Last Lecture. Power Dissipation CMOS Scaling. EECS 141 S02 Lecture 8

Size: px
Start display at page:

Download "Last Lecture. Power Dissipation CMOS Scaling. EECS 141 S02 Lecture 8"

Transcription

1 EECS 141 S02 Lecture 8 Power Dissipation CMOS Scaling Last Lecture CMOS Inverter loading Switching Performance Evaluation Design optimization Inverter Sizing 1

2 Today CMOS Inverter power dissipation» Dynamic» Short-Circuit» Leakage Scaling CMOS into the future Power Dissipation 2

3 Where Does Power Go in CMOS? Dynamic Power Consumption Charging and Discharging Capacitors Short Circuit Currents Short Circuit Path between Supply Rails during Switching Leakage Leaking diodes and transistors Dynamic Power Dissipation Vdd Vin Vout C L Energy/transition = C L * V dd 2 Power = Energy/transition * f = C L * V dd 2 * f Not a function of transistor sizes! Need to reduce C L, V dd, and f to reduce power. 3

4 Modification for Circuits with Reduced Swing V dd V dd V dd -V t C L E 0 1 = C L V dd ( V dd V t ) Can exploit reduced swing to lower power (e.g., reduced bit-line swing in memory) Adiabatic Charging

5 Adiabatic Charging Node Transition Activity and Power Consider switching a CMOS gate for N clock cycles E N = C L V 2 dd nn ( ) E N : the energy consumed for N clock cycles n(n): the number of 0->1 transition in N clock cycles P avg = lim N E N f N clk = nn ( ) lim C V N N dd fclk L α 0 1 = nn ( ) lim N N P avg = α 0 1 C L V 2 fclk dd 5

6 Transistor Sizing for Minimum Energy In Out C g1 1 f C ext Goal: Minimize Energy of whole circuit» Design parameters: f and V DD» tp tpref of circuit with f=1 and V DD =V ref t t p p0 f = t p γ VDD V V DD TE F fγ Transistor Sizing (2) Performance Constraint (γ=1) t t p pref t = t p0 p0ref 2 + f + F f V = ( 3+ F ) V V V ( 3+ F ) Energy for single Transition E = V E E ref 2 DD C V = V g1 DD ref V 2 + f + = 1 DD ref V ref DD TE TE [( 1+ γ )( 1+ f ) + F ] f + F 4 + F F f 6

7 Transistor Sizing (3) V DD =f(f) E/E ref =f(f) vdd (V) F= normalized energy f f Short Circuit Currents Vdd Vin Vout C L 0.15 IVDD (ma) V in (V)

8 How to keep Short-Circuit Currents Down? Short circuit current goes to zero if t fall >> t rise, but can t do this for cascade logic, so... Minimizing Short-Circuit Power Vdd =3.3 P norm 5 4 Vdd = Vdd = t sin /t sout 8

9 Leakage Vdd Vout Drain Junction Leakage Sub-Threshold Current Sub-threshold current one of most compelling issues in low-energy circuit design! Reverse-Biased Diode Leakage GATE p + p+ N + - V dd Reverse Leakage Current I DL = J S A JS = pa/µm2 at 25 deg C for 0.25µm CMOS JS doubles for every 9 deg C! 9

10 Subthreshold Leakage Component Static Power Consumption Vdd I stat V out V in =5V C L P stat = P (In=1).V dd. I stat Wasted energy Should be avoided in most cases, but could help reducing energy in others (e.g. sense amps) 10

11 Principles for Power Reduction Prime choice: Reduce voltage!» Recent years have seen an acceleration in supply voltage reduction» Design at very low voltages still open question ( V by 2010!) Reduce switching activity Reduce physical capacitance» Device Sizing: for F=20 f opt (energy)=3.53, f opt (performance)=4.47 Impact of Technology Scaling 11

12 Goals of Technology Scaling Make things cheaper:» Want to sell more functions (transistors) per chip for the same money» Build same products cheaper, sell the same part for less money» Price of a transistor has to be reduced But also want to be faster, smaller, lower power Technology Scaling Goals of scaling the dimensions by 30%:» Reduce gate delay by 30% (increase operating frequency by 43%)» Double transistor density» Reduce energy per transition by 65% (50% power 43% increase in frequency Die size used to increase by 14% per generation Technology generation spans 2-3 years 12

13 Technology Evolution (2000 data) International Technology Roadmap for Semiconductors Year of Introduction Technology node [nm] Supply [V] Wiring levels Max frequency [GHz],Local-Global Max µp power [W] Bat. power [W] Node years: 2007/65nm, 2010/45nm, 2013/33nm, 2016/23nm Technology Evolution (1999) 13

14 ITRS Technology Roadmap Acceleration Continues Technology Scaling (1) Minimum Feature Size (micron) Year Minimum Feature Size 14

15 Technology Scaling (2) Number of components per chip Technology Scaling (3) t p decreases by 13%/year 50% every 5 years! Propagation Delay 15

16 Technology Scaling (4) 100 x1.4 / 3 years 1000 κ 0.7 Power Dissipation (W) x4 / 3 years 85 (a) Power dissipation vs. year. 90 Year MPU DSP 95 Power Density (mw/mm 2 ) κ Scaling Factor κ i normalized by 4µm design rule j (b) Power density vs. scaling factor. 10 From Kuroda Technology Scaling Models Full Scaling (Constant Electrical Field) ideal model dimensions and voltage scale together by the same factor S Fixed Voltage Scaling most common model until recently only dimensions scale, voltages remain constant General Scaling most realistic for todays situation voltages and dimensions scale with different factors 16

17 Scaling Relationships for Long Channel Devices Transistor Scaling (velocity-saturated devices) 17

18 µprocessor Scaling P.Gelsinger: µprocessors for the New Millenium, ISSCC 2001 µprocessor Power P.Gelsinger: µprocessors for the New Millenium, ISSCC

19 µprocessor Performance P.Gelsinger: µprocessors for the New Millenium, ISSCC Outlook Performance 2X/16 months» 1 TIP (terra instructions/s)» 30 GHz clock Size» No of transistors: 2 Billion» Die: 40*40 mm Power» 10kW!!» Leakage: 1/3 active Power P.Gelsinger: µprocessors for the New Millenium, ISSCC

20 Some interesting questions What will cause this model to break? When will it break? Will the model gradually slow down?» Power and power density» Leakage» Process Variation 20

Where Does Power Go in CMOS?

