EECS240 Spring Lecture 21: Matching. Elad Alon Dept. of EECS. V i+ V i-
|
|
- Abraham Patterson
- 5 years ago
- Views:
Transcription
1 EECS40 Spring 010 Lecture 1: Matching Elad Alon Dept. of EECS Offset V i+ V i- To achieve zero offset, comparator devices must be perfectly matched to each other How well-matched can the devices be made? Not arbitrary direct function of design choices EECS40 Lecture 1
2 Device Mismatch Categories Die-to-die All devices on same chip (or wafer) have same characteristics Within die (long-range) All devices within certain region have same characteristics Local (short-range) Every device different, random Usually most important source of mismatch EECS40 Lecture 1 3 Sources of Local Variation Deterministic sources: Local poly density Sub-90nm: stress, litho interactions, Random sources: Dopant fluctuations Line-edge roughness Oxide traps Focus our modeling on random variations Deterministic handled with good layout practices EECS40 Lecture 1 4
3 References M. J. M. Pelgrom, A. C. J. Duinmaijer, and A. P. G. Welbers, "Matching properties of MOS transistors," IEEE JSSC, vol. 4, pp , Oct Mismatch model Statistical data for.5µm CMOS J. A. Croon, M. Rosmeulen, S. Decoutere, W. Sansen, and H. E. Maes, An easy-to-use mismatch model for the MOS transistor, IEEE JSSC, vol. 37, pp , Aug µm CMOS data EECS40 Lecture 1 5 Mismatch Statistics Total mismatch set by composite of many single, independent events Correlation distance << device dimensions E.g., number of dopant atoms implanted into the channel Individual effects are small: linear superposition holds Mismatch is zero mean, Gaussian distribution EECS40 Lecture 1 6
4 Parameter Mismatch Model σ ( P) σ A WL P ( P ) = + S D : variance of P WL : active gate area P : 0 for "good" layout P Dx : distance between device centers AP : measured area proportionality constant S : measured distance proportionality constant, x EECS40 Lecture 1 7 V T Mismatch Mismatch in V T between two identical devices: A σ = + WL VT ( VT) SV Dx.5µm CMOS process : AV, 30 mv m T NMOS µ A 35 mv µ m VT, PMOS Often largest source of offset T EECS40 Lecture 1 8
5 Drain Bias, V DS V T largely independent of V DS EECS40 Lecture 1 9 Back-Gate Bias, V SB Mismatch can depend on V SB Why? EECS40 Lecture 1 10
6 Current Matching, I D /I D Strong bias dependence (we knew that already) EECS40 Lecture 1 11 Current Factor W β = µc ox L EECS40 Lecture 1 1
7 Sources of β Mismatch Mobility variations E.g., due to dopant variations, random defects Oxide thickness variation Usually very well-controlled Edge roughness EECS40 Lecture 1 13 Edge Model σ β ( β ) σ ( W ) σ ( L) σ ( C ) σ ( µ ) = W + L + C ox ox + µ n n For: σ ( W ) 1 and σ ( L) 1 L W Simplifies to: σ β ( β ) A A AC Aµ L W ox = S D β WL W L WL WL EECS40 Lecture 1 14
8 Orientation Effects Si and transistors are not (perfectly) isotropic keep direction of current flow same! EECS40 Lecture 1 15 Distance Effect EECS40 Lecture 1 16
9 Process Dependence A Vt tends to scale with technology Proportional to t ox Also depends on doping level EECS40 Lecture µm CMOS EECS40 Lecture 1 18
10 Current Matching EECS40 Lecture 1 19 Voltage Matching EECS40 Lecture 1 0
11 Golden Rule of Layout for Matching Everything you can think of might matter Even whether or not there is metal above the devices How to avoid systematic errors? Ref: A. Hastings, The art of analog layout, Prentice Hall, 001 EECS40 Lecture 1 1 Common Centroid Layout Cancels linear gradients Required for moderate matching EECS40 Lecture 1
12 Simulating Mismatch Brute force: Monte Carlo HSPICE throws the dice EECS40 Lecture 1 3 Simulating Mismatch EECS40 Lecture 1 4
