MC74HC390. Dual 4 Stage Binary Ripple Counter with 2 and 5 Sections. High Performance Silicon Gate CMOS
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1 Dual 4Sage Binary Ripple ouner wih 2 and 5 Secions HighPerformance Siliconae OS The 54/74H30 is idenical in pinou o he LS30. The device inpus are compaible wih sandard OS oupus; wih pullup resisors, hey are compaible wih LSTTL oupus. This device consiss of wo independen 4bi couners, each composed of a dividebywo and a dividebyfive secion. The dividebywo and dividebyfive couners have separae clock inpus, and can be cascaded o implemen various combinaions of 2 and/or 5 up o a 100 couner. lipflops inernal o he couners are riggered by higholow ransiions of he clock inpu. A separae, asynchronous rese is provided for each 4bi couner. Sae changes of he Q oupus do no occur simulaneously because of inernal ripple delays. Therefore, decoded oupu signals are subjec o decoding spikes and should no be used as clocks or srobes excep when gaed wih he lock of he H30. Oupu Drive apabiliy: 10 LSTTL Loads Oupus Direcly Inerface o OS, NOS, and TTL Operaing olage Range: 2 o 6 Low Inpu urren: 1 μa High Noise Immuniy haracerisic of OS Devices In ompliance wih he Requiremens Defined by EDE Sandard No 7A hip omplexiy: 244 ETs or 61 Equivalen aes LO A LOI DIARA 1, 15 2 OUNTER 3, N SUIX PLASTI PAAE ASE D SUIX SOI PAAE ASE 751B05 ORDERIN INORATION 54HXXX 74HXXXN 74HXXXD LO A a a SUIX ERAI PAAE ASE eramic Plasic SOI PIN ASSINENT a LO B a a Q a a ND LO A b b b LO B b b Q b b LO B 4, 12 2, 14 5 OUNTER PIN = PIN 8 = ND 5, 11 6, 10 Q 7, UNTION TABLE lock A B Rese Acion X X H Rese 2 and 5 X L Incremen 2 X L Incremen 5 Semiconducor omponens Indusries, LL, 2006 une, 2006 Rev. 7 1 Publicaion Order Number: 74H30/D
2 AXIU RATINS* SymbolÎÎ Parameer Î alue Uni ÎÎ D Supply olage (Referenced o ND) Î 0.5 o in ÎÎ D Inpu olage (Referenced o ND) Î 1.5 o ou D Oupu olage (Referenced o ND) 0.5 o ÎÎ I in D Inpu urren, per Pin ± 20 ma I ou D Oupu urren, per Pin ± 25 ma I D Supply urren, and ND Pins ± 50 ma P D Power Dissipaion in Sill Air,Plasic or eramic DIP 750 ÎÎ SOI Package Î 500 mw T sg ÎÎ Sorage Temperaure Î 65 o T L ÎÎ Lead Temperaure, 1 mm from ase for 10 Seconds Î (Plasic or SOI DIP) Î 260 (eramic DIP) *aximum Raings are hose values beyond which damage o he device may occur. uncional operaion should be resriced o he Recommended Operaing ondiions. Deraing Plasic DIP: 10 mw/ from 65 o 125 eramic DIP: 10 mw/ from 100 o 125 SOI Package: 7 mw/ from 65 o 125 or high frequency or heavy load consideraions, see haper 2 of he oorola HighSpeed OS Daa Book (DL12/D). REOENDED OPERATIN ONDITIONS ÎÎ Symbol Parameer in ÎÎ ax Uni D Supply olage (Referenced o ND) 2.0 ÎÎ 6.0 in, ou ÎÎ ÎÎ D Inpu olage, Oupu olage (Referenced o ND) 0 T A Operaing Temperaure, All Package Types 55 ÎÎ r, f Inpu Rise and all Time ÎÎ = 2.0 ÎÎ (igure 1) = 4.5 ÎÎ 0 0 ÎÎ ns = 6.0 D ELETRIAL HARATERISTIS (olages Referenced o ND) uaraneed Limi 55 oî Symbol Parameer Tes ondiions Uni ÎÎ IH inimum HighLevel Inpu ÎÎ olage Î ou = 0.1 or I ou 20 μa IL ÎÎ aximum LowLevel Inpu Î ou = 0.1 or olage I ÎÎ ou 20 μa OH ÎÎ inimum HighLevel Oupu Î in = IH or IL olage I Î ou 20 μa ÎÎ Î in = IH or IL I ou 4.0 ma Î I ou 5.2 ma OL ÎÎ aximum LowLevel Oupu Î in = IH or IL olage I Î ou 20 μa Î in = IH or IL I ou 4.0 maîî Î I ou 5.2 ma I in ÎÎ aximum Inpu Leakage urren Î in = or ND 6.0 ± 0.1 ± 1.0 ± 1.0 μa I ÎÎ aximum Quiescen Supply Î in = or ND ÎÎ μa urren (per Package) I ou = 0 μa This device conains proecion circuiry o guard agains damage due o high saic volages or elecric fields. However, precauions mus be aken o avoid applicaions of any volage higher han maximum raed volages o his highimpedance circui. or proper operaion, in and ou should be consrained o he range ND ( in or ou ). Unused inpus mus always be ied o an appropriae logic volage level (e.g., eiher ND or ). Unused oupus mus be lef open. NOTE: Informaion on ypical parameric values can be found in haper 2 of he oorola HighSpeed OS Daa Book (DL12/D). 2