Where Does Power Go in CMOS? Power Dissipation Where Does Power Go in CMOS? Dynamic Power Consumption Charging and Discharging Capacitors Short Circuit Currents Short Circuit Path between Supply Rails during Switching Leakage Leaking

More information

Digital Integrated Circuits 2nd Inverter

Digital Integrated Circuits 2nd Inverter Digital Integrated Circuits The Inverter The CMOS Inverter V DD Analysis Inverter complex gate Cost V in V out complexity & Area Integrity and robustness C L Static behavior Performance Dynamic response

More information

Power Dissipation. Where Does Power Go in CMOS?

Power Dissipation. Where Does Power Go in CMOS? Power Dissipation [Adapted from Chapter 5 of Digital Integrated Circuits, 2003, J. Rabaey et al.] Where Does Power Go in CMOS? Dynamic Power Consumption Charging and Discharging Capacitors Short Circuit

More information

Announcements. EE141- Fall 2002 Lecture 7. MOS Capacitances Inverter Delay Power

Announcements. EE141- Fall 2002 Lecture 7. MOS Capacitances Inverter Delay Power - Fall 2002 Lecture 7 MOS Capacitances Inverter Delay Power Announcements Wednesday 12-3pm lab cancelled Lab 4 this week Homework 2 due today at 5pm Homework 3 posted tonight Today s lecture MOS capacitances

More information

Announcements. EE141- Spring 2003 Lecture 8. Power Inverter Chain

Announcements. EE141- Spring 2003 Lecture 8. Power Inverter Chain - Spring 2003 Lecture 8 Power Inverter Chain Announcements Homework 3 due today. Homework 4 will be posted later today. Special office hours from :30-3pm at BWRC (in lieu of Tuesday) Today s lecture Power

More information

EE 466/586 VLSI Design. Partha Pande School of EECS Washington State University

EE 466/586 VLSI Design. Partha Pande School of EECS Washington State University EE 466/586 VLSI Design Partha Pande School of EECS Washington State University pande@eecs.wsu.edu Lecture 8 Power Dissipation in CMOS Gates Power in CMOS gates Dynamic Power Capacitance switching Crowbar

More information

EE115C Winter 2017 Digital Electronic Circuits. Lecture 6: Power Consumption

EE115C Winter 2017 Digital Electronic Circuits. Lecture 6: Power Consumption EE115C Winter 2017 Digital Electronic Circuits Lecture 6: Power Consumption Four Key Design Metrics for Digital ICs Cost of ICs Reliability Speed Power EE115C Winter 2017 2 Power and Energy Challenges

More information

Chapter 5. The Inverter. V1. April 10, 03 V1.1 April 25, 03 V2.1 Nov Inverter

Chapter 5. The Inverter. V1. April 10, 03 V1.1 April 25, 03 V2.1 Nov Inverter Chapter 5 The Inverter V1. April 10, 03 V1.1 April 25, 03 V2.1 Nov.12 03 Objective of This Chapter Use Inverter to know basic CMOS Circuits Operations Watch for performance Index such as Speed (Delay calculation)

More information

Integrated Circuits & Systems

Integrated Circuits & Systems Federal University of Santa Catarina Center for Technology Computer Science & Electronics Engineering Integrated Circuits & Systems INE 5442 Lecture 14 The CMOS Inverter: dynamic behavior (sizing, inverter

More information

Dynamic operation 20

Dynamic operation 20 Dynamic operation 20 A simple model for the propagation delay Symmetric inverter (rise and fall delays are identical) otal capacitance is linear t p Minimum length devices R W C L t = 0.69R C = p W L 0.69

More information

Objective and Outline. Acknowledgement. Objective: Power Components. Outline: 1) Acknowledgements. Section 4: Power Components

Objective and Outline. Acknowledgement. Objective: Power Components. Outline: 1) Acknowledgements. Section 4: Power Components Objective: Power Components Outline: 1) Acknowledgements 2) Objective and Outline 1 Acknowledgement This lecture note has been obtained from similar courses all over the world. I wish to thank all the

More information

EE241 - Spring 2000 Advanced Digital Integrated Circuits. Announcements

EE241 - Spring 2000 Advanced Digital Integrated Circuits. Announcements EE241 - Spring 2 Advanced Digital Integrated Circuits Lecture 11 Low Power-Low Energy Circuit Design Announcements Homework #2 due Friday, 3/3 by 5pm Midterm project reports due in two weeks - 3/7 by 5pm

More information

Topic 4. The CMOS Inverter

Topic 4. The CMOS Inverter Topic 4 The CMOS Inverter Peter Cheung Department of Electrical & Electronic Engineering Imperial College London URL: www.ee.ic.ac.uk/pcheung/ E-mail: p.cheung@ic.ac.uk Topic 4-1 Noise in Digital Integrated

More information

EE241 - Spring 2001 Advanced Digital Integrated Circuits

EE241 - Spring 2001 Advanced Digital Integrated Circuits EE241 - Spring 21 Advanced Digital Integrated Circuits Lecture 12 Low Power Design Self-Resetting Logic Signals are pulses, not levels 1 Self-Resetting Logic Sense-Amplifying Logic Matsui, JSSC 12/94 2

More information

THE INVERTER. Inverter

THE INVERTER. Inverter THE INVERTER DIGITAL GATES Fundamental Parameters Functionality Reliability, Robustness Area Performance» Speed (delay)» Power Consumption» Energy Noise in Digital Integrated Circuits v(t) V DD i(t) (a)

