Low Inductance Ceramic Capacitor (LICC)

Transcription

1 Low Inductance Ceramic Capacitor (LICC) LICC(Low Inductance Ceramic Capacitor) is a kind of MLCC that is used for decoupling in High Speed IC. The termination shape of LICC is different from that of MLCC. Generally, the inductance value of capacitor is related with the current path length. In case of LICC, the termination parts are formed in the direction of longer side of capacitor in order to reduce the current path. Due to this design improvement,licc reduce the inductance value effectively. General Features - Low ESL, good for noise reduction for high frequency - Highly reliable tolerance and high speed automatic chip placement on PCBs - Highly reliable performance - Highly resistant termination metal - Tape & reel for surface mount assembly Applications -High Speed Microprocessor -High Frequency Digital Equipment Part Numbering CL 01 A 105 K Q 5 N L N C Samsung 2 Multilayer Ceramic Capacitor 2 Size(mm) 3 3 Capacitance Temperature Characteristic 4 4 Nominal Capacitance 5 5 Capacitance Tolerance 6 Rated Voltage 7 Thickness Option 8 Product & Plating Method 9 LICC (Samsung Control Code) 108Reserved For Future Use 118Packaging Type 1 Samsung Multilayer Ceramic Capacitor 2 SIZE(mm) Code Size(mm)

2 3 CAPACITANCE TEMPERATURE CHARACTERISTIC Code A Temperature Temperature Range X5R X5R ±15% -55 ~ +85 B Class Ⅱ X7R X7R ±15% -55 ~ +125 X X6S X6S ±22% -55 ~ NOMINAL CAPACITANCE Nominal capacitance is identified by 3 digits. The first and second digits identify the first and second significant figures of the capacitance. The third digit identifies the multiplier. 'R' identifies a decimal point. - Example Code Nominal Capacitance 1R5 1.5 pf ,000 pf, 10 nf, 0.01μ F * uf = 10 3 nf = 10 6 pf 5 CAPACITANCE TOLERANCE Code Tolerance Code Tolerance J ±5% M ±20% K ±10% 6 RATED VOLTAGE Code Rated Voltage Code Rated Voltage R 4.0V A 25V Q 6.3V L 35V P 10V B 50V O 16V 7 THICKNESS OPTION Code Symbol Thickness(T) Code Symbol Thickness(T) 0306(0816) ±0.10 C 0.85± (1632) ±0.10 E 1.10± (1220) C 0.85±0.10

3 8 PRODUCT & PLATING METHOD Code Electrode Termination Plating Type N Ni Cu Sn_100% 9 SAMSUNG CONTROL CODE Code Description of the code Code Description of the code A Array (2-element) N Normal B Array (4-element) P Automotive C High - Q L LICC 10 RESERVED FOR FUTURE USE 6 Code N Description of the code Reserved for future use 11 PACKAGING TYPE Code Packaging Type Code Packaging Type B Bulk F Embossing 13" (10,000EA) P Bulk Case L Paper 13" (15,000EA) C Paper 7" O Paper 10" D Paper 13" (10,000EA) S Embossing 10" E Embossing 7" APPEARANCE AND DIMENSION BW T DIMENSION ( mm ) CODE EIA CODE L W T BW ± ± ± min. W L ± ± ± ± ± ± ± ± min. 0.2min.

4 RELIABILITY TEST CONDITION NO ITEM PERFORMANCE TEST CONDITION 1 Appearance No Abnormal Exterior Appearance Through Microscope( 10) 10,000 MΩ OR 500 MΩ μf whichever is smaller 2 Insulation RatedVoltageisbelow16V; Apply the Rated Voltage For 60 ~ 120 Sec. 10,000 MΩ or 100 MΩ μf whichever is smaller 3 Withstanding Voltage No Dielectric Breakdown or Mechanical Breakdown ClassⅠ: 300% of the Rated Voltage for 1~5 sec. ClassⅡ:250% of the Rated Voltage for 1~5 sec. is applied Capacitance Frequency Voltage 4 Capacita nce Class Ⅱ Within the specified tolerance 10 μf 1 khz ±10% 1.0±0.2Vrms >10 μf 120 Hz ±20% 0.5±0.1Vrms Capacitance Frequency Voltage 5 Tanδ Class Ⅱ Voltage DF 50V 0.025max X5R/X7R/X6S 25V 0.025max 16V 0.035max Below 10V max 10 μf 1 khz ±10% 1.0±0.2Vrms >10 μf 120 Hz ±20% 0.5±0.1Vrms

