SPECIFICATIONS. Multi-layer Chip Ferrite Bead GZ Series Customer Part Number. [ New Released, Revised] SPEC No.: GZ110000
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1 Sunlord Specifications for Multi-layer Chip Ferrite Bead Page 1 of 16 SPECIFICATIONS Customer Product Name Sunlord Part Number Multi-layer Chip Ferrite Bead G Series Customer Part Number [ New eleased, evised] SPEC No.: G11 ev. Effective Date Changed Contents Change easons Approved By 1 New release / Hai Guo This SPEC is total 16 pages including specifications and appendix. OHS Compliant Parts Approved By Checked By Issued By Shenzhen Sunlord Electronics Co., Ltd. Address: Sunlord Industrial Park, Dafuyuan Industrial one, Guanlan, Shenzhen, China Tel: Fax: sunlord@sunlordinc.com For Customer approval Only Date: Qualification Status: Full estricted ejected Approved By Verified By e-checked By Checked By Comments:
2 Sunlord Specifications for Multi-layer Chip Ferrite Bead Page 2 of Scope This specification applies to G Series of multi-layer ferrite chip bead. 2. Product Description and Identification (Part Number) 1) Description: G Series of multi-layer ferrite chip bead. 2) Product Identification (Part Number) G 〇 F Type 2 External Dimensions (L W)[mm] G For General Use 63 [21] Material Code D, U, E 15 [42] [63] [85] Packing T Tape Carrier Package 6 HSF Products Hazardous Substance Free Products 3216 [126] Nominal Impedance Example Nominal Value 3 3Ω Ω 3. Electrical Characteristics Please refer to Appendix A (Page 7~16). 1) Operating and storage temperature range (individual chip without packing): -55 ~ ) Storage temperature range (packaging conditions):-1 ~+4 and H 7% (Max.) 4. Shape and Dimensions 1) Dimensions and recommended PCB pattern for reflow soldering: See Fig.4-1, Fig.4-2 and Table ) Structure: See Fig. 4-3 and Fig Chip Bead Solder-resist C Land pattern Fig. 4-1 B A B Fig. 4-2 Type L W T a A B C 63.6±.5.3±.5.3±.5.15±.5 [21] [.24±.2] [.12±.2] [.12±.2] [.6±.2].2~.3.2~.3.3~ ±.15.5±.15.5±.15.25±.1 [42] [.39±.6] [.2±.6] [.2±.6] [.1±.4].45~.55.4~.5.45~ [63] 212 [85] 3216 [126] 1.6±.15 [.63±.6] 2. (+.3, -.1) [.79(+.12,-.4)] 3.2±.2 [.126±.8] [Table 4-1].8±.15 [.31±.6] 1.25±.2 [.49±.8] 1.6±.2 [.63±.8].8±.15 [.31±.6].85±.2 [.33±.8].85±.2 [.33±.8].3±.2 [.12±.8].5±.3 [.2±.12].5±.3 [.2±.12] Unit: mm [inch].6~.8.6~.8.6~.8.8~1.2.8~1.2.9~ ~2.5 1.~ ~2. a L a T T Sn Structure of Electro-plating Ferrite 1 Ferrite for Bead Series 2 Internal electrode (Ag) 3 Pull out electrode( Ag) W 4-2 Ni 4-1 Terminal electrode: Inside (Ag) 4-2 Outside (Electro-plating Ni-Sn) Fig Ag Fig. 4-4
3 Sunlord Specifications for Multi-layer Chip Ferrite Bead Page 3 of 16 3) Material Information: See Table 4-2. [Table 4-2] Code Part Name Material Name 1 Ferrite Body Ferrite Powder 2 Inner Coils Silver Paste 3 Pull-out Electrode (Ag) Silver Paste 4-1 Terminal Electrode: Inside Ag Termination Silver Composition 4-2 Electro-Plating: Ni/Sn plating Plating Chemicals 5. Test and Measurement Procedures 5.1 Test Conditions Unless otherwise specified, the standard atmospheric conditions for measurement/test as: a. Ambient Temperature: 2±15 b. elative Humidity: 65±2% c. Air Pressure: 86kPa to 16kPa If any doubt on the results, measurements/tests should be made within the following limits: a. Ambient Temperature: 2±2 b. elative Humidity: 65±5% c. Air Pressure: 86kPa to 16kPa 5.2 Visual Examination a. Inspection Equipment: 2 magnifier 5.3 Electrical Test DC esistance (DC) a. efer to Appendix A. b. Test