More information

EECS 427 Lecture 11: Power and Energy Reading: EECS 427 F09 Lecture Reminders

EECS 427 Lecture 11: Power and Energy Reading: EECS 427 F09 Lecture Reminders EECS 47 Lecture 11: Power and Energy Reading: 5.55 [Adapted from Irwin and Narayanan] 1 Reminders CAD5 is due Wednesday 10/8 You can submit it by Thursday 10/9 at noon Lecture on 11/ will be taught by

More information

Design for Manufacturability and Power Estimation. Physical issues verification (DSM)

Design for Manufacturability and Power Estimation. Physical issues verification (DSM) Design for Manufacturability and Power Estimation Lecture 25 Alessandra Nardi Thanks to Prof. Jan Rabaey and Prof. K. Keutzer Physical issues verification (DSM) Interconnects Signal Integrity P/G integrity

More information

EE141Microelettronica. CMOS Logic

EE141Microelettronica. CMOS Logic Microelettronica CMOS Logic CMOS logic Power consumption in CMOS logic gates Where Does Power Go in CMOS? Dynamic Power Consumption Charging and Discharging Capacitors Short Circuit Currents Short Circuit

More information

Lecture 4: CMOS review & Dynamic Logic

Lecture 4: CMOS review & Dynamic Logic Lecture 4: CMOS review & Dynamic Logic Reading: ch5, ch6 Overview CMOS basics Power and energy in CMOS Dynamic logic 1 CMOS Properties Full rail-to-rail swing high noise margins Logic levels not dependent

More information

Lecture 8-1. Low Power Design

Lecture 8-1. Low Power Design Lecture 8 Konstantinos Masselos Department of Electrical & Electronic Engineering Imperial College London URL: http://cas.ee.ic.ac.uk/~kostas E-mail: k.masselos@ic.ac.uk Lecture 8-1 Based on slides/material

More information

Scaling of MOS Circuits. 4. International Technology Roadmap for Semiconductors (ITRS) 6. Scaling factors for device parameters

Scaling of MOS Circuits. 4. International Technology Roadmap for Semiconductors (ITRS) 6. Scaling factors for device parameters 1 Scaling of MOS Circuits CONTENTS 1. What is scaling?. Why scaling? 3. Figure(s) of Merit (FoM) for scaling 4. International Technology Roadmap for Semiconductors (ITRS) 5. Scaling models 6. Scaling factors

More information

B.Supmonchai July 5th, q Quantification of Design Metrics of an inverter. q Optimization of an inverter design. B.Supmonchai Why CMOS Inverter?

B.Supmonchai July 5th, q Quantification of Design Metrics of an inverter. q Optimization of an inverter design. B.Supmonchai Why CMOS Inverter? July 5th, 4 Goals of This Chapter Quantification of Design Metrics of an inverter Static (or Steady-State) Behavior Chapter 5 CMOS Inverter Boonchuay Supmonchai Integrated Design Application Research (IDAR)

More information

EECS 141: FALL 05 MIDTERM 1

EECS 141: FALL 05 MIDTERM 1 University of California College of Engineering Department of Electrical Engineering and Computer Sciences D. Markovic TuTh 11-1:3 Thursday, October 6, 6:3-8:pm EECS 141: FALL 5 MIDTERM 1 NAME Last SOLUTION

More information

Lecture 6 Power Zhuo Feng. Z. Feng MTU EE4800 CMOS Digital IC Design & Analysis 2010

Lecture 6 Power Zhuo Feng. Z. Feng MTU EE4800 CMOS Digital IC Design & Analysis 2010 EE4800 CMOS Digital IC Design & Analysis Lecture 6 Power Zhuo Feng 6.1 Outline Power and Energy Dynamic Power Static Power 6.2 Power and Energy Power is drawn from a voltage source attached to the V DD

More information

ASIC FPGA Chip hip Design Pow Po e w r e Di ssipation ssipa Mahdi Shabany

ASIC FPGA Chip hip Design Pow Po e w r e Di ssipation ssipa Mahdi Shabany ASIC/FPGA Chip Design Power Di ssipation Mahdi Shabany Department tof Electrical ti lengineering i Sharif University of technology Outline Introduction o Dynamic Power Dissipation Static Power Dissipation

More information

CSE493/593. Designing for Low Power

CSE493/593. Designing for Low Power CSE493/593 Designing for Low Power Mary Jane Irwin [Adapted from Rabaey s Digital Integrated Circuits, 2002, J. Rabaey et al.].1 Why Power Matters Packaging costs Power supply rail design Chip and system

More information

COMP 103. Lecture 16. Dynamic Logic

COMP 103. Lecture 16. Dynamic Logic COMP 03 Lecture 6 Dynamic Logic Reading: 6.3, 6.4 [ll lecture notes are adapted from Mary Jane Irwin, Penn State, which were adapted from Rabaey s Digital Integrated Circuits, 2002, J. Rabaey et al.] COMP03

More information

Lecture 2: CMOS technology. Energy-aware computing

Lecture 2: CMOS technology. Energy-aware computing Energy-Aware Computing Lecture 2: CMOS technology Basic components Transistors Two types: NMOS, PMOS Wires (interconnect) Transistors as switches Gate Drain Source NMOS: When G is @ logic 1 (actually over

More information

EE115C Digital Electronic Circuits Homework #4

EE115C Digital Electronic Circuits Homework #4 EE115 Digital Electronic ircuits Homework #4 Problem 1 Power Dissipation Solution Vdd =1.0V onsider the source follower circuit used to drive a load L =20fF shown above. M1 and M2 are both NMOS transistors

More information

Fig. 1 CMOS Transistor Circuits (a) Inverter Out = NOT In, (b) NOR-gate C = NOT (A or B)

Fig. 1 CMOS Transistor Circuits (a) Inverter Out = NOT In, (b) NOR-gate C = NOT (A or B) 1 Introduction to Transistor-Level Logic Circuits 1 By Prawat Nagvajara At the transistor level of logic circuits, transistors operate as switches with the logic variables controlling the open or closed

More information

! Charge Leakage/Charge Sharing. " Domino Logic Design Considerations. ! Logic Comparisons. ! Memory. " Classification. " ROM Memories.