Random Offset in CMOS IC Design
Random Offset in CMOS C esign ECEN487/587 Analog C esign October 19, 007 Art Zirger, National Semiconductor art.zirger@nsc.com 303-845-404 Where to start? How do we choose what transistor sizes to use
More informationCMOS Cross Section. EECS240 Spring Today s Lecture. Dimensions. CMOS Process. Devices. Lecture 2: CMOS Technology and Passive Devices
EECS240 Spring 2008 CMOS Cross Section Metal p - substrate p + diffusion Lecture 2: CMOS echnology and Passive Devices Poly n - well n + diffusion Elad Alon Dept. of EECS EECS240 Lecture 2 4 oday s Lecture
More informationECE 342 Electronic Circuits. Lecture 6 MOS Transistors
ECE 342 Electronic Circuits Lecture 6 MOS Transistors Jose E. Schutt-Aine Electrical & Computer Engineering University of Illinois jesa@illinois.edu 1 NMOS Transistor Typically L = 0.1 to 3 m, W = 0.2
More informationCMOS Cross Section. EECS240 Spring Dimensions. Today s Lecture. Why Talk About Passives? EE240 Process
EECS240 Spring 202 CMOS Cross Section Metal p - substrate p + diffusion Lecture 2: CMOS Technology and Passive Devices Poly n - well n + diffusion Elad Alon Dept. of EECS EECS240 Lecture 2 4 Today s Lecture
More informationMeasurement and Modeling of MOS Transistor Current Mismatch in Analog IC s
Measurement and Modeling of MOS Transistor Current Mismatch in Analog IC s Eric Felt Amit Narayan Alberto Sangiovanni-Vincentelli Department of Electrical Engineering and Computer Sciences University of
More informationEECS240 Spring Today s Lecture. Lecture 2: CMOS Technology and Passive Devices. Lingkai Kong EECS. EE240 CMOS Technology
EECS240 Spring 2013 Lecture 2: CMOS Technology and Passive Devices Lingkai Kong EECS Today s Lecture EE240 CMOS Technology Passive devices Motivation Resistors Capacitors (Inductors) Next time: MOS transistor
More informationIntegrated Circuits & Systems
Federal University of Santa Catarina Center for Technology Computer Science & Electronics Engineering Integrated Circuits & Systems INE 5442 Lecture 10 MOSFET part 1 guntzel@inf.ufsc.br ual-well Trench-Isolated
More informationP. R. Nelson 1 ECE418 - VLSI. Midterm Exam. Solutions
P. R. Nelson 1 ECE418 - VLSI Midterm Exam Solutions 1. (8 points) Draw the cross-section view for A-A. The cross-section view is as shown below.. ( points) Can you tell which of the metal1 regions is the
More informationImpact of parametric mismatch and fluctuations on performance and yield of deep-submicron CMOS technologies. Philips Research, The Netherlands
Impact of parametric mismatch and fluctuations on performance and yield of deep-submicron CMOS technologies Hans Tuinhout, The Netherlands motivation: from deep submicron digital ULSI parametric spread
More informationCMPEN 411 VLSI Digital Circuits. Lecture 03: MOS Transistor
CMPEN 411 VLSI Digital Circuits Lecture 03: MOS Transistor Kyusun Choi [Adapted from Rabaey s Digital Integrated Circuits, Second Edition, 2003 J. Rabaey, A. Chandrakasan, B. Nikolic] CMPEN 411 L03 S.1
More informationMOS Transistor I-V Characteristics and Parasitics
ECEN454 Digital Integrated Circuit Design MOS Transistor I-V Characteristics and Parasitics ECEN 454 Facts about Transistors So far, we have treated transistors as ideal switches An ON transistor passes
More informationMOS Transistor Properties Review
MOS Transistor Properties Review 1 VLSI Chip Manufacturing Process Photolithography: transfer of mask patterns to the chip Diffusion or ion implantation: selective doping of Si substrate Oxidation: SiO
More informationLecture 3: CMOS Transistor Theory