equipment (Analyzer): High Accuracy Milliohmmeter-HP4338B or equivalent Impedance () a. efer to Appendix A. b. Test equipment: High Accuracy F Impedance /Material Analyzer-E4991A or equivalent. Test fixture: HP16197A for 63, HP16192A for 15/168/212/3216. Test signal: -2dBm or 5mV c. Test frequency refers to Appendix A ated Current a. efer to Appendix A. b. Test equipment (see Fig ): Electric Power, Electric current meter, Thermometer. c. Measurement method (see Fig ): 1. Set test current to be ma. 2. Measure initial temperature of chip surface. 3. Gradually increase voltage and measure chip temperature for corresponding current. d. Definition of ated Current (Ir): Ir is direct electric current as chip surface temperature rose just 2 against chip initial surface temperature (Ta) (see Fig ) Electric Power Electric Thermometer Temperature ( ) +2 Current Meter Chip Fig Ta ated current Fig Ir (ma) e. When operating temperatures exceeding +85, derating of current is necessary for chip ferrite beads for which rated current is 1mA over. Please apply the derating curve shown in chart according to the operating temperature. Derated Current [A] Operating Temperature[ ]
4 Sunlord Specifications for Multi-layer Chip Ferrite Bead Page 4 of eliability Test Items equirements Test Methods and emarks Terminal Strength No removal or split of the termination or other defects shall occur. Chip F Mounting Pad Glass Epoxy Board Fig Solder the bead to the testing jig (glass epoxy board shown in Fig ) using eutectic solder. Then apply a force in the direction of the arrow. 2N force for 63 series, 5N force for 15 and 168 series 1N force for 212 and 3216 series. Keep time: 1±1s. Speed: 1.mm/s esistance Flexure to No visible mechanical damage. Unit: mm [inch] Type a b c 63[21] [42] Solder the bead to the test jig (glass epoxy board shown in Fig ) Using a eutectic solder. Then apply a force in the direction shown Fig Flexure: 2mm. Pressurizing Speed:.5mm/sec. Keep time: 3 sec. 168[63] [85] [126] b Φ c a 1 Fig [1.772] 45[1.772] Fig Flexure Vibration 1 No visible mechanical damage. 2 Impedance change: within ±2% Cu pad Solder mask Glass Epoxy Board Fig Solder the bead to the testing jig (glass epoxy board shown in Fig ) using eutectic solder. The bead shall be subjected to a simple harmonic motion having total amplitude of 1.5 mm, the frequency being varied uniformly between the approximate limits of 1 and 55 Hz. The frequency range from 1 to 55 Hz and return to 1 Hz shall be traversed in approximately 1 minute. This motion shall be applied for a period of 2 hours in each 3mutually perpendicular directions (total of 6 hours) Dropping 1 No visible mechanical damage. 2 Impedance change: within ±2%. Drop chip bead 1 times on a concrete floor from a height of 1 cm Temperature Impedance change should be within ±2% of initial value measuring at 2. Temperature range: -55 ~ 125. eference temperature: Solderability 1 2 No visible mechanical damage. Wetting shall exceed 75% coverage for 63 series; exceed 95% for others Solder temperture:24±2 Duration: 3 sec. Solder: Sn/3.Ag/.5Cu. Flux: 25% esin and 75% ethanol in weight esistance to Soldering Heat 1 No visible mechanical damage. 2 Wetting shall exceed 75% coverage for 63 series; exceed 95% for others 3 Impedance change: within ±2%. 1 Solder temperature :26±3 2 Duration: 5 sec. 3 Solder: Sn/3.Ag/.5Cu. 4 Flux: 25% esin and 75% ethanol in weight. 5 The chip shall be stabilized at normal condition for 1~2 hours before measuring.
