in and ou should be consrained o he range GND ( in or ou ) CC. Unused inpus mus always be ied o an appropriae logic volage level (e.g., eiher GND or CC ). Unused oupus mus be lef open. 2

3 MC74HC257 MAXIMUM RATING ymbol Parameer alue Uni CC Posiive DC upply olage 0.5 o +7.0 IN Digial Inpu olage 0.5 o +7.0 OUT DC Oupu olage 0.5 o CC +0.5 I IK Inpu Diode Curren 20 ma I OK Oupu Diode Curren 20 ma I OUT DC Oupu Curren, per Pin 25 ma I CC DC upply Curren, CC and GND Pins 75 ma P D Power Dissipaion in ill Air OIC Package TOP mw T TG orage Temperaure Range 65 o +50 C ED ED Wihsand olage Human Body Model (Noe ) Machine Model (Noe 2) Charged Device Model (Noe 3) >2000 >200 >2000 I LATCHUP Lachup Performance Above CC and Below GND a 25 C (Noe 4) 300 ma JA Thermal Resisance, Juncion o Ambien OIC Package TOP resses exceeding hose lised in he Maximum Raings able may damage he device. If any of hese limis are exceeded, device funcionaliy should no be assumed, damage may occur and reliabiliy may be affeced. Tesed o EIA/JED22 A4 A 2 Tesed o EIA/JED22 A5 A 3 Tesed o JED22 C0 A 4 Tesed o EIA/JED C/W RECOMMENDED OPERATING CONDITION ymbol Characerisics Min Max Uni CC DC upply olage 5.5 IN DC Inpu olage OUT DC Oupu olage 0 CC T A Operaing Temperaure Range, all Package Types C r, f Inpu Rise or Fall Time CC = CC = ns/ Funcional operaion above he sresses lised in he Recommended Operaing Ranges is no implied. Exended exposure o sresses beyond he Recommended Operaing Ranges limis may affec device reliabiliy. DEICE JUNCTION TEMPERATURE ERU TIME TO % BOND FAILURE Juncion Temperaure C Time, Hours Time, Years 80,032, , , , , , ,900.0 NORMALIZED FAILURE RATE FAILURE RATE OF PLATIC = CERAMIC UNTIL INTERMETALLIC OCCUR TJ = 30 C TJ = 20 C TJ = 0 C TJ = 00 C TJ = 90 C TJ = 80 C TIME, YEAR Figure 4. Failure Rae vs. Time Juncion Temperaure 3

