ACX Advanced Ceramic X

Transcription

1 LF 1608 Series Multilayer Chip Low-Pass Filters ACX Features Monolithic structure replacing one inductor and three capacitors. Applications 0.8-6GHz wireless communication systems, including DECT / PACS / PHS / GSM / DCS / PCS phones, WLAN card, Bluetooth modules, etc. Specifications Part Number LF1608- B1R8KAA_ Frequency Insertion Attenuation Attenuation Q ty/ VSWR Range 2 x f 3 x f o BW (MHz) (db) (db) (db) (pcs) max. 27 min. 19 min. 1.7 max. 4,000 Operating Temperature Range Storage Temperature Range Storage Period Power Capacity : -40 ~ +85 o C : +5 ~ +35 o C, Humidity 45~75%RH : 12 months max. : 2W max. Part Number LF B 1R8 KAA Type LF : Low Pass Filter Dimensions ( L W ) mm Material Code B Frequency Range 1R8=1800MHz Specification Code KAA Packaging T: Tape & Reel B: Bulk Terminal Configuration No. Terminal Name No. Terminal Name GND OUT NC GND GND IN LF1608-B1R8KAAT/LF REV:1 PAGE:1/7

2 Dimensions and Recommended PC Board Pattern a p Unit : mm W c T L g b Mark L W T a b c g p Dimensions / Solder Resist * * 0.25 Land Through-hole ( 0.35) 0.25 * Line width should be designed to match 50 characteristic impedance, depending on PCB material and thickness. Measuring Diagram Port 1 (50 ) Network analyzer Port 2 (50 ) GND GND GND LF1608-B1R8KAAT/LF REV:1 PAGE:2/7

3 Typical Electrical Characteristics(T=25 o C) 0-10 db(s(2,2)) db(s(1,1)) db(s(2,1)) freq, GHz Notes The contents of this data sheet are subject to change without notice. Please confirm the specifications and delivery conditions when placing your order. LF1608-B1R8KAAT/LF REV:1 PAGE:3/7

4 Taping Specifications Tape Dimensions (Unit: mm) & Quantity T A D 1.75 ± C E F PAPER TAPE B A Type A A B C D E F T Quantity/reel Tape material ± 4.0± 1.10± 1.92± 2.0± 3.5± 8.0± 0.75± ,000pcs Paper Reel Dimensions (Unit: mm) Label 1.4 ± ± 1 60±1 Label: Customer s Name, ACX P/N, Q ty, Date, A 13.5±0.5 B ACX Corp. Type A B ± ±0.3 Leader and Trailer Tape (Plastic material) Trailer End Trailer (160 mm min.) Empty Compartments with Cover Tape (500 mm min.) LF1608-B1R8KAAT/LF REV:1 PAGE:4/7

5 Peel-off Force Peeling Direction <10 0 Top Cover Tape Carrier Tape Peel-off force should be in the range of 0.6 N at a peel-off speed of 300±10 mm/min. Storage Conditions (1) Temperature: 15 ~35, relative humidity (RH): 45~75%. (2) Non-corrosive environment. Notes The contents of this data sheet are subject to change without notice. Please confirm the specifications and delivery conditions when placing your order. LF1608-B1R8KAAT/LF REV:1 PAGE:5/7

6 Mechanical & Environmental Characteristics Item Requirements Procedure Solderability Soldering strength (Termination Adhesion) 2. More than 95% of the terminal 1. Preheat: o C electrode shall be covered with 2. Solder: o C for 5 1 sec new solder 1. Solder specimen onto test jig. 2. Apply push force at 0.5mm/s until electrode pads are 1. 1kg minimum peeled off or ceramic are broken. Pushing force is applied to longitude direction 1. Solder specimen onto test jig (FR4, 0.8mm) using the recommend soldering profile. 2. Apply a bending force of 2mm deflection Deflection (Substrate Bending) ` R230 Pressure Rod 90mm 1. Temperature: 85 2 o C Heat/Humidity 2. Humidity: 90% ~ 95% RH 2. Fulfill the electrical specification Resistance 3. Duration: 1000±48hrs after test 4. Recovery: 1-2hrs 1. One cycle/step 1:125 ± 5 C for 30 min Thermal shock step 2:- 40 ± 5 C for 30 min 2. Fulfill the electrical specification (Temperature Cycle) 2. No of cycles:100 after test 3. Recovery:1-2 hrs 1. Temperature: -40 o 5 o C Low Temperature 2. Fulfill the electrical specification 2. Duration: 500 ±24hrs Resistance after test 3. Recovery: 1-2hrs LF1608-B1R8KAAT/LF REV:1 PAGE:6/7

7 Soldering Conditions Typical Soldering Profile for Lead-free Process Reflow Soldering : Temperature ( o C) 260 o C 217 o C o C 20s max. Pre-heating s. Time (s.) s Notes The contents of this data sheet are subject to change without notice. Please confirm the specifications and delivery conditions when placing your order. Corp. 16 Tzu Chiang Road, Hsinchu Industrial District Hsinchu Hsien 303, Taiwan TEL: FAX: acx@acxc.com.tw LF1608-B1R8KAAT/LF REV:1 PAGE:7/7