5 RELIABILITY TEST CONDITION Capacitance shall be measured by the steps shown in the following table. A(X5R)/ B(X7R) Capacitance Change with No Bias ±15% Step Temp.( ) 1 25 ± 2 2 Min. operating temp. ± 2 6 Temperature of Capacitance Class Ⅱ X(X6S) ±22% 3 25 ± 2 4 Max. operating temp ± ± 2 - CLASS Ⅱ Capacitance Change shall be calculated from the formula as below. C = C2 - C1 C1 100(%) C1; Capacitance at step 3 C2: Capacitance at step 2 or 4 Apply 500g.f Pressure for 10±1 sec. 7 Adhesive Strength of Termination Apperance No Indication Of Peeling Shall Occur On The Terminal Electrode. No mechanical damage shall occur. 500g.f Apply 1000g.f Pressure For 0612 size Bending limit ; 1mm Test speed ; 1.0mm/SEC. Capacitance Change Keep the test board at the limit point in 5 sec., Then measure capacitance. 20 R= Bending Strength Capacitance Class Ⅱ A(X5R)/ B(X7R)/ X(X6S) Within ±12.5% 45±1 45±1 Bending limit

6 RELIABILITY TEST CONDITION NO ITEM PERFORMANCE TEST CONDITION More Than 95% Of The Terminal Surface Is 9 Solderability To Be Soldered Newly, So Metal Part Does Not Come Out Or Dissolve Solder 63Sn-37Pb Sn-3Ag-0.5Cu Soldering Temp. 235±5 245±5 Dip time 5±0.5 SEC. 3±0.3 SEC. Pre-heating at 80~120 for 10~30 SEC. Apperance No mechanical damage shall occur. Solder Temperature : 270±5 Capacitance A(X5R)/ B(X7R) Class Ⅱ Capacitance Change Within ±7.5% Dip Time : 10±1 sec. Each termination shall be fully immersed and preheated as below : STEP TEMP.( ) TIME(SEC.) 10 to Soldering heat Tanδ (Class Ⅱ) Insulation Withstanding Voltage Appearance X(X6S) Within ±15% Within the specified initial value Within the specified initial value Within the specified initial value No mechanical damage shall occur. 1 80~ ~ Leave the capacitor in ambient condition for specified time* before measurement Class Ⅱ :48± 4 hours 11 Vibration Test Capacitance Capacitance Change Class A(X5R)/ B(X7R) Within ±5% Ⅱ X(X6S) Within ±10% The capacitor shall be subjected to a Harmonic Motion having a total amplitude of 1.5mm changing frequency from 10Hz to 55Hz and back to 10Hz In 1 min. Tanδ (Class Ⅱ) Insulation Within the specified initial value Within the specified initial value Repeat this for 2hours each in 3 mutually perpendicular directions

7 RELIABILITY TEST CONDITION NO ITEM PERFORMANCE TEST CONDITION 12 Humidity (Steady State) Appearance No mechanical damage shall occur. Temperature : 40±2 Capacitance Change Relative humidity : 90~95 %RH Duration time : /-0 hr. A(X5R)/ Within ±12.5% Capacitance Class B(X7R) Ⅱ Leave the capacitor in ambient X(X6S) Within ±25% condition for specified time* before measurement. CLASSⅡ : 48±4 Hr. Voltage DF 50V 0.05max Tanδ 25V 0.05max CLASS Ⅱ X5R/X7R/X6S 16V 0.05max Below 10V max Insulation 1,000 MΩ or 50 MΩ μf whichever is smaller. Rated Voltage is below 16V ; 10,00MΩ or 10MΩ μf whichever is smaller Appearance No mechanical damage shall occur. Applied voltage : Rated Voltage Capacitance A(X5R)/ B(X7R) Class Ⅱ Capacitance Change Within ±12.5% Temperature : 40±2 Humidity : :90~95%RH Duration time : /-0 hr. Charge/discharge current : 50mA max. <Initial Measurement> Perform the heat treatment at /-10 for 1 hr. Then leave the capacitor in ambient condition for 48±4 hrs. before measurement. Then perform the measurement. X(X6S) Within ±30% <Latter Measurement> - Class Ⅱ Perform the heat treatment at / Moisture for 1 hr. Then leave the capacitor in ambient condition for 48±4 hrs. before measurement. Tanδ (Class Ⅱ) Voltage DF 50V 0.05max X5R/X7R/X6S 25V 0.05max 16V 0.05max Below 10V max Then perform the measurement. Insulation 500 MΩ or 25MΩ μf whichever is smaller. Rated Voltage is below 16V ; 500MΩ or 5MΩ μf whichever is smaller

