Dual 4-Input AND Gate
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1 TENIAL DATA Dual 4-Input AND ate The is high-speed Si-gate MOS device and is pin compatible with low power Schottky TTL (LSTTL). The device provide the Dual 4-input AND function. Outputs Directly Interface to MOS, NMOS, and TTL Operating oltage Range: to Low Input urrent:. µa igh Noise Immunity haracteristic of MOS Devices ORDERIN INFORMATION N Plastic D SOI T A = -55 to 25 for all packages LOI DIARAM A PIN ASSINMENT B Y A B D2 2 D 5 B2 A2 Y ND 6 9 A2 Y2 B2 Y2 2 FUNTION TABLE D2 PIN 4 = PIN = ND Inputs Output A B С D Y L X X X L X L X X L X X L X L X X X L L X = don t care
2 MAXIMUM RATINS* Symbol Parameter alue Unit D Supply oltage (Referenced to ND) -.5 to +. IN D Input oltage (Referenced to ND) -.5 to +.5 OUT D Output oltage (Referenced to ND) -.5 to +.5 I IN D Input urrent, per Pin ±2 ma I OUT D Output urrent, per Pin ±25 ma I D Supply urrent, and ND Pins ±5 ma P D Power Dissipation in Still Air, Plastic DIP** SOI Package** Tstg Storage Temperature -65 to +5 T L Lead Temperature, mm from ase for Seconds (Plastic DIP or SOI Package) *Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recommended Operating onditions. **Derating - Plastic DIP: - mw/ from 65 to 25 SOI Package: : - mw/ from 65 to mw 26 REOMMENDED OPERATIN ONDITIONS Symbol Parameter Min Max Unit D Supply oltage (Referenced to ND) IN, OUT D Input oltage, Output oltage (Referenced to ND) T A Operating Temperature, All Package Types t r, t f Input Rise and Fall Time (Figure ) =2. = = ns This device contains protection circuitry to guard against damage due to high static voltages or electric fields. owever, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance circuit. For proper operation, IN and OUT should be constrained to the range ND ( IN or OUT ). Unused inputs must always be tied to an appropriate logic voltage level (e.g., either ND or ). Unused outputs must be left open.
3 D ELETRIAL ARATERISTIS (oltages Referenced to ND) Symbol Parameter Test onditions uaranteed Limit Unit 25 to I Minimum igh-level Input oltage IL Maximum Low -Level Input oltage O OL I IL I I I I T Minimum igh-level Output oltage Maximum Low-Level Output oltage Maximum Low-Level Input Leakage urrent Maximum igh-level Input Leakage urrent Maximum Quiescent Supply urrent (per Package) Maximum Additional Quiescent Supply urrent on input pin IN = I or IL I OUT = - 5 µa IN = I or IL I OUT = - 4. ma IN = I or IL I OUT = 5 µa IN = I or IL I OUT = 4. ma IN = µa IN =... µa IN = or I OUT = µa IN =3.4 any one input, IN = or others inputs µa mа
4 A ELETRIAL ARATERISTIS ( L =5pF,Input t r =t f =6. ns) Symbol Parameter 25 to -55 uaranteed Limit 5 25 Unit t PL, t PL Maximum Propagation Delay (Figure ) ns t TL, t TL Maximum Output Transition Time (Figure ) ns IN Maximum Input apacitance 5. pf PD Power Dissipation apacitance (Per ate) Used to determine the no-load dynamic power consumption: P D = PD 2 f+i T A =25, =5. 5 pf t L t L Input I ND t PL t PL Output O t TL t TL =.3 = 3. I Figure. Switching Waveforms PULSE ENERATOR I R T DEIE UNDER TEST O L 5 pf Termination resistance R T should be equal to Z OUT of pulse generators Figure 2. Test ircuit
5 N SUFFIX PLASTI DIP (MS - AA) NOTES: 4 A F.25 (.) M T. Dimensions A, B do not include mold flash or protrusions. Maximum mold flash or protrusions.25 mm (.) per side. D N B -T- SEATIN 5.2 PLANE K D M J F J.25 (.) M T M NOTES: K..25. Dimensions A and B do not include mold flash or protrusion. M Maximum mold flash or protrusion.5 mm (.6) per side P for A; for B.25 mm (.) per side. R T- K SEATIN PLANE M L J Dimension, mm Symbol MIN MAX A B D F J K L M.2.36 N.3 D SUFFIX SOI (MS - 2AB) 4 A B P Symbol MIN MAX A.55.5 B D.33.5 F.4.2 R x 45 Dimension, mm.2
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