EVERLIGHT ELECTRONICS CO., LTD.

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1 Features Top View White LEDs Lead frame package with individual 2 pins Wide viewing angle Soldering methods: IR reflow soldering ESD protection Pb-free The product itself will remain within RoHS compliant version. Descriptions Due to the package design, has wide viewing angle, low power consumption and white LEDs are devices which are materialized by combing blue chips and special phosphor. This feature makes the LED ideal for light guide application. Applications LCD back light Mobile phones Indicators Illuminations Switch Lights Device Selection Guide Chip Material Emitted Color Resin Color InGaN White Water Clear Everlight Electronics Co., Ltd. Rev. 1 Page: 1 of 12

2 - + Package Outline Dimensions Cathode Mark Polarity Note: Tolerances unless dimension are ±0.1mm, unit = mm. Recommended soldering pad design Everlight Electronics Co., Ltd. Rev. 1 Page: 2 of 12

3 Absolute Maximum Ratings (Ta=25 ) Parameter Symbol Rating Unit Reverse Voltage V R 5 V Forward Current I F 30 ma Peak Forward Current (Duty I FP 100 ma Power Dissipation Pd 110 mw Electrostatic Discharge(HBM)* 1 ESD 2000 V Operating Temperature Topr -40 ~ +85 Storage Temperature Tstg -40 ~ +90 Reflow Soldering: 260 for 10 sec. Soldering Temperature Tsol Hand Soldering: 350 for 3 sec. Note: The products are sensitive to static electricity and must be carefully taken when handling products. Electro-Optical Characteristics (Ta=25 ) Parameter Symbol Min. Typ. Max. Unit Condition Luminous Intensity I V mcd I F =20mA Notes: Viewing Angle 2θ 1/ deg I F =20mA Forward Voltage V F V I F =20mA Reverse Current I R μ A V R =5V 1. Tolerance of Luminous Intensity: ± 11% 2. Tolerance of Forward Voltage: ± 0.05V Everlight Electronics Co., Ltd. Rev. 1 Page: 3 of 12

4 Bin Range of Luminous Intensity Bin Code Min. Max. Unit Condition W X mcd I F =20mA Bin Range of Forward Voltage Group Bin Code Min. Max. Unit Condition G V I F =20mA Notes: 1.Tolerance of Luminous Intensity: ±11% 2.Tolerance of Forward Voltage: ±0.05V Everlight Electronics Co., Ltd. Rev. 1 Page: 4 of 12

5 Bin Range of Chromaticity Coordinates CCT Bin Code CIE_x CIE_y CCT Bin Code CIE_x CIE_y 4500K ~5000K Note: U4 U5 U V K ~5650K V V Tolerance of the Chromaticity Coordinates: ±0.01 V Everlight Electronics Co., Ltd. Rev. 1 Page: 5 of 12

6 The C.I.E Chromaticity Diagram Everlight Electronics Co., Ltd. Rev. 1 Page: 6 of 12

7 Forward Current I F (ma) Relative luminous intensity (%) Relative luminous intensity ) Relative luminous intensity Forward Current ( % ) I (ma) F Typical Electro-Optical Characteristics Curves 100 Spectrum Distribution Ta=25 XC 50 Forward Current vs. Forward Voltage Ta=25 XC Wavelength f(nm) Forward Voltage V (V) F 1000 Relative Luminous Intensity vs. Ambient Temperature (%1000 Relative Luminous Intensity vs. Forward Current Ta=25 XC f=1khz Duty=1/ Ambient Temperature Ta ( XC) Forward Current 2 10 I (ma) F Forward Current Derating Curve Radiation Diagram Ta=25 XC 0 X 10 X 20 X 30 X X Ambient Temperature Ta ( XC) X 60 X 70 X 80 X 90 X Everlight Electronics Co., Ltd. Rev. 1 Page: 7 of 12

8 Label Explanation CAT: Luminous Intensity Rank HUE: Chromaticity Coordinates REF: Forward Voltage Rank Pb CPN : P N : XXXXXXXXXXXXX XXXXXXXXXXXXX EVERLIGHT RoHS QTY : XXX LOT NO : XXXXXXXXXX CAT : XXX HUE : XXX REF : XXX Reference : XXXXXXXX MADE IN TAIWAN Reel Dimensions Note: The tolerances unless mentioned are ±0.1mm, unit = mm. Everlight Electronics Co., Ltd. Rev. 1 Page: 8 of 12

9 Carrier Tape Dimensions: Loaded Quantity 2000 pcs. Per Reel Note: Tolerances unless dimension are ±0.1mm, unit = mm. Moisture Resistant Packaging Label Aluminum moisture-proof bag Desiccant Label Everlight Electronics Co., Ltd. Rev. 1 Page: 9 of 12

10 Reliability Test Items and Conditions The reliability of products shall be satisfied with items listed below. Confidence level:90% LTPD:10% No. Items Test Condition Test Hours/Cycles Sample Size Ac/Re 1 Reflow Soldering 2 Temperature Cycle 3 Thermal Shock Temp. : 260 ±5 Min. 10 sec. H : min 5 min L : min H : min 10 sec L : -10 5min 6 Min. 22 PCS. 0/1 300 Cycles 22 PCS. 0/1 300 Cycles 22 PCS. 0/1 4 High Temperature Storage Temp. : Hrs. 22 PCS. 0/1 5 Low Temperature Storage Temp. : Hrs. 22 PCS. 0/1 6 DC Operating Life I F = 20 ma / Hrs. 22 PCS. 0/1 7 High Temperature / High Humidity 85 /85%RH 1000 Hrs. 22 PCS. 0/1 Everlight Electronics Co., Ltd. Rev. 1 Page: 10 of 12

11 Precautions for Use 1. Over-current-proof Customer must apply resistors for protection, otherwise slight voltage shift will cause big current change ( Burn out will happen ). 2. Storage 2.1 Do not open moisture proof bag before the products are ready to use. 2.2 Before opening the package: The LEDs should be kept at 30 or less and 90%RH or less. 2.3 After opening the package: The LED's floor life is 1 year under 30 or less and 60% RH or less. If unused LEDs remain, it should be stored in moisture proof packages. 2.4 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions. Baking treatment : 60±5 for 24 hours. 3. Soldering Condition 3.1 Pb-free solder temperature profile 1~5 XC / Sec. 1~5 XC / Sec. Pre-heating 180~200 XC 60 Sec. Max. Above 220 XC 260 XC. Max. 10 Sec. Max. 120 Sec. Max Reflow soldering should not be done more than two times. 3.3 When soldering, do not put stress on the LEDs during heating. 3.4 After soldering, do not warp the circuit board. Everlight Electronics Co., Ltd. Rev. 1 Page: 11 of 12

12 4. Soldering Iron Each terminal is to go to the tip of soldering iron temperature less than 350 for 3 seconds within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. Be careful because the damage of the product is often started at the time of the hand solder. 5. Repairing Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. 6. Handling Indications During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound Tel: , Office: No 25, Lane 76, Sec 3, Chung Yang Rd, Fax: , , Tucheng, Taipei 236, Taiwan, R.O.C Everlight Electronics Co., Ltd. Rev. 1 Page: 12 of 12