8 RELIABILITY TEST CONDITION NO ITEM PERFORMANCE TEST CONDITION Appearance No mechanical damage shall occur. Capacitance Change Applied Voltage : 100% of Rated Voltage Test Time : /-0 Hr. Current Applied : 50mA Max. Capacitance Class Ⅱ A(X5R)/ B(X7R) Within ±12.5% Temp. A(X5R) 85 ±3 Class B(X7R) 125 ±3 Ⅱ X(X6S) 105 ±3 <Initial Measurement> High X(X6S) Within ±12.5% Perform the heat treatment at /-10 for 1 hr. Then leave the capacitor in ambient 14 Temperature condition for 48±4 hrs. before measurement. Then perform the measurement. <Latter Measurement> Tanδ (Class Ⅱ) Insulation Voltage DF 50V 0.05max X5R/X7R/X6S 25V 0.05max 16V 0.05max Below 10V max r 1,000 MΩ or 50MΩ μf whichever is smaller. - Class Ⅱ Perform the heat treatment at /-10 for 1 hr. Then leave the capacitor in ambient condition for 48±4 hrs. before measurement. Then perform the measurement. 15 Temperature Cycle Appearance No mechanical damage shall occur. Capacitor shall be subjected to 5 cycles. Capacitance Change Condition for 1 cycle : Step Temp.( ) Time(min.) Capacitance Class A(X5R)/ B(X7R)/ Within ±7.5% Min. operating 1 temp.+0/-3 30 Ⅱ ~3 X(X6S) Within ±7.5% Max. operating 3 temp.+3/-0 30 Tanδ (Class Ⅱ) Within the specified initial value ~3 Leave the capacitor in ambient condition for specified time* before measurement Class Ⅱ :48±4hours Insulation Within the specified initial value

9 PACKAGING CARDBOARD PAPER TAPE Feeding Hole Chip Inserting Hole D E B A F W t P0 P2 P1 unit : mm Symbol Type D i m e n s i o n 0306 (0816) 0508 (1220) 0612 (1632) EMBOSSED PLASTIC TAPE t1 A B W F E P1 P2 P0 D t 1.1 ± ± ± ± ± ±0.2 Feeding Hole B A 8.0 ± ± ± ±0.1 Chip inserting Hole D 2.0 ± ±0.1 Φ /-0 E F 1.1 Below W High Voltage Type t0 P0 P2 P1 unit : mm Symbol Type A B W F E P1 P2 P0 D t1 t0 D i m e n s i o n 0612 (1632) 1.9 ± ± ± ± ± ± ± ±0.1 Φ / max 0.6 Below

10 TAPING SIZE Empty Section 45 Pitch Packed Part Empty Section 50 Pitch Loading Section 35 Pitch END START unit : pcs Symbol Cardboard Paper Tape Embossed Plastic Tape 7" Reel " Reel REEL DIMENSION E C High Voltage Type R D B W t A unit : mm Symbol A B C D E W t R 7" Reel φ180+0/ -3 φ60+1/ -3 φ13±0.3 25± ±0.5 9± ±0.2 13" Reel φ330±2.0 φ80+1/ ±

11 PACKAGING BULK CASE PACKAGING - Bulk case packaging can reduce the stock space and transportation costs. - The bulk feeding system can increase the productivity. - It can eliminate the components loss. A B T C D E F W G H L I unit : mm Symbol A B T C D E Dimension 6.8± ±0.1 12± /-0 2+0/ /-0 Symbol F W G H L I Dimension / / ±0.35 7± ±0.7 5±0.35