! Charge Leakage/Charge Sharing.  Domino Logic Design Considerations. ! Logic Comparisons. ! Memory.  Classification.  ROM Memories. ESE 57: Digital Integrated Circuits and VLSI Fundamentals Lec 9: March 9, 8 Memory Overview, Memory Core Cells Today! Charge Leakage/ " Domino Logic Design Considerations! Logic Comparisons! Memory " Classification

More information

Lecture 4: Technology Scaling

Lecture 4: Technology Scaling Digital Integrated Circuits (83-313) Lecture 4: Technology Scaling Semester B, 2016-17 Lecturer: Dr. Adam Teman TAs: Itamar Levi, Robert Giterman 2 April 2017 Disclaimer: This course was prepared, in its

More information

ESE 570: Digital Integrated Circuits and VLSI Fundamentals

ESE 570: Digital Integrated Circuits and VLSI Fundamentals ESE 570: Digital Integrated Circuits and VLSI Fundamentals Lec 19: March 29, 2018 Memory Overview, Memory Core Cells Today! Charge Leakage/Charge Sharing " Domino Logic Design Considerations! Logic Comparisons!

More information

EEC 118 Lecture #5: CMOS Inverter AC Characteristics. Rajeevan Amirtharajah University of California, Davis Jeff Parkhurst Intel Corporation

EEC 118 Lecture #5: CMOS Inverter AC Characteristics. Rajeevan Amirtharajah University of California, Davis Jeff Parkhurst Intel Corporation EEC 8 Lecture #5: CMOS Inverter AC Characteristics Rajeevan Amirtharajah University of California, Davis Jeff Parkhurst Intel Corporation Acknowledgments Slides due to Rajit Manohar from ECE 547 Advanced

More information

Digital Integrated Circuits A Design Perspective

Digital Integrated Circuits A Design Perspective igital Integrated Circuits esign Perspective esigning Combinational Logic Circuits 1 Combinational vs. Sequential Logic In Combinational Logic Circuit Out In Combinational Logic Circuit Out State Combinational

More information

EE5311- Digital IC Design

EE5311- Digital IC Design EE5311- Digital IC Design Module 3 - The Inverter Janakiraman V Assistant Professor Department of Electrical Engineering Indian Institute of Technology Madras Chennai September 3, 2018 Janakiraman, IITM

More information

EECS 141 F01 Lecture 17

EECS 141 F01 Lecture 17 EECS 4 F0 Lecture 7 With major inputs/improvements From Mary-Jane Irwin (Penn State) Dynamic CMOS In static circuits at every point in time (except when switching) the output is connected to either GND

More information

5.0 CMOS Inverter. W.Kucewicz VLSICirciuit Design 1

5.0 CMOS Inverter. W.Kucewicz VLSICirciuit Design 1 5.0 CMOS Inverter W.Kucewicz VLSICirciuit Design 1 Properties Switching Threshold Dynamic Behaviour Capacitance Propagation Delay nmos/pmos Ratio Power Consumption Contents W.Kucewicz VLSICirciuit Design

More information

ESE 570: Digital Integrated Circuits and VLSI Fundamentals

ESE 570: Digital Integrated Circuits and VLSI Fundamentals ESE 570: Digital Integrated Circuits and VLSI Fundamentals Lec 15: March 15, 2018 Euler Paths, Energy Basics and Optimization Midterm! Midterm " Mean: 89.7 " Standard Dev: 8.12 2 Lecture Outline! Euler

More information

Spiral 2 7. Capacitance, Delay and Sizing. Mark Redekopp

Spiral 2 7. Capacitance, Delay and Sizing. Mark Redekopp 2-7.1 Spiral 2 7 Capacitance, Delay and Sizing Mark Redekopp 2-7.2 Learning Outcomes I understand the sources of capacitance in CMOS circuits I understand how delay scales with resistance, capacitance

More information

Midterm. ESE 570: Digital Integrated Circuits and VLSI Fundamentals. Lecture Outline. Pass Transistor Logic. Restore Output.

Midterm. ESE 570: Digital Integrated Circuits and VLSI Fundamentals. Lecture Outline. Pass Transistor Logic. Restore Output. ESE 570: Digital Integrated Circuits and VLSI Fundamentals Lec 16: March 21, 2017 Transmission Gates, Euler Paths, Energy Basics Review Midterm! Midterm " Mean: 79.5 " Standard Dev: 14.5 2 Lecture Outline!

More information

Lecture 15: Scaling & Economics

Lecture 15: Scaling & Economics Lecture 15: Scaling & Economics Outline Scaling Transistors Interconnect Future Challenges Economics 2 Moore s Law Recall that Moore s Law has been driving CMOS [Moore65] Corollary: clock speeds have improved

More information

EE 466/586 VLSI Design. Partha Pande School of EECS Washington State University

EE 466/586 VLSI Design. Partha Pande School of EECS Washington State University EE 466/586 VLSI Design Partha Pande School of EECS Washington State University pande@eecs.wsu.edu Lecture 9 Propagation delay Power and delay Tradeoffs Follow board notes Propagation Delay Switching Time

More information

CMPEN 411 VLSI Digital Circuits. Lecture 04: CMOS Inverter (static view)

CMPEN 411 VLSI Digital Circuits. Lecture 04: CMOS Inverter (static view) CMPEN 411 VLSI Digital Circuits Lecture 04: CMOS Inverter (static view) Kyusun Choi [Adapted from Rabaey s Digital Integrated Circuits, Second Edition, 2003 J. Rabaey, A. Chandrakasan, B. Nikolic] CMPEN