Lecture 3: CMOS Transistor Theory Outline Introduction MOS Capacitor nmos I-V Characteristics pmos I-V Characteristics Gate and Diffusion Capacitance 2 Introduction So far, we have treated transistors
More informationEE382M-14 CMOS Analog Integrated Circuit Design
EE382M-14 CMOS Analog Integrated Circuit Design Lecture 3, MOS Capacitances, Passive Components, and Layout of Analog Integrated Circuits MOS Capacitances Type of MOS transistor capacitors Depletion capacitance
More informationELEN0037 Microelectronic IC Design. Prof. Dr. Michael Kraft
ELEN0037 Microelectronic IC Design Prof. Dr. Michael Kraft Lecture 2: Technological Aspects Technology Passive components Active components CMOS Process Basic Layout Scaling CMOS Technology Integrated
More informationEE 435. Lecture 22. Offset Voltages Common Mode Feedback
EE 435 Lecture Offset Voltages Common Mode Feedback Review from last lecture Offset Voltage Two types of offset voltage: Systematic Offset Voltage Random Offset Voltage V ICQ Definition: The output offset
More informationECE 342 Electronic Circuits. 3. MOS Transistors
ECE 342 Electronic Circuits 3. MOS Transistors Jose E. Schutt-Aine Electrical & Computer Engineering University of Illinois jschutt@emlab.uiuc.edu 1 NMOS Transistor Typically L = 0.1 to 3 m, W = 0.2 to
More informationL ECE 4211 UConn F. Jain Scaling Laws for NanoFETs Chapter 10 Logic Gate Scaling
L13 04202017 ECE 4211 UConn F. Jain Scaling Laws for NanoFETs Chapter 10 Logic Gate Scaling Scaling laws: Generalized scaling (GS) p. 610 Design steps p.613 Nanotransistor issues (page 626) Degradation
More informationThe Mismatch Behavior P(x,y)
The Mismatch Behavior P(x,y) x y σ 2 ( P) = f A ( WL, ) + f D ( D) f A ( W, L) Small random, transistor size dependent component, true mismatch component f D ( D) Gradient surface, transistor distance
More informationEE115C Winter 2017 Digital Electronic Circuits. Lecture 3: MOS RC Model, CMOS Manufacturing
EE115C Winter 2017 Digital Electronic Circuits Lecture 3: MOS RC Model, CMOS Manufacturing Agenda MOS Transistor: RC Model (pp. 104-113) S R on D CMOS Manufacturing Process (pp. 36-46) S S C GS G G C GD
More informationThe Devices: MOS Transistors
The Devices: MOS Transistors References: Semiconductor Device Fundamentals, R. F. Pierret, Addison-Wesley Digital Integrated Circuits: A Design Perspective, J. Rabaey et.al. Prentice Hall NMOS Transistor
More informationEE 240B Spring Advanced Analog Integrated Circuits Lecture 2: MOS Transistor Models. Elad Alon Dept. of EECS
EE 240B Spring 2018 Advanced Analog Integrated Circuits Lecture 2: MOS Transistor Models Elad Alon Dept. of EECS Square Law Model? Assumptions made to come up with this model: Charge density determined
More informationEE 435. Lecture 22. Offset Voltages
EE 435 Lecture Offset Voltages . Review from last lecture. Offset Voltage Definition: The input-referred offset voltage is the differential dc input voltage that must be applied to obtain the desired output
More informationFig The electron mobility for a-si and poly-si TFT.
Fig. 1-1-1 The electron mobility for a-si and poly-si TFT. Fig. 1-1-2 The aperture ratio for a-si and poly-si TFT. 33 Fig. 1-2-1 All kinds defect well. (a) is the Dirac well. (b) is the repulsive Columbic
More informationEE 560 MOS TRANSISTOR THEORY
1 EE 560 MOS TRANSISTOR THEORY PART 1 TWO TERMINAL MOS STRUCTURE V G (GATE VOLTAGE) 2 GATE OXIDE SiO 2 SUBSTRATE p-type doped Si (N A = 10 15 to 10 16 cm -3 ) t ox V B (SUBSTRATE VOLTAGE) EQUILIBRIUM:
More informationLECTURE 3 MOSFETS II. MOS SCALING What is Scaling?