12 STORAGE CONDITION Storage Environment The electrical characteristics of MLCCs were degraded by the environment of high temperature or humidity. Therefore, the MLCCs shall be stored in the ambient temperature and the relative humidity of less than 40 and 70%, respectively. Guaranteed storage period is within 6 months from the outgoing date of delivery. Corrosive Gases Since the solderability of the end termination in MLCC was degraded by a chemical atmosphere such as chlorine, acid or sulfide gases, MLCCs must be avoid from these gases. Temperature Fluctuations Since dew condensation may occur by the differences in temperature when the MLCCs are taken out of storage, it is important to maintain the temperature-controlled environment. DESIGN OF LAND PATTERN Array Type When designing printed circuit boards, the shape and size of the lands must allow for the proper amount of solder on the capacitor. The amount of solder at the end terminations has a direct effect on the crack. The crack in MLCC will be easily occurred by the tensile stress which was due to too much amount of solder. In contrast, if too little solder is applied, the termination strength will be insufficiently. Use the following illustrations as guidelines for proper land design. Recommendation of Land Shape and Size. W Solder Resist b T Solder Resist Solder Land 2/3W < b < W a 2/3T < a < T

13 ADHESIVES When flow soldering the MLCCs, apply the adhesive in accordance with the following conditions. Requirements for Adhesives They must have enough adhesion, so that, the chips will not fall off or move during the handling of the circuit board. They must maintain their adhesive strength when exposed to soldering temperature. They should not spread or run when applied to the circuit board. They should harden quickly. They should not corrode the circuit board or chip material. They should be a good insulator. They should be non-toxic, and not produce harmful gases, nor be harmful when touched. Application Method It is important to use the proper amount of adhesive. Too little and much adhesive will cause poor adhesion and overflow into the land, respectively. Solder Resist PCB Land a a b Type unit : mm a 0.2 min 0.2 min Array Type b 70~100 μm 70~100 μm c c c > 0 > 0 Adhesive hardening To prevent oxidation of the terminations, the adhesive must harden at 160 or less, within 2 minutes or less. MOUNTING Mounting Head Pressure Excessive pressure will cause crack to MLCCs. The pressure of nozzle will be 300g maximum during mounting.

14 Bending Stress When double-sided circuit boards are used, MLCCs first are mounted and soldered onto one side of the board. When the MLCCs are mounted onto the other side, it is important to support the board as shown in the illustration. If the circuit board is not supported, the crack occur to the ready-installed MLCCs by the bending stress. nozzle force support pin Manual Soldering Manual soldering can pose a great risk of creating thermal cracks in chip capacitors. The hot soldering iron tip comes into direct contact with the end terminations, and operator's carelessness may cause the tip of the soldering iron to come into direct contact with the ceramic body of the capacitor. Therefore the soldering iron must be handled carefully, and close attention must be paid to the selection of the soldering iron tip and to temperature control of the tip. Array Type Amount of Solder Too much Solder Not enough Solder Cracks tend to occur due to large stress W eak holding force may cause bad connections or detaching of the capacitor Good

15 Cooling Natural cooling using air is recommended. If the chips are dipped into solvent for cleaning, the temperature difference( T) must be less than 100 Cleaning If rosin flux is used, cleaning usually is unnecessary. When strongly activated flux is used, chlorine in the flux may dissolve into some types of cleaning fluids, thereby affecting the chip capacitors. This means that the cleaning fluid must be carefully selected, and should always be new. Notes for Separating Multiple, Shared PC Boards. A multi-pc board is separated into many individual circuit boards after soldering has been completed. If the board is bent or distorted at the time of separation, cracks may occur in the chip capacitors. Carefully choose a separation method that minimizes the bending often circuit board. Recommended Soldering Profile Soldering Temp. ( ) Pre-heating Temp. ( ) Reflow Pre-heating 250±5 6 sec. max. Gradual Cooling in the air T i) 1206(3216) and below : 150 max. 220 ii) 1210(3225) and over : 130 max. 30 to 50 sec. Array Type 60 sec. min. 60 to 120 sec. Time (sec.)

16 Flow Soldering Pre-heating 260±3 5 sec. max. Gradual Cooling in the air Temp. ( ) T i) 1206(3216) and below : 150 max. Pre-heating Temp. ( ) 120 sec. min. Time (sec.) Soldering Iron Soldering Pre-heating Soldering Cooling Variation of Temp. Temp ( ) Time (Sec) Time(Sec) Time(Sec) T ±10 max Array Type Condition of Iron facilities Wattage Tip Diameter Soldering Time 20W Max 3 mm Max 4 Sec Max * Caution - Iron Tip Should Not Contact With Ceramic Body Directly.