HCB1608 Series FEATURES DIMENSIONS. Chip Size:1608 B C PART NUMBERING. High Current Ferrite Chip Bead APPLICATIONS. All dimensions in units:mm
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1 FETUES losed Magneic circui srucure allows high densiy mouning while prevening crossalk. Exremely high reliabiliy due o enirely monolihic consrucion. Low resisance srucure of elecrode o preven waseful elecric power consumpion. High urren raing up o 6. The producs conain no lead and also suppor lead-free soldering. PPLITIONS Personal compuers,ommunicaion equipmen,igial elephone,elecronic games machines,ts,hard disk drives,cellular phones,ps,priners High curren lines and oher compuer peripheral producs. IMENSIONS hip Size: ±.15.8±.15.8±.15.3±.2 ll dimensions in unis:mm PT NUMEING H 168 K F 3 T 3 Series Name imension ( x ) aed urren 3=3m Packaging (T=Taping and eel, =ulk<ags>) M Maerial illevel Impedance (3=3Ω) 3Ω) Lead Free ode hp:// sales@coils-ec h. c om 1/5
2 SPEIFITION Par Number lmpedance (Ohm) Tes Frequency (MHz) aed urren (m)max. (Ohm)max. H168KF-3T3 3±25% H168KF-8T3 8±25% H168KF-121T2 12±25% H168KF-151T2 15±25% H168KF-221T2 22±25% H168KF-31T1 3±25% H168KF-471T1 47±25% H168KF-61T1 6±25% eraing urve For he ferrie chip bead which wihsanding curren over 1.5, as he operaing emperaure over 85, he deraing curren informaion is necessary o consider wih. For he deail deraing of curren, please refer o he eraed urren vs. Operaing Temperaure curve. Typical Impedance V.s. Frequency urve 12 H168KF-3T3 16 H168KF-8T3 3 H168KF-121T FEQUENY(MHz) FEQUENY(MHz) FEQUENY(MHz) hp:// sales@coils-ec h. c om 2/5
3 SOLEING N MOUNTING EOMMENE P O PTTEN L Land Paerns For eflow Soldering H Size L G H G Upper limi ecommendable ccordingly increasing he solder volume, he mechanical sress o produc is also increased. Exceeding solder volume may cause he failure of mechanical or elerical performance. Solder shall be used no o be exceed as shown in lef side. hp:// sales@coils-ec h. c om 3/5
4 EOMMENE SOLEING ONITIONS eflow Soldering Wave Soldering TEMPETU E( ) TP( PE- HETING SOLEING NTUL OOLING o c/ 1s max.) 6~18s 2~4s 6~15s TEM PETU E( ) PE-HETI NG SOLEI NG NTUL OOLING 48s max. 25 TIME(sec.) Over 2min. Gradual cooling wihin 1sec. TIME(sec.) PKGING INFOMTION 2± "x8mm Type 7" x 8mm 9±.5 6±2 13.5±.5 178±2 hp:// sales@coils-ec h. c om 4/5
5 Series o o Ko P Series o o Ko P ±.5 1.5±.5.95±.5 4.±.1.95± ±.1 1.5±.1 1.5±.1 4.±.1.23±.5 none PKGING QUNTITY Size 1688 hip/eel Inner ox Middle ox aron pplicaion Noice Sorage ondiions To mainain he solderabiliy of erminal elecrodes: 1. Temperaure and humidiy condiions:-1~4 and 3~7% H. 2. ecommended producs should be used wihin 6 monhs from he ime of delivery. 3. The packaging maerial should be kep where on chlorine or sulfur exiss in he air. Transporaion 1. Producs should be handled wih care o avoid damage or conaminaion from perspiraion and skin oils. 2. The use of weezers or vacuum pick up is srongly recommended for individual componens. 3. ulk handling should ensure ha abrasion and mechanical shock are minimized. ll he daa lised in his caalogue are for reference only, OILS-TEH reserves he righ o aler. Specificaions are subjec o change wihou noice. hp:// sales@coils-ec h. c om 5/5
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