LECTURE 3 MOSFETS II Lecture 3 Goals* * Understand constant field and constant voltage scaling and their effects. Understand small geometry effects for MOS transistors and their implications modeling and
More informationECE 415/515 ANALOG INTEGRATED CIRCUIT DESIGN
ECE 415/515 ANALOG INTEGRATED CIRCUIT DESIGN CMOS PROCESS CHARACTERIZATION VISHAL SAXENA VSAXENA@UIDAHO.EDU Vishal Saxena DESIGN PARAMETERS Analog circuit designers care about: Open-loop Gain: g m r o
More informationEEC 118 Lecture #2: MOSFET Structure and Basic Operation. Rajeevan Amirtharajah University of California, Davis Jeff Parkhurst Intel Corporation
EEC 118 Lecture #2: MOSFET Structure and Basic Operation Rajeevan Amirtharajah University of California, Davis Jeff Parkhurst Intel Corporation Announcements Lab 1 this week, report due next week Bring
More informationLecture 13 MOSFET as an amplifier with an introduction to MOSFET small-signal model and small-signal schematics. Lena Peterson
Lecture 13 MOSFET as an amplifier with an introduction to MOSFET small-signal model and small-signal schematics Lena Peterson 2015-10-13 Outline (1) Why is the CMOS inverter gain not infinite? Large-signal
More informationFIELD-EFFECT TRANSISTORS
FIEL-EFFECT TRANSISTORS 1 Semiconductor review 2 The MOS capacitor 2 The enhancement-type N-MOS transistor 3 I-V characteristics of enhancement MOSFETS 4 The output characteristic of the MOSFET in saturation
More informationThe Intrinsic Silicon
The Intrinsic ilicon Thermally generated electrons and holes Carrier concentration p i =n i ni=1.45x10 10 cm-3 @ room temp Generally: n i = 3.1X10 16 T 3/2 e -1.21/2KT cm -3 T= temperature in K o (egrees
More informationUNIVERSITY OF CALIFORNIA College of Engineering Department of Electrical Engineering and Computer Sciences. EECS 130 Professor Ali Javey Fall 2006
UNIVERSITY OF CALIFORNIA College of Engineering Department of Electrical Engineering and Computer Sciences EECS 130 Professor Ali Javey Fall 2006 Midterm 2 Name: SID: Closed book. Two sheets of notes are
More informationMOSFET: Introduction
E&CE 437 Integrated VLSI Systems MOS Transistor 1 of 30 MOSFET: Introduction Metal oxide semiconductor field effect transistor (MOSFET) or MOS is widely used for implementing digital designs Its major
More informationESE 570: Digital Integrated Circuits and VLSI Fundamentals
ESE 570: Digital Integrated Circuits and VLSI Fundamentals Lec 4: January 23, 2018 MOS Transistor Theory, MOS Model Penn ESE 570 Spring 2018 Khanna Lecture Outline! CMOS Process Enhancements! Semiconductor
More informationESE 570: Digital Integrated Circuits and VLSI Fundamentals
ESE 570: Digital Integrated Circuits and VLSI Fundamentals Lec 4: January 24, 2017 MOS Transistor Theory, MOS Model Penn ESE 570 Spring 2017 Khanna Lecture Outline! Semiconductor Physics " Band gaps "
More informationP-MOS Device and CMOS Inverters
Lecture 23 P-MOS Device and CMOS Inverters A) P-MOS Device Structure and Oeration B) Relation of Current to t OX, µ V LIMIT C) CMOS Device Equations and Use D) CMOS Inverter V OUT vs. V IN E) CMOS Short
More information1. The MOS Transistor. Electrical Conduction in Solids
Electrical Conduction in Solids!The band diagram describes the energy levels for electron in solids.!the lower filled band is named Valence Band.!The upper vacant band is named conduction band.!the distance
More informationFLCC Seminar. Spacer Lithography for Reduced Variability in MOSFET Performance
1 Seminar Spacer Lithography for Reduced Variability in MOSFET Performance Prof. Tsu-Jae King Liu Electrical Engineering & Computer Sciences Dept. University of California at Berkeley Graduate Student:
More informationEEC 118 Lecture #16: Manufacturability. Rajeevan Amirtharajah University of California, Davis
EEC 118 Lecture #16: Manufacturability Rajeevan Amirtharajah University of California, Davis Outline Finish interconnect discussion Manufacturability: Rabaey G, H (Kang & Leblebici, 14) Amirtharajah, EEC
More informationSection 12: Intro to Devices
Section 12: Intro to Devices Extensive reading materials on reserve, including Robert F. Pierret, Semiconductor Device Fundamentals EE143 Ali Javey Bond Model of Electrons and Holes Si Si Si Si Si Si Si
More informationPractice 3: Semiconductors
