Multi-Layer Ferrite Chip Beads

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Multi-Layer Ferrite Chip Beads ODEING CODE BP 3 T T S PODUCT CODE BF : For General Signal Lines BP : For Power Lines BH : For High Speed Signal Lines (1MHz~) BS : For Higher Speed Signal Lines (MHz~)

1 Multi-Layer Ferrite Chip Beads ODEING CODE BP 3 T T S PODUCT CODE BF : For General Signal Lines BP : For Power Lines BH : For High Speed Signal Lines (1MHz~) BS : For Higher Speed Signal Lines (MHz~) DIMENSION (L W) Code Dimension EIA Code Dimension EIA mm mm mm mm mm 63 IMPEDANCE CODE Code (Ω) TOLEANCE CODE T= ± % PACKAGING CODE T = Paper Tape P = Embossed Tape TYPE CODE S=Standard Type =Low DC B=GHz Band Type U=High GHz Band Type THICKNESS CODE(mm) 3=.3 =. 8=.8 9=.9 B=1.1 1 ev.2161

2 EMI Suppression Standard External Dimensions Unit: mm/(inch) Series L W 63 (21) (2) 168 (63) 212 (8) 3216 (126).6±.3 (.2 ±.1) 1. ±.1 (. ±.) 1.6 ±.2 (.63 ±.8) 2. +/-.2 (.79 +/-.8) 3.2 +/-.2 (.126 +/-.8).3 ±.3 (.12 ±.1). ±.1 (.2 ±.).8 ±.2 (.31 ±.8) 1.2 +/-.2 (.7 +/-.8) 1.6 +/-.2 (.63 +/-.8) A (Min/Max). ±. (.6 ±.2). ±. (.1 ±.6).3 ±.2 (.12 ±.8). +/-.3 (.2 +/-.12). +/-.3 (.2 +/-.12) ecommended pad dimensions Land Pattern Soldering SMD resist Inductor c b a Size mm (EIA) L x W (mm) a (mm) b (mm) c (mm) 63(21).6*.3.2 to.3.2 to.3. to. (2) 1.*..3 to..3 to.. to. 168 (63) 1.6*.8.7 to 1..6 to.8.7 to (8) 2.* to to.9 1. to (126) 3.2* to to to 1.6 2

3 Beads For Power Lines (BP series) Feature The BP series can be used on high current circuits due to its low DC resistance. It can meet power lines to the maximum at DC. Application 1. This series is suitable for EMI suppression of the high DC current power line. 2. Various power lines of electronic equipment. 3. Mother board, tablet PC, notebook, desktop computers and peripheral equipment.. DSC, DVC, LCD Television, Set Top Box.. Digital communication equipment. Part Numbers & Characteristic BP63 series (EIA 21 Size) Type Standard Ordering Code (Ω)±% Test Frequency (MHz) DC esistance (Ω) MA. ated Current (ma) MA. Thickness (mm) BP631TTS ,3.3 ±.3 BP6322TTS ,.3 ±.3 BP6333TTS ,.3 ±.3 BP638TTS ,.3 ±.3 BP63121TTS ±.3 OPEATING TEMPEATUE ANGE: - TO +8 BP series (EIA 2 Size) Type Standard Ordering Code (Ω)±% Test Frequency (MHz) DC esistance (Ω) MA. ated Current (ma) MA. Thickness (mm) BP1TTS ,. ±.1 BP6TTS ,7. ±.1 BP8TTS ,. ±.1 BP121TTS ,. ±.1 BP181TTS ,2. ±.1 BP221TTS ±.1 BP331TTS ±.1 BP61TTS ±.1 1 Type GHz Band DC esistance ated Current Thickness Ordering Code at 1MHZ at 1GHZ (Ω) MA. (ma) MA. (mm) (Ω)±% (Ω)±% BP121TTB ,. ±.1 BP221TTB ±.1 OPEATING TEMPEATUE ANGE: - TO +1 BP168 series (EIA 63 Size) Type Standard Low DC Ordering Code (Ω)±% Test Frequency (MHz) DC esistance (Ω) MA. ated Current (ma) MA. Thickness (mm) BP1683TTS ,.8 ±.2 BP16833TTS ,.8 ±.2 BP1687TTS ,.8 ±.2 BP1686TTS ,.8 ±.2 BP1688TTS ,.8 ±.2 BP16811TTS ,.8 ±.2 BP168121TTS ,.8 ±.2 BP1681TTS8 1. 3,.8 ±.2 BP168181TTS ,.8 ±.2 BP168221TTS ,.8 ±.2 BP16831TTS ,.8 ±.2 BP168331TTS ,7.8 ±.2 BP16871TTS ,.8 ±.2 BP16861TTS ,.8 ±.2 BP16826TT ,.8 ±. BP1683TT ,.8 ±. BP16861TT ,.8 ±. 1 EMI Suppression Multi-Layer Ferrite Bead for Power Lines 3 ev.2161