More information

EE241 - Spring 2003 Advanced Digital Integrated Circuits

EE241 - Spring 2003 Advanced Digital Integrated Circuits EE241 - Spring 2003 Advanced Digital Integrated Circuits Lecture 16 Energy-Recovery Circuits SOI Technology and Circuits Optimal EDP Contours 1 Leakage and Switching ELk 2 = ESw Opt L ln d K tech α avg

More information

Dynamic Combinational Circuits. Dynamic Logic

Dynamic Combinational Circuits. Dynamic Logic Dynamic Combinational Circuits Dynamic circuits Charge sharing, charge redistribution Domino logic np-cmos (zipper CMOS) Krish Chakrabarty 1 Dynamic Logic Dynamic gates use a clocked pmos pullup Two modes:

More information

EE5311- Digital IC Design

EE5311- Digital IC Design EE5311- Digital IC Design Module 3 - The Inverter Janakiraman V Assistant Professor Department of Electrical Engineering Indian Institute of Technology Madras Chennai September 6, 2017 Janakiraman, IITM

More information

Digital Microelectronic Circuits ( ) The CMOS Inverter. Lecture 4: Presented by: Adam Teman

Digital Microelectronic Circuits ( ) The CMOS Inverter. Lecture 4: Presented by: Adam Teman Digital Microelectronic Circuits (361-1-301 ) Presented by: Adam Teman Lecture 4: The CMOS Inverter 1 Last Lectures Moore s Law Terminology» Static Properties» Dynamic Properties» Power The MOSFET Transistor»

More information

ESE 570: Digital Integrated Circuits and VLSI Fundamentals

ESE 570: Digital Integrated Circuits and VLSI Fundamentals ESE 570: Digital Integrated Circuits and VLSI Fundamentals Lec 18: March 27, 2018 Dynamic Logic, Charge Injection Lecture Outline! Sequential MOS Logic " D-Latch " Timing Constraints! Dynamic Logic " Domino

More information

ECE321 Electronics I

ECE321 Electronics I ECE321 Electronics I Lecture 1: Introduction to Digital Electronics Payman Zarkesh-Ha Office: ECE Bldg. 230B Office hours: Tuesday 2:00-3:00PM or by appointment E-mail: payman@ece.unm.edu Slide: 1 Textbook

More information

ECE 438: Digital Integrated Circuits Assignment #4 Solution The Inverter

ECE 438: Digital Integrated Circuits Assignment #4 Solution The Inverter ECE 438: Digital Integrated Circuits Assignment #4 The Inverter Text: Chapter 5, Digital Integrated Circuits 2 nd Ed, Rabaey 1) Consider the CMOS inverter circuit in Figure P1 with the following parameters.

More information

Digital Integrated Circuits

Digital Integrated Circuits Chapter 6 The CMOS Inverter 1 Contents Introduction (MOST models) 0, 1 st, 2 nd order The CMOS inverter : The static behavior: o DC transfer characteristics, o Short-circuit current The CMOS inverter :

More information

Power Consumption in CMOS CONCORDIA VLSI DESIGN LAB

Power Consumption in CMOS CONCORDIA VLSI DESIGN LAB Power Consumption in CMOS 1 Power Dissipation in CMOS Two Components contribute to the power dissipation:» Static Power Dissipation Leakage current Sub-threshold current» Dynamic Power Dissipation Short

More information

CMOS Inverter (static view)

CMOS Inverter (static view) Review: Design Abstraction Levels SYSTEM CMOS Inverter (static view) + MODULE GATE [Adapted from Chapter 5. 5.3 CIRCUIT of G DEVICE Rabaey s Digital Integrated Circuits,, J. Rabaey et al.] S D Review:

More information

9/18/2008 GMU, ECE 680 Physical VLSI Design

9/18/2008 GMU, ECE 680 Physical VLSI Design ECE680: Physical VLSI Design Chapter III CMOS Device, Inverter, Combinational circuit Logic and Layout Part 3 Combinational Logic Gates (textbook chapter 6) 9/18/2008 GMU, ECE 680 Physical VLSI Design

More information

EE 434 Lecture 33. Logic Design

EE 434 Lecture 33. Logic Design EE 434 Lecture 33 Logic Design Review from last time: Ask the inverter how it will interpret logic levels V IN V OUT V H =? V L =? V LARGE V H V L V H Review from last time: The two-inverter loop X Y X

More information

Topics. Dynamic CMOS Sequential Design Memory and Control. John A. Chandy Dept. of Electrical and Computer Engineering University of Connecticut

Topics. Dynamic CMOS Sequential Design Memory and Control. John A. Chandy Dept. of Electrical and Computer Engineering University of Connecticut Topics Dynamic CMOS Sequential Design Memory and Control Dynamic CMOS In static circuits at every point in time (except when switching) the output is connected to either GND or V DD via a low resistance

More information

Dynamic Combinational Circuits. Dynamic Logic

Dynamic Combinational Circuits. Dynamic Logic Dynamic Combinational Circuits Dynamic circuits Charge sharing, charge redistribution Domino logic np-cmos (zipper CMOS) Krish Chakrabarty 1 Dynamic Logic Dynamic gates use a clocked pmos pullup Two modes:

More information

The Physical Structure (NMOS)

The Physical Structure (NMOS) The Physical Structure (NMOS) Al SiO2 Field Oxide Gate oxide S n+ Polysilicon Gate Al SiO2 SiO2 D n+ L channel P Substrate Field Oxide contact Metal (S) n+ (G) L W n+ (D) Poly 1 Transistor Resistance Two

More information

VLSI Design I; A. Milenkovic 1

VLSI Design I; A. Milenkovic 1 Why Power Matters PE/EE 47, PE 57 VLSI Design I L5: Power and Designing for Low Power Department of Electrical and omputer Engineering University of labama in Huntsville leksandar Milenkovic ( www.ece.uah.edu/~milenka

More information

Miscellaneous Lecture topics. Mary Jane Irwin [Adapted from Rabaey s Digital Integrated Circuits, 2002, J. Rabaey et al.]