4 MC74HC257 DC CHARACTERITIC (olages Referenced o GND) CC T A = 25 C T A 85 C 55 C T A 25 C ymbol Parameer Condiion () Min Typ Max Min Max Min Max Uni IH Minimum High Level Inpu olage IL OH Maximum Low Level Inpu olage Maximum High Level Oupu olage IN = IH or IL I OH = 50 A o 5.5 o 5.5 CCX CCX 0.3 CCX CCX 0.5 CCX 0.3 CCX CCX 0.3 IN = IH or IL I OH = 4 ma I OH = 8 ma OL Maximum Low Level Oupu olage IN = IH or IL I OL = 50 A IN = IH or IL I OH = 4 ma I OH = 8 ma I IN Inpu Leakage Curren IN = 5.5 or GND 0 o 5.5 I OZ I CC Maximum 3 ae Leakage Curren Maximum Quiescen upply Curren (per package) IN = IH or IL OUT = CC or GND ± ±.0 ±.0 A 5.5 ±0.25 ±2.5 ±2.5 A IN = CC or GND A Î AC ELECTRICAL CHARACTERITIC (Inpu r = f = ns) T Î A = 25 C T Î A = 85 C 55 C T A 25 C ymbol Parameer Tes Condiions Min Typ Max Min Max Min Max Î Uni PLH, Maximum Propagaion PHL Î Delay Î CC = 3.3 ± 0.3 C L = 5 pf C L = 50 pf Î Î.0.0Î Î.0.0 ns.0 A or B o Y Î CC = 5.0 ± 0.5 C L = 5 pf C L = 50 pf Î Î Î PLH, Maximum Propagaion PHL Î CC = 3.3 ± 0.3 C L = 5 pf Delay 7.0 Î.0 Î.0Î Î.0 ns C L = 50 pf o Y Î CC = 5.0 ± 0.5 C L Î = 5 pf C L = 50 pf Î Î Î Î Î PZL, Î Maximum Oupu Enable Î CC = 3.3 ± 0.3 C L = 5 pf 6.7 Î 0.5 Î.0Î 2.5 Î ns PZH Time R Î L = k C L = 50 pf OE o Y Î Î Î CC = 5.0 ± 0.5 C L = 5 pf R L = k C L = 50 pf Î Î 8.0.0Î 0.0 Î PLZ, Î Maximum Oupu Disable Î CC = 3.3 ± 0.3 C L = 50 pf Î 5.0Î.0Î 6.0 Î ns PHZ Time R Î L = k OE o Y CC = 5.0 ± 0.5 C L = 50 pf R L = k 5.7 Î Î Î Î Î C IN Î Maximum Inpu Î Capaciance Î Î Î Î 4 Î 0 Î Î 0 Î Î Î 0 pf 25 C, CC = 5.0 C PD Power Dissipaion Capaciance (Noe 5) 20 pf 5. C PD is defined as he value of he inernal equivalen capaciance which is calculaed from he operaing curren consumpion wihou load. Average operaing curren can be obained by he equaion: I CC(OPR) = C PD CC f in + I CC. C PD is used o deermine he no load dynamic power consumpion; P D = C PD 2 CC f in + I CC CC. 4

5 MC74HC257 NOIE CHARACTERITIC (Inpu r = f = ns, C L = 50 pf, CC = 5.0 ) T A = 25 C ymbol Characerisic Typ Max Uni OLP Quie Oupu Maximum Dynamic OL OL Quie Oupu Minimum Dynamic OL IHD Minimum High Level Dynamic Inpu olage 3.5 ILD Maximum Low Level Dynamic Inpu olage.5 CC OE 50% CC GND A, B or 50% PLH PHL GND Y PZL 50% CC PLZ HIGH IMPEDANCE OL Y 50% CC Y PZH 50% CC PHZ OH HIGH IMPEDANCE Figure 5. wiching Waveform Figure 6. wiching Waveform DEICE UNDER TET OUTPUT TET POINT C L * DEICE UNDER TET TET POINT kω OUTPUT C L * CONNECT TO CC WHEN TETING PLZ AND PZL. CONNECT TO GND WHEN TETING PHZ AND PZH. *Includes all probe and jig capaciance Figure 7. Tes Circui *Includes all probe and jig capaciance Figure 8. Tes Circui INPUT Figure 9. Inpu Equivalen Circui 5

6 MC74HC257 PACKAGE DIMENION OIC 6 CAE 75B 05 IUE K A B P 8 PL 0.25 (0.00) M B NOTE:. DIMENIONING AND TOLERANCING PER ANI YM, CONTROLLING DIMENION: MILLIMETER. 3. DIMENION A AND B DO NOT INCLUDE MOLD PROTRUION. 4. MAXIMUM MOLD PROTRUION 5 (0.006) PER IDE. 5. DIMENION D DOE NOT INCLUDE DAMBAR PROTRUION. ALLOWABLE DAMBAR PROTRUION HALL BE 27 (0.005) TOTAL IN EXCE OF THE D DIMENION AT MAXIMUM MATERIAL CONDITION. T EATING PLANE G D 6 PL K C M R X 45 J F MILLIMETER INCHE DIM MIN MAX MIN MAX A B C D F G.27 BC BC J K M P R (0.00) M T B A OLDERING FOOTPRINT 8X X.2 6 6X PITCH 8 9 DIMENION: MILLIMETER 6