Practice 3: Semiconductors Digital Electronic Circuits Semester A 2012 VLSI Fabrication Process VLSI Very Large Scale Integration The ability to fabricate many devices on a single substrate within a given
More informationLecture 0: Introduction
Lecture 0: Introduction Introduction q Integrated circuits: many transistors on one chip q Very Large Scale Integration (VLSI): bucketloads! q Complementary Metal Oxide Semiconductor Fast, cheap, low power
More informationEE 505. Lecture 11. Offset Voltages DAC Design
EE 505 Lecture 11 Offset Voltages DC Design Offset Voltages ll DCs have comparators and many DCs and DCs have operational amplifiers The offset voltages of both amplifiers and comparators are random variables
More informationChapter 2 Process Variability. Overview. 2.1 Sources and Types of Variations
Chapter 2 Process Variability Overview Parameter variability has always been an issue in integrated circuits. However, comparing with the size of devices, it is relatively increasing with technology evolution,
More informationEE 330 Lecture 16. MOS Device Modeling p-channel n-channel comparisons Model consistency and relationships CMOS Process Flow
EE 330 Lecture 16 MOS Device Modeling p-channel n-channel comparisons Model consistency and relationships CMOS Process Flow Review from Last Time Operation Regions by Applications Id I D 300 250 200 150
More informationEE105 - Fall 2006 Microelectronic Devices and Circuits
EE105 - Fall 2006 Microelectronic Devices and Circuits Prof. Jan M. Rabaey (jan@eecs) Lecture 7: MOS Transistor Some Administrative Issues Lab 2 this week Hw 2 due on We Hw 3 will be posted same day MIDTERM
More informationnmos IC Design Report Module: EEE 112
nmos IC Design Report Author: 1302509 Zhao Ruimin Module: EEE 112 Lecturer: Date: Dr.Zhao Ce Zhou June/5/2015 Abstract This lab intended to train the experimental skills of the layout designing of the
More informationFig. 1 CMOS Transistor Circuits (a) Inverter Out = NOT In, (b) NOR-gate C = NOT (A or B)
1 Introduction to Transistor-Level Logic Circuits 1 By Prawat Nagvajara At the transistor level of logic circuits, transistors operate as switches with the logic variables controlling the open or closed
More informationLecture 12: MOSFET Devices
Lecture 12: MOSFET Devices Gu-Yeon Wei Division of Engineering and Applied Sciences Harvard University guyeon@eecs.harvard.edu Wei 1 Overview Reading S&S: Chapter 5.1~5.4 Supplemental Reading Background
More informationEECS130 Integrated Circuit Devices
EECS130 Integrated Circuit Devices Professor Ali Javey 10/30/2007 MOSFETs Lecture 4 Reading: Chapter 17, 19 Announcements The next HW set is due on Thursday. Midterm 2 is next week!!!! Threshold and Subthreshold
More informationIntroduction and Background
Analog CMOS Integrated Circuit Design Introduction and Background Dr. Jawdat Abu-Taha Department of Electrical and Computer Engineering Islamic University of Gaza jtaha@iugaza.edu.ps 1 Marking Assignments
More informationLecture Outline. ESE 570: Digital Integrated Circuits and VLSI Fundamentals. Review: MOSFET N-Type, P-Type. Semiconductor Physics.
ESE 57: Digital Integrated Circuits and VLSI Fundamentals Lec 4: January 24, 217 MOS Transistor Theory, MOS Model Lecture Outline! Semiconductor Physics " Band gaps " Field Effects! MOS Physics " Cutoff
More informationChapter 20. Current Mirrors. Basics. Cascoding. Biasing Circuits. Baker Ch. 20 Current Mirrors. Introduction to VLSI
Chapter 20 Current Mirrors Basics Long Channel Matching Biasing Short Channel Temperature Subthreshold Cascoding Simple Low Voltage, Wide Swing Wide Swing, Short Channel Regulated Drain Biasing Circuits
More informationESE 570: Digital Integrated Circuits and VLSI Fundamentals
ESE 570: Digital Integrated Circuits and VLSI Fundamentals Lec 4: January 29, 2019 MOS Transistor Theory, MOS Model Penn ESE 570 Spring 2019 Khanna Lecture Outline! CMOS Process Enhancements! Semiconductor
More informationEEC 116 Lecture #3: CMOS Inverters MOS Scaling. Rajeevan Amirtharajah University of California, Davis Jeff Parkhurst Intel Corporation
EEC 116 Lecture #3: CMOS Inverters MOS Scaling Rajeevan Amirtharajah University of California, Davis Jeff Parhurst Intel Corporation Outline Review: Inverter Transfer Characteristics Lecture 3: Noise Margins,