Miscellaneous Lecture topics. Mary Jane Irwin [Adapted from Rabaey s Digital Integrated Circuits, 2002, J. Rabaey et al.] Miscellaneous Lecture topics Mary Jane Irwin [dapted from Rabaey s Digital Integrated Circuits, 2002, J. Rabaey et al.] MOS Switches MOS transistors can be viewed as simple switches. In an N-Switch, the

More information

Digital Integrated Circuits A Design Perspective

Digital Integrated Circuits A Design Perspective Digital Integrated Circuits Design Perspective Designing Combinational Logic Circuits Fuyuzhuo School of Microelectronics,SJTU Introduction Digital IC Dynamic Logic Introduction Digital IC 2 EE141 Dynamic

More information

EEE 421 VLSI Circuits

EEE 421 VLSI Circuits EEE 421 CMOS Properties Full rail-to-rail swing high noise margins» Logic levels not dependent upon the relative device sizes transistors can be minimum size ratioless Always a path to V dd or GND in steady

More information

EEC 118 Lecture #6: CMOS Logic. Rajeevan Amirtharajah University of California, Davis Jeff Parkhurst Intel Corporation

EEC 118 Lecture #6: CMOS Logic. Rajeevan Amirtharajah University of California, Davis Jeff Parkhurst Intel Corporation EEC 118 Lecture #6: CMOS Logic Rajeevan mirtharajah University of California, Davis Jeff Parkhurst Intel Corporation nnouncements Quiz 1 today! Lab 2 reports due this week Lab 3 this week HW 3 due this

More information

EECS150 - Digital Design Lecture 22 Power Consumption in CMOS. Announcements

EECS150 - Digital Design Lecture 22 Power Consumption in CMOS. Announcements EECS150 - Digital Design Lecture 22 Power Consumption in CMOS November 22, 2011 Elad Alon Electrical Engineering and Computer Sciences University of California, Berkeley http://www-inst.eecs.berkeley.edu/~cs150

More information

CMOS INVERTER. Last Lecture. Metrics for qualifying digital circuits. »Cost» Reliability» Speed (delay)»performance

CMOS INVERTER. Last Lecture. Metrics for qualifying digital circuits. »Cost» Reliability» Speed (delay)»performance CMOS INVERTER Last Lecture Metrics for qualifying digital circuits»cost» Reliability» Speed (delay)»performance 1 Today s lecture The CMOS inverter at a glance An MOS transistor model for manual analysis

More information

ΗΜΥ 307 ΨΗΦΙΑΚΑ ΟΛΟΚΛΗΡΩΜΕΝΑ ΚΥΚΛΩΜΑΤΑ Εαρινό Εξάμηνο 2018

ΗΜΥ 307 ΨΗΦΙΑΚΑ ΟΛΟΚΛΗΡΩΜΕΝΑ ΚΥΚΛΩΜΑΤΑ Εαρινό Εξάμηνο 2018 ΗΜΥ 307 ΨΗΦΙΑΚΑ ΟΛΟΚΛΗΡΩΜΕΝΑ ΚΥΚΛΩΜΑΤΑ Εαρινό Εξάμηνο 2018 ΔΙΑΛΕΞΗ 11: Dynamic CMOS Circuits ΧΑΡΗΣ ΘΕΟΧΑΡΙΔΗΣ (ttheocharides@ucy.ac.cy) (ack: Prof. Mary Jane Irwin and Vijay Narayanan) [Προσαρμογή από

More information

ENGR890 Digital VLSI Design Fall Lecture 4: CMOS Inverter (static view)

ENGR890 Digital VLSI Design Fall Lecture 4: CMOS Inverter (static view) ENGR89 Digital VLSI Design Fall 5 Lecture 4: CMOS Inverter (static view) [Adapted from Chapter 5 of Digital Integrated Circuits, 3, J. Rabaey et al.] [Also borrowed from Vijay Narayanan and Mary Jane Irwin]

More information

Practice 7: CMOS Capacitance

Practice 7: CMOS Capacitance Practice 7: CMOS Capacitance Digital Electronic Circuits Semester A 2012 MOSFET Capacitances MOSFET Capacitance Components 3 Gate to Channel Capacitance In general, the gate capacitance is similar to a

More information

EECS 151/251A Homework 5

EECS 151/251A Homework 5 EECS 151/251A Homework 5 Due Monday, March 5 th, 2018 Problem 1: Timing The data-path shown below is used in a simple processor. clk rd1 rd2 0 wr regfile 1 0 ALU REG 1 The elements used in the design have

More information

Low Power CMOS Dr. Lynn Fuller Webpage:

Low Power CMOS Dr. Lynn Fuller Webpage: ROCHESTER INSTITUTE OF TECHNOLOGY MICROELECTRONIC ENGINEERING Dr. Lynn Fuller Webpage: http://people.rit.edu/lffeee 82 Lomb Memorial Drive Rochester, NY 14623-5604 Email: Lynn.Fuller@rit.edu Department

More information

CSE140L: Components and Design Techniques for Digital Systems Lab. Power Consumption in Digital Circuits. Pietro Mercati

CSE140L: Components and Design Techniques for Digital Systems Lab. Power Consumption in Digital Circuits. Pietro Mercati CSE140L: Components and Design Techniques for Digital Systems Lab Power Consumption in Digital Circuits Pietro Mercati 1 About the final Friday 09/02 at 11.30am in WLH2204 ~2hrs exam including (but not

