ACX Advanced Ceramic X
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1 BF 1411 Series Multilayer Chip Band-Pass Filters Features Ultra small SMD type with low loss at passband and high attenuation at stop-band. RoHS compliant Applications 2.4 GHz wireless communication systems, including, WLAN card, Bluetooth modules, etc. Specifications Part Number BF1411- K2R4NCA Freq. Range (MHz) 2400 ~ 2500 Insertion 1.8 C 2.4 C Return BW(dB) 10 min. Frequency Attenuation (db) 824~ 915 MHz 30 min ~ 1605 MHz 30 min ~ 1990 MHz 30 min MHz 20 min. 4800~5000 MHz 35 min. 7200~7500 MHz 22 min. Q ty/reel (pcs) : 4,000 Operating Temperature Range : -40 ~ +85 o C Storage Temperature Range : -40 ~ +85 o C Storage Period : 12 months max.* *12 months in vacuum sealed bag and 1 week after opened. Please keep unused parts in vacuum sealed bags. Solder Paste : SAC 305 type is recommended. Power Capacity : 1W max. Part Number BF K 2R4 NCA /LF Type BF : Band-Pass Filter Dimensions ( L W ) mm Material Code K Frequency Range 2R4=2400MHz Specification Code NCA Packaging T: Tape & Reel B: Bulk Soldering LF=lead-free BF1411-K2R4NCAT/LF REV:5 PAGE:1/7
2 Terminal Configuration <Top View> No. Terminal Name No. Terminal Name IN OUT GND GND GND Dimensions and Recommended PC Board Pattern b Unit : mm W a d T c c L L < Bottom View> < Side View > Mark L W T a b c d Dimensions 0.8 max Solder Resist * * Land Through-hole ( 0.2) 0.25 * Line width should be designed to match 50 characteristic impedance, depending on PCB material and thickness. BF1411-K2R4NCAT/LF REV:5 PAGE:2/7
3 Measuring Diagram Port 1 Network Analyzer Port 2 (50 ) (50 ) I/O I/O GND Electrical Characteristics (T=25 o C) db(s(2,1)) db(s(2,2)) db(s(1,1)) freq, GHz Notes The contents of this data sheet are subject to change without notice. Please confirm the specifications and delivery conditions when placing your order. BF1411-K2R4NCAT/LF REV:5 PAGE:3/7
4 Taping Specifications Tape Dimensions (Unit: mm) & Quantity T A D 1.75 ± 0.1 C T EMBOSS PAPER TAPE B A E F TAPE Type A A B C D E F T Quantity/reel Tape material ± ± ± 1.65± 2.0± 3.5± 8.0± ± 4,000pcs Paper Reel Dimensions (Unit: mm) Label 1.4 ± ± 1 60±1 Label: Customer s Name, P/N, Q ty, Date, A 13.5±0.5 B Corp. Type A B ± ±0.3 Leader and Trailer Tape Trailer End Trailer (160 mm min.) Empty Compartments with Cover Tape (500 mm min.) BF1411-K2R4NCAT/LF REV:5 PAGE:4/7
5 Peel-off Force Peeling Direction <10 0 Top Cover Tape Carrier Tape Peel-off force should be in the range of N at a peel-off speed of 300±10 mm/min. Storage Conditions (1) Temperature: +5~+35, relative humidity (RH): 45~75%. (2) Non-corrosive environment. Notes The contents of this data sheet are subject to change without notice. Please confirm the specifications and delivery conditions when placing your order. BF1411-K2R4NCAT/LF REV:5 PAGE:5/7
6 Mechanical & Environmental Characteristics Item Requirements Procedure Solderability 2. More than 75% of the terminal 1. Preheat: o C electrode shall be covered with 2. Solder: o C for 5 1 sec new solder. 1. Solder specimen onto test jig. Soldering strength 1. Normail:1kg minimum 2. Apply push force at 0.5mm/s until electrode pads are (Termination series:0.7kg minimum peeled off or ceramic are broken. Pushing force is Adhesion) applied to longitude direction. 1. Solder specimen onto test jig (FR4, 0.8mm) using the recommend soldering profile. 2. Apply a bending force of 2mm deflection. Pressure Rod Deflection (Substrate Bending) 2. Fulfill the electrical specification R230 90mm Heat/Humidity Resistance Thermal shock (Temperature Cycle) Low Temperature Resistance 1. Temperature: 85 2 o C 2. Humidity: 90% ~ 95% RH 2. Fulfill the electrical specification 3. Duration: 1000±48hrs after test 4. Recovery: 1-2hrs 1. One cycle/step 1:125 ± 5 C for 30 min step 2:- 40 ± 5 C for 30 min 2. Fulfill the electrical specification 2. No of cycles:100 after test 3. Recovery:1-2 hrs 1. Temperature: -40 o 5 o C 2. Fulfill the electrical specification 2. Duration: 500 ±24hrs after test 3. Recovery: 1-2hrs BF1411-K2R4NCAT/LF REV:5 PAGE:6/7
7 Soldering Conditions Typical Soldering Profile for Lead-free Process Reflow Soldering : Temperature ( o C) 250 o C 217 o C o C 10s max. Pre-heating 60-90s. Time (s.) s Notes The contents of this data sheet are subject to change without notice. Please confirm the specifications and delivery conditions when placing your order. Corp. 16 Tzu Chiang Road, Hsinchu Industrial District Hsinchu Hsien 303, Taiwan TEL: FAX: acx@acxc.com.tw BF1411-K2R4NCAT/LF REV:5 PAGE:7/7
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