5 Sunlord Specifications for Multi-layer Chip Ferrite Bead Page 5 of Thermal Shock 1 No mechanical damage. 2 Impedance change: Within ±2% min. 3 min. Ambient Temperature min. Fig sec. (max.) Temperature, Time: (See Fig ) -55 for 3±3 min 125 for 3±3min. Transforming interval: Max. 2 sec. Tested cycle: 1 cycles. The chip shall be stabilized at normal condition for 1~2 hours before measuring esistance to Low Temperature esistance to High Temperature Damp Heat (Steady States) Loading Under Damp Heat Loading at High Temperature (Life Test) 1 No mechanical damage. 2 Impedance change: within ±2%. 1 No mechanical damage. 2 Impedance change: within ±2%. 1 No mechanical damage. 2 Impedance change: Within ±2%. 1 No visible mechanical damage. 2 Impedance change: within ±2%. 1 No visible mechanical damage. 2 Impedance change: within ±2%. 1 Temperature: -55±2 2 Duration: hours. 3 The chip shall be stabilized at normal condition for 1~2 hours before measuring. 1 Temperature: 125±2 2 Duration: hours. 3 The chip shall be stabilized at normal condition for 1~2 hours before measuring. 1 Temperature: 6±2 2 Humidity: 9% to 95% H. 3 Duration: hours. 4 The chip shall be stabilized at normal condition for 1~2 hours before measuring. 1 Temperature: 6±2 2 Humidity: 9% to 95% H. 3 Duration: hours. 4 Applied current: ated current. 5 The chip shall be stabilized at normal condition for 1~2 hours before measuring. 1 Temperature: 125±2 2 Duration: hours. 3 Applied current: ated current. 4 The chip shall be stabilized at normal condition for 1~2 hours before measuring. 6. Packaging, Storage 6.1 Packaging Tape Carrier Packaging: Packaging code: T a. Tape carrier packaging are specified in attached figure Fig.6.1-1~3 b. Tape carrier packaging quantity please see the following table: Type 63[21] 15[42] 168[63] 212[85] 3216[126] T(mm).3±.15.5±.15.8±.15.85±.2.85±.2 Tape Paper Tape Paper Tape Paper Tape Paper Tape Paper Tape Quantity 15K 1K 4K 4K 3K (1) Taping Drawings (Unit: mm) Paper Tape Top Tape Paper Tape Sprocket Hole Bottom Tape Chip Cavity emark: The sprocket holes are to the right as the tape is pulled toward the user. Fig
6 Sunlord Specifications for Multi-layer Chip Ferrite Bead Page 6 of 16 (2) Taping Dimensions (Unit: mm) Sprocket Hole Φ1.5 (+.1,) Chip Cavity 1.75±.1 Paper Tape Type A B P T max B A 3.5±.5 8.±.3 63[21].4±.1.7±.1 2.± [42].65± ±.1 2.± [63] 1.±.2 1.8±.2 4.± [85] 1.5±.2 2.3±.2 4.± P 4.±.1 Direction of Feed T Fig [126] 1.9±.2 3.5±.2 4.± (3) eel Dimensions (Unit: mm) 4.3±.2mm 1.±1.5mm 2.45±.2mm 4.±.1mm 5.±.1mm 58±2.mm 13.5±.2mm 3.±.1mm 178±2.mm Fig Storage a. The solderability of the external electrode may be deteriorated if packages are stored where they are exposed to high humidity. Package must be stored at 4 or less and 7% H or less. b. The solderability of the external electrode may be deteriorated if packages are stored where they are exposed to dust of harmful gas (e.g. HCl, sulfurous gas of H 2 S). c. Packaging material may be deformed if package are stored where they are exposed to heat of direct sunlight. d. Solderability specified in Clause shall be guaranteed for 12 months from the date of delivery on condition that they are stored at the environment specified in Clause 3. For those parts, which passed more than 12 months shall be checked solder-ability before use. 7. ecommended Soldering Technologies 7.1 e-flowing Profile: Preheat condition: 15 ~2 /6~12sec. Allowed time above 217 : 6~9sec. Max temp: 26 Max time at max temp: 1sec. Solder paste: Sn/3.Ag/.5Cu Allowed eflow time: 2x max [Note: The reflow profile in the above table is only for qualification and is not meant to specify board assembly profiles. Actual board assembly profiles must be based on the customer's specific board design, solder paste and process, and should not exceed the parameters as the eflow profile shows.] Max amp Up ate=3 /sec. Max amp Down ate=6 /sec. Peak 26 max 6~9sec. 6~12sec. Time 25 to Peak =8 min max 7.2 Iron Soldering Profile. Iron soldering power: Max. 3W Pre-heating: 15 /6sec. Soldering Tip temperature: 35 Max. Soldering time: 3sec. Max. Solder paste: Sn/3.Ag/.5Cu Max.1 times for iron soldering [Note: Take care not to apply the tip of the soldering iron to the terminal electrodes.] 35 Tc 3sec. Max. Soldering Iron Power: max. 3W Diameter of Soldering Iron 1.mm max.