More information

CARNEGIE MELLON UNIVERSITY DEPARTMENT OF ELECTRICAL AND COMPUTER ENGINEERING DIGITAL INTEGRATED CIRCUITS FALL 2002

CARNEGIE MELLON UNIVERSITY DEPARTMENT OF ELECTRICAL AND COMPUTER ENGINEERING DIGITAL INTEGRATED CIRCUITS FALL 2002 CARNEGIE MELLON UNIVERSITY DEPARTMENT OF ELECTRICAL AND COMPUTER ENGINEERING 18-322 DIGITAL INTEGRATED CIRCUITS FALL 2002 Final Examination, Monday Dec. 16, 2002 NAME: SECTION: Time: 180 minutes Closed

More information

VLSI GATE LEVEL DESIGN UNIT - III P.VIDYA SAGAR ( ASSOCIATE PROFESSOR) Department of Electronics and Communication Engineering, VBIT

VLSI GATE LEVEL DESIGN UNIT - III P.VIDYA SAGAR ( ASSOCIATE PROFESSOR) Department of Electronics and Communication Engineering, VBIT VLSI UNIT - III GATE LEVEL DESIGN P.VIDYA SAGAR ( ASSOCIATE PROFESSOR) contents GATE LEVEL DESIGN : Logic Gates and Other complex gates, Switch logic, Alternate gate circuits, Time Delays, Driving large

More information

ECE 342 Solid State Devices & Circuits 4. CMOS

ECE 342 Solid State Devices & Circuits 4. CMOS ECE 34 Solid State Devices & Circuits 4. CMOS Jose E. Schutt-Aine Electrical & Computer Engineering University of Illinois jschutt@emlab.uiuc.edu ECE 34 Jose Schutt Aine 1 Digital Circuits V IH : Input

More information

EEC 116 Lecture #5: CMOS Logic. Rajeevan Amirtharajah Bevan Baas University of California, Davis Jeff Parkhurst Intel Corporation

EEC 116 Lecture #5: CMOS Logic. Rajeevan Amirtharajah Bevan Baas University of California, Davis Jeff Parkhurst Intel Corporation EEC 116 Lecture #5: CMOS Logic Rajeevan mirtharajah Bevan Baas University of California, Davis Jeff Parkhurst Intel Corporation nnouncements Quiz 1 today! Lab 2 reports due this week Lab 3 this week HW

More information

Circuit A. Circuit B

Circuit A. Circuit B UNIVERSITY OF CALIFORNIA College of Engineering Department of Electrical Engineering and Computer Sciences Last modified on November 19, 2006 by Karl Skucha (kskucha@eecs) Borivoje Nikolić Homework #9

More information

ECE 342 Electronic Circuits. Lecture 35 CMOS Delay Model

ECE 342 Electronic Circuits. Lecture 35 CMOS Delay Model ECE 34 Electronic Circuits Lecture 35 CMOS Delay Model Jose E. Schutt-Aine Electrical & Computer Engineering University of Illinois jesa@illinois.edu ECE 34 Jose Schutt Aine 1 Digital Circuits V IH : Input

More information

ESE570 Spring University of Pennsylvania Department of Electrical and System Engineering Digital Integrated Cicruits AND VLSI Fundamentals

ESE570 Spring University of Pennsylvania Department of Electrical and System Engineering Digital Integrated Cicruits AND VLSI Fundamentals University of Pennsylvania Department of Electrical and System Engineering Digital Integrated Cicruits AND VLSI Fundamentals ESE570, Spring 017 Final Wednesday, May 3 4 Problems with point weightings shown.

More information

ESE570 Spring University of Pennsylvania Department of Electrical and System Engineering Digital Integrated Cicruits AND VLSI Fundamentals

ESE570 Spring University of Pennsylvania Department of Electrical and System Engineering Digital Integrated Cicruits AND VLSI Fundamentals University of Pennsylvania Department of Electrical and System Engineering Digital Integrated Cicruits AND VLSI Fundamentals ESE570, Spring 2018 Final Monday, Apr 0 5 Problems with point weightings shown.

More information

Digital Integrated Circuits Designing Combinational Logic Circuits. Fuyuzhuo

Digital Integrated Circuits Designing Combinational Logic Circuits. Fuyuzhuo Digital Integrated Circuits Designing Combinational Logic Circuits Fuyuzhuo Introduction Digital IC Dynamic Logic Introduction Digital IC EE141 2 Dynamic logic outline Dynamic logic principle Dynamic logic

More information

Introduction to CMOS VLSI Design (E158) Lecture 20: Low Power Design

Introduction to CMOS VLSI Design (E158) Lecture 20: Low Power Design Harris Introduction to CMOS VLSI Design (E158) Lecture 20: Low Power Design David Harris Harvey Mudd College David_Harris@hmc.edu Based on EE271 developed by Mark Horowitz, Stanford University MAH E158

More information

Lecture 23. CMOS Logic Gates and Digital VLSI I

Lecture 23. CMOS Logic Gates and Digital VLSI I ecture 3 CMOS ogic Gates and Digital SI I In this lecture you will learn: Digital ogic The CMOS Inverter Charge and Discharge Dynamics Power Dissipation Digital evels and Noise NFET Inverter Cut-off Saturation

More information

High-to-Low Propagation Delay t PHL

High-to-Low Propagation Delay t PHL High-to-Low Propagation Delay t PHL V IN switches instantly from low to high. Driver transistor (n-channel) immediately switches from cutoff to saturation; the p-channel pull-up switches from triode to

More information

ESE 570: Digital Integrated Circuits and VLSI Fundamentals

ESE 570: Digital Integrated Circuits and VLSI Fundamentals ESE 570: Digital Integrated Circuits and VLSI Fundamentals Lec 17: March 26, 2019 Energy Optimization & Design Space Exploration Penn ESE 570 Spring 2019 Khanna Lecture Outline! Energy Optimization! Design

More information

Lecture 7 Circuit Delay, Area and Power

Lecture 7 Circuit Delay, Area and Power Lecture 7 Circuit Delay, Area and Power lecture notes from S. Mitra Intro VLSI System course (EE271) Introduction to VLSI Systems 1 Circuits and Delay Introduction to VLSI Systems 2 Power, Delay and Area:

More information

MASSACHUSETTS INSTITUTE OF TECHNOLOGY Department of Electrical Engineering and Computer Sciences

MASSACHUSETTS INSTITUTE OF TECHNOLOGY Department of Electrical Engineering and Computer Sciences MSSCHUSETTS INSTITUTE OF TECHNOLOGY Department of Electrical Engineering and Computer Sciences nalysis and Design of Digital Integrated Circuits (6.374) - Fall 2003 Quiz #1 Prof. nantha Chandrakasan Student

More information

The CMOS Inverter: A First Glance

The CMOS Inverter: A First Glance The CMOS Inverter: A First Glance V DD S D V in V out C L D S CMOS Inverter N Well V DD V DD PMOS 2λ PMOS Contacts In Out In Out Metal 1 NMOS Polysilicon NMOS GND CMOS Inverter: Steady State Response V

More information

Recall the essence of data transmission: How Computers Work Lecture 11

Recall the essence of data transmission: How Computers Work Lecture 11 Recall the essence of data transmission: How Computers Work Lecture 11 Q: What form does information take during transmission? Introduction to the Physics of Computation A: Energy Energy How Computers

More information

Digital Electronics Part II - Circuits

Digital Electronics Part II - Circuits Digital Electronics Part - Circuits Dr.. J. Wassell Gates from Transistors ntroduction Logic circuits are non-linear, consequently we will introduce a graphical technique for analysing such circuits The

More information

University of Toronto. Final Exam

University of Toronto. Final Exam University of Toronto Final Exam Date - Apr 18, 011 Duration:.5 hrs ECE334 Digital Electronics Lecturer - D. Johns ANSWER QUESTIONS ON THESE SHEETS USING BACKS IF NECESSARY 1. Equation sheet is on last

More information

DC and Transient Responses (i.e. delay) (some comments on power too!)

DC and Transient Responses (i.e. delay) (some comments on power too!) DC and Transient Responses (i.e. delay) (some comments on power too!) Michael Niemier (Some slides based on lecture notes by David Harris) 1 Lecture 02 - CMOS Transistor Theory & the Effects of Scaling

More information

Lecture 14 - Digital Circuits (III) CMOS. April 1, 2003

Lecture 14 - Digital Circuits (III) CMOS. April 1, 2003 6.12 - Microelectronic Devices and Circuits - Spring 23 Lecture 14-1 Lecture 14 - Digital Circuits (III) CMOS April 1, 23 Contents: 1. Complementary MOS (CMOS) inverter: introduction 2. CMOS inverter:

More information

ESE 570: Digital Integrated Circuits and VLSI Fundamentals

ESE 570: Digital Integrated Circuits and VLSI Fundamentals ESE 570: Digital Integrated Circuits and VLSI Fundamentals Lec 21: April 4, 2017 Memory Overview, Memory Core Cells Penn ESE 570 Spring 2017 Khanna Today! Memory " Classification " ROM Memories " RAM Memory

More information

Chapter 11. Inverter. DC AC, Switching. Layout. Sizing PASS GATES (CHPT 10) Other Inverters. Baker Ch. 11 The Inverter. Introduction to VLSI

Chapter 11. Inverter. DC AC, Switching. Layout. Sizing PASS GATES (CHPT 10) Other Inverters. Baker Ch. 11 The Inverter. Introduction to VLSI Chapter 11 Inverter DC AC, Switching Ring Oscillator Dynamic Power Dissipation Layout LATCHUP Sizing PASS GATES (CHPT 10) Other Inverters Joseph A. Elias, Ph.D. Adjunct Professor, University of Kentucky;

More information

EE241 - Spring 2005 Advanced Digital Integrated Circuits. Admin. Lecture 10: Power Intro

EE241 - Spring 2005 Advanced Digital Integrated Circuits. Admin. Lecture 10: Power Intro EE241 - Spring 2005 Advanced Digital Integrated Circuits Lecture 10: Power Intro Admin Project Phase 2 due Monday March 14, 5pm (by e-mail to jan@eecs.berkeley.edu and huifangq@eecs.berkeley.edu) Should

More information

CMPEN 411 VLSI Digital Circuits Spring 2011 Lecture 07: Pass Transistor Logic

CMPEN 411 VLSI Digital Circuits Spring 2011 Lecture 07: Pass Transistor Logic CMPEN 411 VLSI Digital Circuits Spring 2011 Lecture 07: Pass Transistor Logic [dapted from Rabaey s Digital Integrated Circuits, Second Edition, 2003 J. Rabaey,. Chandrakasan,. Nikolic] Sp11 CMPEN 411

More information

Answers. Name: Grade: Q1 Q2 Q3 Q4 Total mean: 83, stdev: 14. ESE370 Fall 2017

Answers. Name: Grade: Q1 Q2 Q3 Q4 Total mean: 83, stdev: 14. ESE370 Fall 2017 University of Pennsylvania Department of Electrical and System Engineering Circuit-Level Modeling, Design, and Optimization for Digital Systems ESE370, Fall 2017 Midterm 2 Monday, November 6 Point values

More information

EEC 118 Lecture #16: Manufacturability. Rajeevan Amirtharajah University of California, Davis

EEC 118 Lecture #16: Manufacturability. Rajeevan Amirtharajah University of California, Davis EEC 118 Lecture #16: Manufacturability Rajeevan Amirtharajah University of California, Davis Outline Finish interconnect discussion Manufacturability: Rabaey G, H (Kang & Leblebici, 14) Amirtharajah, EEC

More information

EE 330 Lecture 6. Improved Switch-Level Model Propagation Delay Stick Diagrams Technology Files

EE 330 Lecture 6. Improved Switch-Level Model Propagation Delay Stick Diagrams Technology Files EE 330 Lecture 6 Improved witch-level Model Propagation elay tick iagrams Technology Files Review from Last Time MO Transistor Qualitative iscussion of n-channel Operation Bulk ource Gate rain rain G Gate

More information