More informationEE 230 Lecture 31. THE MOS TRANSISTOR Model Simplifcations THE Bipolar Junction TRANSISTOR
EE 23 Lecture 3 THE MOS TRANSISTOR Model Simplifcations THE Bipolar Junction TRANSISTOR Quiz 3 Determine I X. Assume W=u, L=2u, V T =V, uc OX = - 4 A/V 2, λ= And the number is? 3 8 5 2? 6 4 9 7 Quiz 3
More informationBoosting the MOSFETs Matching by Using Diamond Layout Style
Vinicius Vono Peruzzi 1 ; Christian Renaux 2 ; Denis Flandre 2, Senior Member, IEEE; Salvador Pinillos Gimenez 1, Member, IEEE; 1 Department of Electrical Engineering, Centro Universitário da FEI (FEI),
More informationECE 546 Lecture 10 MOS Transistors
ECE 546 Lecture 10 MOS Transistors Spring 2018 Jose E. Schutt-Aine Electrical & Computer Engineering University of Illinois jesa@illinois.edu NMOS Transistor NMOS Transistor N-Channel MOSFET Built on p-type
More informationCircuits. L5: Fabrication and Layout -2 ( ) B. Mazhari Dept. of EE, IIT Kanpur. B. Mazhari, IITK. G-Number
EE610: CMOS Analog Circuits L5: Fabrication and Layout -2 (12.8.2013) B. Mazhari Dept. of EE, IIT Kanpur 44 Passive Components: Resistor Besides MOS transistors, sometimes one requires to implement passive
More informationClassification of Solids
Classification of Solids Classification by conductivity, which is related to the band structure: (Filled bands are shown dark; D(E) = Density of states) Class Electron Density Density of States D(E) Examples
More informationEE 434 Lecture 33. Logic Design
EE 434 Lecture 33 Logic Design Review from last time: Ask the inverter how it will interpret logic levels V IN V OUT V H =? V L =? V LARGE V H V L V H Review from last time: The two-inverter loop X Y X
More informationScaling Impact on Analog Circuit Performance
ICTP Microprocessor Laboratory Second Central American Regional Course on Advanced VLSI Design Techniques Benemérita Universidad Autónoma de Puebla, Puebla, Mexico 29 November 17 December 2004 Scaling
More informationToday s lecture. EE141- Spring 2003 Lecture 4. Design Rules CMOS Inverter MOS Transistor Model
- Spring 003 Lecture 4 Design Rules CMOS Inverter MOS Transistor Model Today s lecture Design Rules The CMOS inverter at a glance An MOS transistor model for manual analysis Important! Labs start next
More information6.776 High Speed Communication Circuits Lecture 10 Noise Modeling in Amplifiers
6.776 High Speed Communication Circuits Lecture 10 Noise Modeling in Amplifiers Michael Perrott Massachusetts Institute of Technology March 8, 2005 Copyright 2005 by Michael H. Perrott Notation for Mean,
More information! CMOS Process Enhancements. ! Semiconductor Physics. " Band gaps. " Field Effects. ! MOS Physics. " Cut-off. " Depletion.
ESE 570: Digital Integrated Circuits and VLSI Fundamentals Lec 4: January 9, 019 MOS Transistor Theory, MOS Model Lecture Outline CMOS Process Enhancements Semiconductor Physics Band gaps Field Effects
More informationMOS Transistor Theory
MOS Transistor Theory So far, we have viewed a MOS transistor as an ideal switch (digital operation) Reality: less than ideal EE 261 Krish Chakrabarty 1 Introduction So far, we have treated transistors
More informationESE 570 MOS TRANSISTOR THEORY Part 1. Kenneth R. Laker, University of Pennsylvania, updated 5Feb15
ESE 570 MOS TRANSISTOR THEORY Part 1 TwoTerminal MOS Structure 2 GATE Si Oxide interface n n Mass Action Law VB 2 Chemical Periodic Table Donors American Chemical Society (ACS) Acceptors Metalloids 3 Ideal
More informationUniversity of Pennsylvania Department of Electrical Engineering. ESE 570 Midterm Exam March 14, 2013 FORMULAS AND DATA
University of Pennsylvania Department of Electrical Engineering ESE 570 Midterm Exam March 4, 03 FORMULAS AND DATA. PHYSICAL CONSTANTS: n i = intrinsic concentration undoped) silicon =.45 x 0 0 cm -3 @
More informationThin Film Transistors (TFT)
Thin Film Transistors (TFT) a-si TFT - α-si:h (Hydrogenated amorphous Si) deposited with a PECVD system (low temp. process) replaces the single crystal Si substrate. - Inverted staggered structure with
More informationESE 570: Digital Integrated Circuits and VLSI Fundamentals
ESE 570: Digital Integrated Circuits and VLSI Fundamentals Lec 5: January 25, 2018 MOS Operating Regions, pt. 1 Lecture Outline! 3 Regions of operation for MOSFET " Subthreshold " Linear " Saturation!
