INPAQ Global RF/Component Solutions

Transcription

1 MIP P Series Specification Product Name Series Power Inductor MIP P Series Size EIAJ

2 Multilayer Power Inductor (MIP P Series) Engineering Spec. PART NUMBER AND CHARACTERISTICS TABLE INPAQ MIP-P series Inductance DCR Rated Current SRF Part No. ±20% (μh) ±25% (Ω) (ma) (MHz) MIPP R47MBE MIPP 1R0MBE MIPP 2R2MBE Test Instruments: HP4291B-RF Impedance / Material Analyzer Test Frequency : 1MHz / OSC level : 100mV HP4338A/B Milloohmmeter ** For special part number which is not shown in the above table, please refer to appendix. Inductance vs. Frequency Inductance vs. DC-bias MIP P Series Engineer Specification Version: A0 Page 1 of 6

3 Temperature rise vs. DC-bias INPAQ SHAPES AND DIMENSIONS Unit:mm TYPE (EIA0806) L 2.00±0.15 W 1.60±0.15 T 0.90±0.10 E 0.50±0.20 PART NUMBER CODE MIP P R47 M B E Series Name 2 Size Code: The first two digitals: length(mm),the last two digitals: width(mm) 3 Material code 4 Inductance: R=Decimal point,unit=μh 5 Tolerance: M=±20% 6 Soldering: Green Parts,B=Lead-Free for whole chip 7 Packaging: E=Embossed plastic tape, 7" reel MIP P Series Engineer Specification Version: A0 Page 2 of 6

4 TAPE AND REEL SPECIFICATIONS Plastic Carrier Taping Dimensions Symbol E W 8.00 ± 0.10 P 4.00 ± 0.10 E 1.75 ± 0.10 F 3.50 ± 0.10 D 1.55 ± 0.05 D ± 0.05 Po 4.00 ± Po 40.0 ± 0.20 P ± 0.10 Ao 1.90 ± 0.10 Bo 2.30 ± 0.10 Ko(T) 1.15 ± 0.10 t 0.22 ± 0.05 Unit:mm MIP P Series Engineer Specification Version: A0 Page 3 of 6

5 REEL DIMENSIONS 7 Reel Packaging Quantity PART SIZE (EIA SIZE) (0806) Qty.(pcs) 3000 BOX 5 reels / inner box RECOMMENDED SOLDERING CONDITIONS MIP P Series Engineer Specification Version: A0 Page 4 of 6

6 LAND PATTERNS FOR REFLOW SOLDERING INPAQ Solder land information: Unit: mm (inches) Size A B C 0.8 (0.031) 2.4 (0.094) 1.8 (0.071) RELIABILITY AND TEST CONDITION Test item Test condition Criteria Resistance to Solder Heat 1. Solder temperature : 260 ± 5 2. Flux : Rosin 3. DIP time : 10 ± 1 sec 1. More than 95 % of terminal electrode should be covered with new solder 2. No mechanical damage 3. Inductance value should be within ± 20 % of the initial value Adhesive Test 1. Reflow temperature : 245 It shall be Soldered on the substrate applying direction parallel to the substrate 2. Apply force(f) : 5 N 3. Test time : 10 sec 2. Soldering the products on PCB after the pulling test force > 5 N MIP P Series Engineer Specification Version: A0 Page 5 of 6

7 Test item Test condition Criteria 1. Temperature : Test time : 8 hrs 1. More than 95 % of 3. Solder temperature : 235 ± Steam Aging Test terminal electrode should be 5 covered with new solder 4. Flux : Rosin 5. DIP time : 5 ± 1 sec Temperature Cycle 1. Temperature:-55 ~ 125 For 30 minutes each 2. Cycle: 100 cycles 3. Measurement:At ambient temperature 24 hours after test completion 2. Inductance should be within ±20% of the initial value Operational Life Biased Humidity Rated Current 1. Temperature: 125 ± 5 2. Testing time: 1000 hrs 3. Applied current: Full rated current 4. Measurement: At ambient temperature 24 hours after test completion 1. Temperature: 40 ± 2 2. Humidity: % RH 3. Applied current: Full rated current 4. Testing time: 1000 hrs 5. Measurement:At ambient temperature 24 hours after test completion At ambient temperature & humidity Testing time:5 minutes ( under full rated current ) 2. Inductance should be within ± 20% of the initial value 2. Inductance should be within ±20% of the initial value MIP product surface temp: below room temperature plus 40 GENERAL TECHNICAL DATA Operating temperature range : - 55 ~ +125 Storage Condition : Less than 40 and 70% RH Storage Time : 12 months Max. Soldering method : Reflow or Wave Soldering MIP P Series Engineer Specification Version: A0 Page 6 of 6