3 A ELETRIAL HARATERISTIS ( L = 50 p, Inpu f = f = 6 ns) uaraneed Limi Symbol Parameer 55 oî Uni ÎÎ f Î max aximum lock requency ( Duy ycle) Hz ÎÎ (igures 1 and 3) Î PLH, Î aximum Propagaion Delay, lock A o QA ns Î PHL (igures 1 and 3) ÎÎ Î PLH ÎÎ, aximum Propagaion Delay, lock A o Q Î PHL Î (QA conneced o lock B) ns (igures 1 and 3) ÎÎ Î PLH, aximum Propagaion Delay, lock B o QB ns PHL Î (igures 1 and 3) Î PLH, Î aximum Propagaion Delay, lock B o Q ns Î PHL (igures 1 and 3) Î PLH, Î aximum Propagaion Delay, lock B o QD ÎÎ Î PHL Î (igures 1 and 3) ns ÎÎ Î PHL aximum Propagaion Delay, Rese o any Q ns Î (igures 2 and 3) Î TLH, Î aximum Oupu Transiion Time, Any Oupu ns Î THL (igures 1 and 3) Î aximum Inpu apaciance p in NOTES: 1. or propagaion delays wih loads oher han 50 p, see haper 2 of he oorola HighSpeed OS Daa Book (DL12/D). 2. Informaion on ypical parameric values can be found in haper 2 of he oorola HighSpeed OS Daa Book (DL12/D). PD Power Dissipaion apaciance (Per ouner)* 25, = 5.0 * Used o deermine he noload dynamic power consumpion: P D = PD 2 f + I. or load consideraions, see haper 2 of he oorola HighSpeed OS Daa Book (DL12/D). 35 p TIIN REQUIREENTS (Inpu r = f = 6 ns) uaraneed Limi 55 o ÎÎ Symbol Parameer Uni ÎÎ Î rec inimum Recovery Time, Rese Inacive o lock A or lock B ns Î (igure 2) Î w Î inimum Pulse Widh, lock A, lock B ns (igure 1) Î w Î inimum Pulse Widh, Rese ÎÎ Î (igure 2) ns ÎÎ Î f, f aximum Inpu Rise and all Times ns Î (igure 1) NOTE: Informaion on ypical parameric values can be found in haper 2 of he oorola HighSpeed OS Daa Book (DL12/D). 3
4 PIN DESRIPTIONS INPUTS lock A (Pins 1, 15) and lock B (Pins 4, 15) lock A is he clock inpu o he 2 couner; lock B is he clock inpu o he 5 couner. The inernal flipflops are oggled by higholow ransiions of he clock inpu. ONTROL INPUTS Rese (Pins 2, 14) Asynchronous rese. A high a he Rese inpu prevens couning, reses he inernal flipflops, and forces hrough low. OUTPUTS (Pins 3, 13) Oupu of he 2 couner., Q, (Pins 5, 6, 7,, 10, 11) Oupus of he 5 couner. is he mos significan bi. is he leas significan bi when he couner is conneced for BD oupu as in igure 4. is he leas significan bi when he couner is operaing in he biquinary mode as in igure 5. SWITHIN WAEORS LO 10% f 0% 10% w 1/f max r ND PHL w ND Q PLH PHL Q 10% 0% TLH THL LO rec ND igure 1. igure 2. TEST IRUIT TEST POINT DEIE UNDER TEST OUTPUT L * *Includes all probe and jig capaciance igure 3. 4
5 EXPANDED LOI DIARA LO A 1, 15 Q D Q R 3, 13 LO B 4, 12 Q D Q R 5, 11 Q D Q R 6, 10 Q D Q R 7, 2, 14 TIIN DIARA ( onneced o lock B) LO A Q 5
6 APPLIATIONS INORATION Each half of he 54/74H30 has independen 2 and 5 secions (excep for he Rese funcion). The 2 and 5 couners can be conneced o give BD or biquinary (25) coun sequences. If Oupu is conneced o he lock B inpu (igure 4), a decade divider wih BD oupu is obained. The funcion able for he BD coun sequence is given in Table 1. To obain a biquinary coun sequence, he inpu signals conneced o he lock B inpu, and oupu is conneced o he lock A inpu (igure 5). provides a duy cycle oupu. The biquinary coun sequence funcion able is given in Table 2. oun 1. BD oun Sequence* Oupu Q 0 L L L L 1 L L L H 2 L L H L 3 L L H H 4 L H L L 5 L H L H 6 L H H L 7 L H H H 8 H L L L H L L H * conneced o lock B inpu. 6