More informationEKV MOS Transistor Modelling & RF Application
HP-RF MOS Modelling Workshop, Munich, February 15-16, 1999 EKV MOS Transistor Modelling & RF Application Matthias Bucher, Wladek Grabinski Electronics Laboratory (LEG) Swiss Federal Institute of Technology,
More informationPreviously. ESE370: Circuit-Level Modeling, Design, and Optimization for Digital Systems. Today. Variation Types. Fabrication
ESE370: Circuit-Level Modeling, Design, and Optimization for Digital Systems Previously Understand how to model transistor behavior Given that we know its parameters V dd, V th, t OX, C OX, W, L, N A Day
More informationLecture 15: MOS Transistor models: Body effects, SPICE models. Context. In the last lecture, we discussed the modes of operation of a MOS FET:
Lecture 15: MOS Transistor models: Body effects, SPICE models Context In the last lecture, we discussed the modes of operation of a MOS FET: oltage controlled resistor model I- curve (Square-Law Model)
More informationExtensive reading materials on reserve, including
Section 12: Intro to Devices Extensive reading materials on reserve, including Robert F. Pierret, Semiconductor Device Fundamentals EE143 Ali Javey Bond Model of Electrons and Holes Si Si Si Si Si Si Si
More informationEE105 Fall 2014 Microelectronic Devices and Circuits. NMOS Transistor Capacitances: Saturation Region
EE105 Fall 014 Microelectronic Devices and Circuits Prof. Ming C. Wu wu@eecs.berkeley.edu 511 Sutardja Dai Hall (SDH) 1 NMOS Transistor Capacitances: Saturation Region Drain no longer connected to channel
More informationEE105 - Fall 2005 Microelectronic Devices and Circuits
EE105 - Fall 005 Microelectronic Devices and Circuits ecture 7 MOS Transistor Announcements Homework 3, due today Homework 4 due next week ab this week Reading: Chapter 4 1 ecture Material ast lecture
More informationMicroelectronics Part 1: Main CMOS circuits design rules
GBM8320 Dispositifs Médicaux telligents Microelectronics Part 1: Main CMOS circuits design rules Mohamad Sawan et al. Laboratoire de neurotechnologies Polystim! http://www.cours.polymtl.ca/gbm8320/! med-amine.miled@polymtl.ca!
More informationLecture 12: MOS Capacitors, transistors. Context
Lecture 12: MOS Capacitors, transistors Context In the last lecture, we discussed PN diodes, and the depletion layer into semiconductor surfaces. Small signal models In this lecture, we will apply those
More informationECE 497 JS Lecture - 12 Device Technologies
ECE 497 JS Lecture - 12 Device Technologies Spring 2004 Jose E. Schutt-Aine Electrical & Computer Engineering University of Illinois jose@emlab.uiuc.edu 1 NMOS Transistor 2 ρ Source channel charge density
More information! CMOS Process Enhancements. ! Semiconductor Physics. " Band gaps. " Field Effects. ! MOS Physics. " Cut-off. " Depletion.
ESE 570: Digital Integrated Circuits and VLSI Fundamentals Lec 4: January 3, 018 MOS Transistor Theory, MOS Model Lecture Outline! CMOS Process Enhancements! Semiconductor Physics " Band gaps " Field Effects!
More informationThe Future of CMOS. David Pulfrey. CHRONOLOGY of the FET. Lecture Lilienfeld s patent (BG FET) 1965 Commercialization (Fairchild)
The Future of CMOS David Pulfrey 1 CHRONOLOGY of the FET 1933 Lilienfeld s patent (BG FET) 1965 Commercialization (Fairchild) 1991 The most abundant object made by mankind (C.T. Sah) 2003 The 10 nm FET
More information3. Design a stick diagram for the PMOS logic shown below [16] Y = (A + B).C. 4. Design a layout diagram for the CMOS logic shown below [16]
Code No: RR420203 Set No. 1 1. (a) Find g m and r ds for an n-channel transistor with V GS = 1.2V; V tn = 0.8V; W/L = 10; µncox = 92 µa/v 2 and V DS = Veff + 0.5V The out put impedance constant. λ = 95.3
More informationCMOS Inverter (static view)
Review: Design Abstraction Levels SYSTEM CMOS Inverter (static view) + MODULE GATE [Adapted from Chapter 5. 5.3 CIRCUIT of G DEVICE Rabaey s Digital Integrated Circuits,, J. Rabaey et al.] S D Review:
More informationPart 4: Heterojunctions - MOS Devices. MOSFET Current Voltage Characteristics
MOS Device Uses: Part 4: Heterojunctions - MOS Devices MOSCAP capacitor: storing charge, charge-coupled device (CCD), etc. MOSFET transistor: switch, current amplifier, dynamic random access memory (DRAM-volatile),
More informationEE5311- Digital IC Design
EE5311- Digital IC Design Module 1 - The Transistor Janakiraman V Assistant Professor Department of Electrical Engineering Indian Institute of Technology Madras Chennai October 28, 2017 Janakiraman, IITM
