Chip Inductors. LCCM Series Chip Common Mode Filter FEATURES CONSTRUCTION

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1 FEATURES Small wire wound chip inductor with ferrite core and 2 common mode lines. Highly effective in noise suppression High common-mode impedance at noise band an low differential mode impedance at signal band factor. There is almost no distortion in high-speed signals. Operating temperature -40 C ~ 85 C. CONSTRUCTION APPLICATIONS EMI suppression for electronic devices. USB line in personal computers and peripherals. Terminal Ferrite IEEE 394 line for personal computers, DVC, and STB LCD Panels. Low-Voltage Differential Signal (LVDS) Enamel-insulated Wire DIMENSIONS B C K H K E I A F E J I G mm (inches) Type Size (inch) LCCM LCCM A B C E F G H I J K Weight (g) (pcs) 2.00 ± ± ± (0.079 ± 0.008) (0.047 ± 0.008) (0.047 ± 0.008) (0.08) (0.047) (0.06) (0.03) (0.06) (0.06) (0.035) 3.20 ± ± ± (0.26 ± 0.008) (0.063 ± 0.008) (0.07 ± 0.008) (0.024) (0.079) (0.024) (0.063) (0.024) (0.06) (0.04) HOW TO ORDER LC CM 0805 M G T A R Family LC = Chip Inductor Series CM = Common Mode Size Tolerance M = 20% Impedance 670 = = = = Style G = Standard Q = High Q/ High Current R = Low Profile Termination T = Sn Plating Special A = Standard Packaging R = 7" Reel 2

2 ELECTRICAL CHARACTERISTICS 0805 Impedance Tolerance Test DCR IDC Rated Voltage Withstanding Insulation (Ω) Condition (Ω) max. (ma) max. Vdc (V) Voltage Vdc Resistance (MHz) (V) (MΩ) min. 67 ±20% ±20% ±20% ±20% ±20% ±20% ±20% ±20% Impedance Tolerance Test DCR IDC Rated Voltage Withstanding Insulation (Ω) Condition (Ω) max. (ma) max. Vdc (V) Voltage Vdc Resistance (MHz) (V) (MΩ) min. 90 ±20% ±20% ±20% ±20% ±20% ±20%

3 LCCM0805 CHARACTERISTICS IMPEDANCE vs. FREQUENCY LCCM0805M670 0 LCCM0805M900 0 LCCM0805M LCCM0805M2 0 LCCM0805M8 0 LCCM0805M LCCM0805M20 0 LCCM0805M Common Mode Differential Mode 4

4 LCCM206 CHARACTERISTICS IMPEDANCE vs. FREQUENCY LCCM206M900 0 LCCM206M26 0 LCCM206M LCCM206M6 0 LCCM206M60 0 LCCM206M Common Mode Differential Mode 5

5 ENVIRONMENTAL CHARACTERISTICS ELECTRICAL PERFORMANCE TEST Items Requirement Test Conditions I Test Methods Impedance LCR Meter HP 429B DC Resistance DCR Micro-Ohm meter (GOM-80G) Test Voltage: 2.5 Times Rated Voltage Withstand Voltage (VDC) Refer to standard electrical Testing Time: 60 seconds characteristic spec. Charge Current: 0.5mA Component should not Test Voltage: Rated Voltage Rated Voltage (VDC) be damaged Testing Time: to 5 seconds Charge Current: ma Insulation Resistance (I.R) Charge Current: minute M ohm min. MECHANICAL PERFORMANCE TEST Items Requirement Test Conditions I Test Methods Base: Lbs The component should be soldered (232 C ± 5 C Component Adhesion Cover: 0805 Lbs for sec.) to tinned copper substrate (Push Test) Base: Lbs Applied force gauge to the side of component Cover: Lbs It must withstand force of 2 or 4 pounds without failure of the component. Dropping chip by each side and corner. 6 Drop Component should not be damaged Drop times in total Drop height: 0 cm Drop weight: 25 g Solderability The terminal should at least The component shall be dipped in a be 90% covered with solder melted solder bath at 245 ±5 C for 3 seconds. Amplitude:.5 m/m Vibration Test Component should not 2. Frequency: -55-Hz (min.) (Low Frequency) be damaged 3. Direction: X, Y, Z 4. Duration: 2 Hrs/X, Y, Z MECHANICAL PERFORMANCE TEST Items Requirement Test Conditions I Test Methods. Temp: -40 ±2 C Low Temperature Storage 2. Time: ±48 Hours 3. Component should be tested after hour at room temperature Thermal Shock Impedance change: Within± 20% ROOM TEMP Without distinct damage Total: 5 Cycles 5 MINS in appearance. Temp: 85 ± 2 C High Temperature Storage 2. Time: ± 48 Hours 3. Component should be tested after hour at room temperature. Temp: 40 ± 2 C Humidity 2. R.H. : 90 95% 3. Time: 48 ±2 Hours. Temp: 85 ± 2 C High Temperature Load Life 2. Time: 96 ± 2 Hours There should be no evidence of 3. Load: Allowed DC Current Low Temperature Load Life short or open circuit. Temp: -40 ± 2 C 2. Time: 96 ± 2 Hours 3. Load: Allowed DC Current ROOM TEMP 5 MINS -25 ± 2ºC 30 MINS 85 ± 2ºC 30 MINS

6 PACKAGING QUANTITY REAL SPECIFICATIONS D: 2.8 ± 0.80 (0.858 ± 0.03) Label.20 ± 0.20 (0.047 ± 0.008) Embossed Type Plastic Tape (EA) LCCM0805 2,000 LCCM206 2,000 D: 3.0 ± 0.30 (0.52 ± 0.02) 2.00 ± 0.50 (0.079 ±0.020) 78 ± 2.00 (7.008 ± 0.079) 60.0 ± 0.50 (2.362 ± 0.020) 9.00 ± 0.30 (0.354 ±0.02).4 ±.00 (0.449 ± 0.039) EMBOSSED PLASTIC TAPE SPECIFICATIONS Top Tape ψ D 0 A E B F W T P P 2 P 0 Direction of unreeling ψ D.5 Min. Embossed Tape mm (inches) Type A B W E F P0 P P2 ΦD0 T LCCM ± ± ± ± ± ± ± ± ± ± 0. (0.055 ± 0.004) (0.0 ± 0.002) (0.35 ± 0.008) (0.069 ± 0.004) (0.38 ± 0.004) (0.57 ± 0.004) (0.57 ± 0.004) (0.079 ± 0.004) (0.059 ± 0.004) (0.053 ± 0.004) LCCM ± ± ± ± ± ± ± ± ± ± 0. (0.075 ± 0.004) (0.38 ± 0.004) (0.35 ± 0.008) (0.069 ± 0.004) (0.38 ± 0.004) (0.57 ± 0.004) (0.57 ± 0.004) (0.079 ± 0.004) (0.059 ± 0.004) (0.083 ± 0.004) LEADER/TAPE Trailer End Leader Trailer 80.0 (3.50) min. Empty Compartments with Cover Tape 80.0 (3.50) min. Cover Tape Only 450 (7.72) min. PEEL-OFF FORCE The force for tearing off cover tape is (N) in the arrow direction at the following conditions: Temperature: 5-35 C Humidity: 45-85% Atmospheric pressure: hpa 60-80º Top cover tape Base tape 7