7 oun 2. BiQuinary oun Sequence** Oupu Q 0 L L L L 1 L L L H 2 L L H L 3 L L H H 4 L H L L 8 H L L L H L L H 10 H L H L 11 H L H H 12 H H L L ** conneced o lock A inpu. ONNETION DIARAS LO A 1, 15 3, 13 1, LO A OUNTER OUNTER 3, 13 LO B 4, 12 5 OUNTER 5, 11 6, 10 7, Q LO B 4, 12 5 OUNTER 5, 11 6, 10 7, Q 2, 14 2, 14 igure 4. BD oun igure 5. Bi-Quinary oun 7
8 OUTLINE DIENSIONS A 1 8 B SUIX ERAI PAAE ASE ISSUE L NOTES: 1. DIENSIONIN AND TOLERANIN PER ANSI Y14.5, ONTROLLIN DIENSION: INH. 3. DIENSION L TO ENTER O LEAD WHEN ORED PARALLEL. 4. DI AY NARROW TO 0.76 (0.030) WHERE THE LEAD ENTERS THE ERAI BODY. T SEATIN PLANE E N D PL 0.25 (0.010) T A S PL 0.25 (0.010) T B S DI A B D E L N INHES IN AX BS BS BS ILLIETERS IN AX BS BS BS A 1 8 H S B T SEATIN PLANE D PL 0.25 (0.010) T A N SUIX PLASTI PAAE ASE ISSUE R L NOTES: 1. DIENSIONIN AND TOLERANIN PER ANSI Y14.5, ONTROLLIN DIENSION: INH. 3. DIENSION L TO ENTER O LEADS WHEN ORED PARALLEL. 4. DIENSION B DOES NOT INLUDE OLD LASH. 5. ROUNDED ORNERS OPTIONAL. DI A B D H L S INHES IN AX BS BS ILLIETERS IN AX BS 1.27 BS T SEATIN PLANE 1 8 A D PL B 0.25 (0.010) T B S A S D SUIX PLASTI SOI PAAE ASE 751B05 ISSUE P 8 PL 0.25 (0.010) B R X 45 NOTES: 1. DIENSIONIN AND TOLERANIN PER ANSI Y14.5, ONTROLLIN DIENSION: ILLIETER. 3. DIENSIONS A AND B DO NOT INLUDE OLD PROTRUSION. 4. AXIU OLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIENSION D DOES NOT INLUDE DABAR PROTRUSION. ALLOWABLE DABAR PROTRUSION SHALL BE (0.005) TOTAL IN EXESS O THE D DIENSION AT AXIU ATERIAL ONDITION. DI A B D P R ILLIETERS IN AX INHES IN AX BS BS
9 ON Semiconducor and are regisered rademarks of Semiconducor omponens Indusries, LL (SILL). SILL reserves he righ o make changes wihou furher noice o any producs herein. SILL makes no warrany, represenaion or guaranee regarding he suiabiliy of is producs for any paricular purpose, nor does SILL assume any liabiliy arising ou of he applicaion or use of any produc or circui, and specifically disclaims any and all liabiliy, including wihou limiaion special, consequenial or incidenal damages. Typical parameers which may be provided in SILL daa shees and/or specificaions can and do vary in differen applicaions and acual performance may vary over ime. All operaing parameers, including Typicals mus be validaed for each cusomer applicaion by cusomer s echnical expers. SILL does no convey any license under is paen righs nor he righs of ohers. SILL producs are no designed, inended, or auhorized for use as componens in sysems inended for surgical implan ino he body, or oher applicaions inended o suppor or susain life, or for any oher applicaion in which he failure of he SILL produc could creae a siuaion where personal injury or deah may occur. Should Buyer purchase or use SILL producs for any such uninended or unauhorized applicaion, Buyer shall indemnify and hold SILL and is officers, employees, subsidiaries, affiliaes, and disribuors harmless agains all claims, coss, damages, and expenses, and reasonable aorney fees arising ou of, direcly or indirecly, any claim of personal injury or deah associaed wih such uninended or unauhorized use, even if such claim alleges ha SILL was negligen regarding he design or manufacure of he par. SILL is an Equal Opporuniy/Affirmaive Acion Employer. This lieraure is subjec o all applicable copyrigh laws and is no for resale in any manner. PUBLIATION ORDERIN INORATION LITERATURE ULILLENT: Lieraure Disribuion ener for ON Semiconducor P.O. Box 53, Denver, olorado USA Phone: or Toll ree USA/anada ax: or Toll ree USA/anada orderli@onsemi.com N. American Technical Suppor: Toll ree USA/anada Europe, iddle Eas and Africa Technical Suppor: Phone: apan usomer ocus ener Phone: ON Semiconducor Websie: Order Lieraure: hp:// or addiional informaion, please conac your local Sales Represenaive 74H30/D
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