4 Type GHz Band Ordering Code at 1MHZ (Ω)±% at 1GHZ (typ.) DC esistance (Ω) MA. ated Current (ma) MA. Thickness (mm) BP16811TTB ±. BP168221TTB ±. OPEATING TEMPEATUE ANGE: - TO +1 BP212 series (EIA 8 Size) Type Standard Ordering Code (Ω) ±% Test Frequency (MHz) DC esistance (Ω) MA. ated Current (ma) MA. Thickness (mm) BP2127TTS ,.9 ±.2 BP21211TTS ,.9 ±.2 BP21222TTS ,.9 ±.2 BP2123TTS ,.9 ±.2 BP21TTS9 1.2,.9 ±.2 BP2126TTS9 6 1.,.9 ±.2 BP2128TTS ,.9 ±.2 BP21211TTS ,.9 ±.2 BP212121TTS ,.9 ±.2 BP212221TTS ,.9 ±.2 BP21231TTS ,.9 ±.2 BP212331TTS ,.9 ±.2 BP21261TTS ,.9 ±.2 BP21212TTS ,.9 ±.2 BP212122TTS ,.9 ±.2 OPEATING TEMPEATUE ANGE: - TO +1 TYPICAL ELECTICAL CHAACTEISTICS (IMPEDANCE VS FEQUENCY) BP63 series (EIA 21 Size) Freq.(MHz) , BP63121TTS EMI Suppression Multi-Layer Ferrite Bead for Power Lines BP631TTS BP6322TTS BP6333TTS BP638TTS3 1 1 Freq.(MHz) 1 1, 1 1 Freq.(MHz) 1 1, 1 1 Freq.(MHz) 1 1, Freq.(MHz) 1 1, BP series (EIA 2 Size) BP1TTS Freq.(MHz) 1 1, BP6TTS Freq.(MHz) 1 1, BP8TTS Freq.(MHz) 1 1, BP121TTS Freq.(MHz) 1 1,

5 BP181TTS Freq.(MHz) 1 1, BP221TTS Freq.(MHz) 1 1, BP331TTS Freq.(MHz) 1 1, BP61TTS Freq.(MHz) 1 1, BP121TTB 3 2 BP221TTB Freq.(MHz) 1 1, 1 1 Freq.(MHz) 1 1, BP168 series (EIA 63 Size) BP1683TTS Freq.(MHz) 1 1, BP16833TTS Freq.(MHz) 1 1, BP1687TTS Freq.(MHz) 1 1, BP1686TTS Freq.(MHz) 1 1, BP1688TTS Freq.(MHz) 1 1, BP16811TTS Freq.(MHz) 1 1, BP168121TTS8 1 1 Freq.(MHz) 1 1, BP1681TTS Freq.(MHz) 1 1, BP168181TTS Freq.(MHz) 1 1, BP168221TTS Freq.(MHz) 1 1, BP16831TTS Freq.(MHz) 1 1, BP168331TTS Freq.(MHz) 1 1, BP16871TTS Freq.(MHz) 1 1, BP16861TTS Freq.(MHz) 1 1, BP16826TT BP1683TT BP16861TT8 1 1 Freq.(MHz) 1 1, 1 1 Freq.(MHz) 1 1, 1 1 Freq.(MHz) 1 1, ev.2161

6 Freq.(MHz) 1 1, BP212 series (EIA 8 Size) EMI Suppression Multi-Layer Ferrite Bead for Power Lines BP16811TTB8 3 2 BP168221TTB Freq.(MHz) 1 1, BP2127TTS Freq.(MHz) 1 1, BP21TTS9 9 BP21211TTS Freq.(MHz) 1 1, BP2126TTS9 12 BP21222TTS Freq.(MHz) 1 1, BP2128TTS9 1 BP2123TTS Freq.(MHz) 1 1, BP21211TTS Freq.(MHz) 1 1, BP212121TTS Freq.(MHz) 1 1, BP212221TTS Freq.(MHz) 1 1, BP21231TTS9 1 1 Freq.(MHz) 1 1, BP212331TTS Freq.(MHz) 1 1, BP21261TTS Freq.(MHz) , BP21212TTS9 1, Freq.(MHz) , BP212122TTS9 1, Freq.(MHz) 1 1, , 8 6 1,2 1, Freq.(MHz) 1 1, 1 1 Freq.(MHz) 1 1, 1 1 Freq.(MHz) 1 1, 6