7 Sunlord Specifications for Multi-layer Chip Ferrite Bead Page 7 of Supplier Information a) Supplier: Shenzhen Sunlord Electronics Co., Ltd. b) Manufacture: Shenzhen Sunlord Electronics Co., Ltd. c) Manufacturing Address: Sunlord Industrial Park, Dafuyuan Industrial one, Guanlan, Shenzhen, China Appendix A: Electrical Characteristics I. G63 Series of Beads Part Number Impedance (Ω) Test Freq. DC Ir (MHz) (Ω) Max. (ma) Max. G63D6TF 6±25% G63D8TF 8±25% G63D121TF 12±25% G63D241TF 24±25% G63D471TF 47±25% G63D61TF 6±25% Thickness (mm) [inch].3±.5 [.12±.2] I. G15 Series of Beads Part Number Impedance (Ω) Test Freq. DC Ir (MHz) (Ω) Max. (ma) Max. G15D1TF ~ G15D31TF 31±25% G15D6TF 6±25% G15D8TF 8±25% G15D121TF 12±25% G15D221TF 22±25% G15D31TF 3±25% G15D421TF 42±25% G15D51TF 5±25% G15D61TF 6±25% G15D751TF 75±25% G15D12TF 1±25% G15D152TF 15±25% G15E8TF 8±25% G15E121TF 12±25% G15E241TF 24±25% G15E61TF 6±25% G15U1TF ~ G15U3TF 3±25% G15U7TF 7±25% G15U121TF 12±25% G15U221TF 22±25% G15U31TF 3±25% G15U421TF 42±25% G15U61TF 6±25% G15U12TF 1±25% Thickness (mm) [inch].5±.15 [.2±.6] II. G168 Series of Beads Part Number Impedance (Ω) Test Freq. DC Ir (MHz) (Ω) Max. (ma) Max. G168D11TF ~ G168D3TF 3±25% G168D6TF 6±25% G168D8TF 8±25% G168D11TF 1±25% G168D121TF 12±25% G168D221TF 22±25% G168D31TF 3±25% Thickness (mm) [inch].8±.15 [.31±.6]
8 Sunlord Specifications for Multi-layer Chip Ferrite Bead Page 8 of 16 G168D471TF 47±25% G168D61TF 6±25% G168D751TF 75±25% G168D12TF 1±25% G168D152TF 15±25% G168D182TF 18±25% G168D22TF 2±25% G168D222TF 22±25% G168E8TF 8±25% G168E121TF 12±25% Part Number Impedance (Ω) Test Freq. DC Ir (MHz) (Ω) Max. (ma) Max. G168E181TF 18±25% G168E31TF 3±25% G168E61TF 6±25% G168E12TF 1±25% G168E22TF 2±25% G168U1TF ~ G168U3TF 3±25% G168U6TF 6±25% G168U121TF 12±25% G168U221TF 22±25% G168U31TF 3±25% G168U471TF 47±25% G168U61TF 6±25% G168U12TF 1±25% Thickness (mm) [inch].8±.15 [.31±.6] III. G212 Series of Beads Part Number Impedance (Ω) Test Freq. DC Ir (MHz) (Ω) Max. (ma) Max. G212D7TF ~ G212D19TF 19±25% G212D3TF 3±25% G212D8TF 8±25% G212D121TF 12±25% G212D181TF 18±25% G212D221TF 22±25% G212D31TF 3±25% G212D421TF 42±25% G212D51TF 5±25% G212D61TF 6±25% G212D751TF 75±25% G212D12TF 1±25% G212D152TF 15±25% G212D22TF 2±25% G212E8TF 8±25% G212E121TF 12±25% G212E181TF 18±25% G212E31TF 3±25% G212E51TF 5±25% G212E61TF 6±25% G212E12TF 1±25% G212U1TF ~ G212U17TF 17±25% G212U3TF 3±25% G212U47TF 47±25% G212U7TF 7±25% G212U121TF 12±25% G212U221TF 22±25% G212U31TF 3±25% G212U421TF 42±25% Thickness (mm) [inch].85±.2 [.33±.8]