More informationECEN474/704: (Analog) VLSI Circuit Design Spring 2018
ECEN474/704: (Analog) SI Circuit Design Spring 2018 ecture 2: MOS ransistor Modeling Sam Palermo Analog & Mixed-Signal Center exas A&M University Announcements If you haven t already, turn in your 0.18um
More informationVariability Aware Statistical Timing Modelling Using SPICE Simulations
Variability Aware Statistical Timing Modelling Using SPICE Simulations Master Thesis by Di Wang Informatics and Mathematical Modelling, Technical University of Denmark January 23, 2008 2 Contents List
More informationELEC 3908, Physical Electronics, Lecture 26. MOSFET Small Signal Modelling
ELEC 3908, Physical Electronics, Lecture 26 MOSFET Small Signal Modelling Lecture Outline MOSFET small signal behavior will be considered in the same way as for the diode and BJT Capacitances will be considered
More informationAnalysis and Design of Analog Integrated Circuits Lecture 14. Noise Spectral Analysis for Circuit Elements
Analysis and Design of Analog Integrated Circuits Lecture 14 Noise Spectral Analysis for Circuit Elements Michael H. Perrott March 18, 01 Copyright 01 by Michael H. Perrott All rights reserved. Recall
More informationAE74 VLSI DESIGN JUN 2015
Q.2 a. Write down the different levels of integration of IC industry. (4) b. With neat sketch explain briefly PMOS & NMOS enhancement mode transistor. N-MOS enhancement mode transistor:- This transistor
More informationDigital Integrated Circuits EECS 312
14 12 10 8 6 Fujitsu VP2000 IBM 3090S Pulsar 4 IBM 3090 IBM RY6 CDC Cyber 205 IBM 4381 IBM RY4 2 IBM 3081 Apache Fujitsu M380 IBM 370 Merced IBM 360 IBM 3033 Vacuum Pentium II(DSIP) 0 1950 1960 1970 1980
More informationIon Implantation. alternative to diffusion for the introduction of dopants essentially a physical process, rather than chemical advantages:
Ion Implantation alternative to diffusion for the introduction of dopants essentially a physical process, rather than chemical advantages: mass separation allows wide varies of dopants dose control: diffusion
More informationECE 438: Digital Integrated Circuits Assignment #4 Solution The Inverter
ECE 438: Digital Integrated Circuits Assignment #4 The Inverter Text: Chapter 5, Digital Integrated Circuits 2 nd Ed, Rabaey 1) Consider the CMOS inverter circuit in Figure P1 with the following parameters.
More informationLecture 11: MOSFET Modeling
Digital Integrated Circuits (83-313) Lecture 11: MOSFET ing Semester B, 2016-17 Lecturer: Dr. Adam Teman TAs: Itamar Levi, Robert Giterman 18 June 2017 Disclaimer: This course was prepared, in its entirety,
More informationThe Devices. Digital Integrated Circuits A Design Perspective. Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic. July 30, 2002
Digital Integrated Circuits A Design Perspective Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic The Devices July 30, 2002 Goal of this chapter Present intuitive understanding of device operation Introduction
More informationThe Devices. Devices
The The MOS Transistor Gate Oxyde Gate Source n+ Polysilicon Drain n+ Field-Oxyde (SiO 2 ) p-substrate p+ stopper Bulk Contact CROSS-SECTION of NMOS Transistor Cross-Section of CMOS Technology MOS transistors
More informationThis is the author s final accepted version.
Al-Ameri, T., Georgiev, V.P., Adamu-Lema, F. and Asenov, A. (2017) Does a Nanowire Transistor Follow the Golden Ratio? A 2D Poisson- Schrödinger/3D Monte Carlo Simulation Study. In: 2017 International
More informationELEC 3908, Physical Electronics, Lecture 27. MOSFET Scaling and Velocity Saturation
ELEC 3908, Physical Electronics, Lecture 27 MOSFET Scaling and Velocity Saturation Lecture Outline Industry push is always to pack more devices on a chip to increase functionality, which requires making
More informationMicroelectronics Main CMOS design rules & basic circuits
GBM8320 Dispositifs médicaux intelligents Microelectronics Main CMOS design rules & basic circuits Mohamad Sawan et al. Laboratoire de neurotechnologies Polystim mohamad.sawan@polymtl.ca M5418 6 & 7 September
More informationENGR890 Digital VLSI Design Fall Lecture 4: CMOS Inverter (static view)
ENGR89 Digital VLSI Design Fall 5 Lecture 4: CMOS Inverter (static view) [Adapted from Chapter 5 of Digital Integrated Circuits, 3, J. Rabaey et al.] [Also borrowed from Vijay Narayanan and Mary Jane Irwin]
More information