7 MC74HC257 PACKAGE DIMENION 5 (0.006) T 5 (0.006) T 0 (0.004) T EATING PLANE L U PIN IDENT. U D 2X L/2 C 6X K REF 0 (0.004) M T U A G B U H TOP 6 CAE 948F IUE B J N N J F DETAIL E DETAIL E K K ÇÇÇ ÉÉÉ ECTION N N 0.25 (0.00) M OLDERING FOOTPRINT 7.06 W NOTE:. DIMENIONING AND TOLERANCING PER ANI YM, CONTROLLING DIMENION: MILLIMETER. 3. DIMENION A DOE NOT INCLUDE MOLD FLAH. PROTRUION OR GATE BURR. MOLD FLAH OR GATE BURR HALL NOT EXCEED 5 (0.006) PER IDE. 4. DIMENION B DOE NOT INCLUDE INTERLEAD FLAH OR PROTRUION. INTERLEAD FLAH OR PROTRUION HALL NOT EXCEED 0.25 (0.00) PER IDE. 5. DIMENION K DOE NOT INCLUDE DAMBAR PROTRUION. ALLOWABLE DAMBAR PROTRUION HALL BE 0.08 (0.003) TOTAL IN EXCE OF THE K DIMENION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBER ARE HOWN FOR REFERENCE ONLY. 7. DIMENION A AND B ARE TO BE DETERMINED AT DATUM PLANE W. MILLIMETER INCHE DIM MIN MAX MIN MAX A B C D F G 0.65 BC BC H J J K K L 6.40 BC BC M PITCH 6X X.26 DIMENION: MILLIMETER ON emiconducor and he are regisered rademarks of emiconducor Componens Indusries, LLC (CILLC) or is subsidiaries in he Unied aes and/or oher counries. CILLC owns he righs o a number of paens, rademarks, copyrighs, rade secres, and oher inellecual propery. A lising of CILLC s produc/paen coverage may be accessed a Marking.pdf. CILLC reserves he righ o make changes wihou furher noice o any producs herein. CILLC makes no warrany, represenaion or guaranee regarding he suiabiliy of is producs for any paricular purpose, nor does CILLC assume any liabiliy arising ou of he applicaion or use of any produc or circui, and specifically disclaims any and all liabiliy, including wihou limiaion special, consequenial or incidenal damages. Typical parameers which may be provided in CILLC daa shees and/or specificaions can and do vary in differen applicaions and acual performance may vary over ime. All operaing parameers, including Typicals mus be validaed for each cusomer applicaion by cusomer s echnical expers. CILLC does no convey any license under is paen righs nor he righs of ohers. CILLC producs are no designed, inended, or auhorized for use as componens in sysems inended for surgical implan ino he body, or oher applicaions inended o suppor or susain life, or for any oher applicaion in which he failure of he CILLC produc could creae a siuaion where personal injury or deah may occur. hould Buyer purchase or use CILLC producs for any such uninended or unauhorized applicaion, Buyer shall indemnify and hold CILLC and is officers, employees, subsidiaries, affiliaes, and disribuors harmless agains all claims, coss, damages, and expenses, and reasonable aorney fees arising ou of, direcly or indirecly, any claim of personal injury or deah associaed wih such uninended or unauhorized use, even if such claim alleges ha CILLC was negligen regarding he design or manufacure of he par. CILLC is an Equal Opporuniy/Affirmaive Acion Employer. This lieraure is subjec o all applicable copyrigh laws and is no for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Lieraure Disribuion Cener for ON emiconducor P.O. Box 563, Denver, Colorado 8027 UA Phone: or Toll Free UA/Canada Fax: or Toll Free UA/Canada orderli@onsemi.com N. American Technical uppor: Toll Free UA/Canada Europe, Middle Eas and Africa Technical uppor: Phone: Japan Cusomer Focus Cener Phone: ON emiconducor Websie: Order Lieraure: hp:// For addiional informaion, please conac your local ales Represenaive MC74HC257/D

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