9 Sunlord Specifications for Multi-layer Chip Ferrite Bead Page 9 of 16 G212U61TF 6±25% G212U12TF 1±25% IV. G 3216 Series of Beads Part Number Impedance (Ω) Test Freq. DC Ir (MHz) (Ω) Max. (ma) Max. G3216DTF ~ G3216D31TF 31±25% G3216D6TF 6±25% G3216D8TF 8±25% G3216D121TF 12±25% G3216D221TF 22±25% G3216D31TF 3±25% G3216D51TF 5±25% G3216D61TF 6±25% G3216D12TF 1±25% G3216D122TF 12±25% G3216U31TF 31±25% G3216U7TF 7±25% G3216U31TF 3±25% G3216U61TF 6±25% Thickness (mm) [inch].85±.2 [.33±.8] Products with other electrical characteristic can be provided upon customer s request. Please contact your local sales. D, E, U Material Comparison G168D121TF G168E121TF G168U121TF Impedance Frequency Characteristics G63 series 16 G63D6TF 2 G63D8TF 3 G63D121TF G63D241TF 1 G63D471TF 12 G63D61TF
10 Sunlord Specifications for Multi-layer Chip Ferrite Bead Page 1 of 16 G15 series 3 G15D1TF 1 G15D31TF 2 G15D6TF G15D8TF 3 G15D121TF 6 G15D221TF G15D31TF 8 G15D421TF 8 G15D51TF G15D61TF 12 G15D751TF 18 G15D12TF G15D152TF 15 G15E8TF 2 G15E121TF G15E241TF 9 G15E61TF 2 G15U1TF
11 Sunlord Specifications for Multi-layer Chip Ferrite Bead Page 11 of 16 5 G15U3TF 12 G15U7TF 2 G15U121TF G15U221TF 5 G15U31TF 6 G15U421TF G15U61TF G15U12TF G168 series 25 G168D11TF 8 G168D3TF 15 G168D6TF G168D8TF G168D11TF G168D121TF G168D221TF 6 G168D31TF 1 G168D471TF
12 Sunlord Specifications for Multi-layer Chip Ferrite Bead Page 12 of 16 1 G168D61TF 12 G168D751TF 16 G168D12TF G168D152TF 2 G168D182TF 25 G168D22TF G168D222TF 15 G168E8TF 2 G168E121TF G168E181TF 5 G168E31TF 9 G168E61TF G168E12TF 4 G168E22TF 2 G168U1TF G168U3TF 1 G168U6TF 2 G168U121TF
13 Sunlord Specifications for Multi-layer Chip Ferrite Bead Page 13 of 16 4 G168U221TF 5 G168U31TF 75 G168U471TF G168U61TF 12 G168U12TF G212 series 25 G212D7TF 8 G212D19TF 8 G212D3TF G212D8TF 25 G212D121TF 4 G212D181TF G212D221TF 5 G212D31TF 7 G212D421TF
14 Sunlord Specifications for Multi-layer Chip Ferrite Bead Page 14 of 16 8 G212D61TF 15 G212D751TF 8 G212D51TF G212D12TF 25 G212D22TF 2 G212D152TF G212E121TF G212E8TF G212E181TF G212E51TF G212E61TF G212E31TF G212E12TF G212U1TF G212U17TF G212U3TF 8 G212U47TF 12 G212U7TF
15 Sunlord Specifications for Multi-layer Chip Ferrite Bead Page 15 of 16 G212U121TF G212U221TF G212U31TF G212U61TF 6 G212U421TF 12 G212U12TF G3216 series 4 G3216DTF 8 G3216D31TF 16 G3216D6TF G3216D8TF 25 G3216D121TF 4 G3216D221TF G3216D31TF 6 G3216D51TF 8 G3216D61TF
16 Sunlord Specifications for Multi-layer Chip Ferrite Bead Page 16 of G3216D12TF 16 G3216D122TF 4 G3216U31TF G3216U7TF 45 G3216U31TF 8 G3216U61TF
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