7 Testing Condition & equirements No. Item Test Condition equirements 1 Appearance Ferrite Beads shall be visually inspected for visible evidence of defect. In accordance with specification. 2 Measuring frequency:1±1mhz Applied Voltage: mv Measuring equipment and fixture: 63: HP291A A : HP291B A 168: HP291B A 212: HP291A A 3216: HP291A A Within specified tolerance. 3 DC esistance a. Temperature: ±3 b. elative Humidity: ~7%H c. Measuring equipment: HP 338 Dimension Dimension shall be measured with caliper or micrometer In accordance with electrical specification. In accordance with dimension specification. Solder-ability Preheat:,6 seconds Solder temperature: ± Flux: osin Dip time: ±1 seconds More than 7% of the terminal electrode part shall be covered with new solder. Solder the chip to test jig then apply a force in the direction shown in below. The soldering shall be done with the reflow method and shall be conducted with care so that the soldering is uniform and free of defects such as heat shock. 6 Bending Strength No mechanical damage shall be observed. Preheat:,6 seconds Solder temperature: 27± Flux: osin Dip time: 1±1 seconds 7 esistance to Soldering Heat BH BS_Series Preheating temperature : The chip shall not be cracks. More than 7% of terminal electrode shall be covered with solder. to 18 Preheating time :3 min. Preheat:,6 seconds Solder temperature: 26± Flux: osin Dip time: 1±. seconds 7 ev.2161

8 EMI Suppression Multi-Layer Ferrite Bead Humidity: 9 to 9% H. Temperature: ±2 Testing time: ±12 hours 8 High Humidity Load Life Test Humidity: 9 to 9% H. Temperature: ±2 BH_Series Testing time: +2/- hours No visible damage. : Within±3% of the initial value. ecovery:2 to 3 hrs of recovery under the standard condition after the removal from test chamber. Measurement: After placing for 2±2 hours min. BH_Series Measurement: After placing for 8±2 hours min. Temperature:Maximum and Minimum,kept stabilized for 3±3 minutes each 9 Thermal Shock Cycle: cycles Measurement: After placing for 2±2 hours min. BH_Series Measurement: After placing for 8±2 hours min. No visible damage : Within±3% of the initial value. Temperature: 8±3 (BP_63 Series) 1±3 Testing time: ±12 hours 1 High Temperature Load BH_Series Temperature: 1±3 Testing time: +2/- hours No visible damage. : Within±3% of the initial value. ecovery:2 to 3 hrs of recovery under the standard condition after the removal from test chamber. Measurement: After placing for 2±2 hours min. BH_Series Measurement: After placing for 8±2 hours min. 8

9 Temperature ( ) Temperature ( ) Soldering Profile for SMT Process with SnPb Solder Paste. The rate of preheat should not exceed /sec and a target of 2 /sec is preferred. Ceramic chip components should be preheated to within 1 to 13 of the soldering. 3 Soldering 22 to 23 ~ 1 sec. 2 Gradual Natural Cooling Preheating over 1 min over 1 min Over 2,within sec Time (sec.) Soldering Profile for SMT Process with Lead Free Solder Paste. The rate of preheat should not exceed /sec and a target of 2 /sec is preferred. Ceramic chip components should be preheated to within 1 to 13 of the soldering. 3 Soldering 2 to 26 ~ 1 sec. 2 Gradual Natural Cooling Preheating over 1 min over 1 min Over 2,within 9sec Time (sec.) 9 ev.2161

10 EMI Suppression Packaging Specification Paper Tape Material:Paper ( Dimensions in mm) TYPE A B W P T CHIPS / EEL , , , , Embossed Tape Material:Embossed ( Dimensions in mm) TYPE A B W P T CHIPS / EEL , eel dimensions Dimensions in mm TYPE mm 8mm A 178±2 178±2 B 21.±.8 21.±.8 C 13.±.8 13.±.8 G. 1. N 7 7 T

SB/PB Series. Multilayer Ferrite Chip Beads. [ PB Series for Large Current ] APPLICATIONS OUTLINE PRODUCT IDENTIFICATION FEATURES

SB/PB Series. Multilayer Ferrite Chip Beads. [ PB Series for Large Current ] APPLICATIONS OUTLINE PRODUCT IDENTIFICATION FEATURES YAGEO COPOATION SMD INDUCTO/BEADS Multilayer Ferrite Chip Beads SB/PB Series [ PB Series for Large Current ] APPLICATIONS Prevention of high frequency EMI form computers, printers, VCs, TVs, wireless telephone