MGB SERIES (Chip Ferrite Bead for GHz Range) Engineering Specification

Transcription

1 MG SERIES (Chip Ferrite ead for GHz Range) Engineering Specification RoHS Features and Application.Effectively filtering capability over a wide range of frequency (Several MHz to GHz).Monolithic inorganic material construction.closed magnetic circuit avoids crosstalk.excellent solderability and heat resistance.high reliability Pb RF and wireless communication,information technology equipment which includes computer,laptop,telecommunications,radar detectors,automotive electronics,cellular phones,pagers,audio equipment,pdas,keyless remote system and Navigator systems 1. PART NUMER AND CHARACTERISTICS TALE MG-G Series Part No. DCR(Ω) (Max.) Rated Current (ma) MG15-G Series MG15G61FP MG15G12YP MG15G182EP ** For special part number which is not shown in the above table, please refer to appendix. Test Instrument : Agilent E4991A RF Impedance / Material Analyzer HP4338A/ Milliohmmeter TOPWARD 331D DC Power Supply Test Level : 25 mv TITLE : MG Series Engineering Specification SPEC REV.: A7 Page 1 of 8

2 2.PART NUMER CODE MG 15 G 6 1 F P Series Name 2 Size Code: the first two digitals : length(mm), the last two digitals : width(mm) 3 Material Code 4 Impedance(Ω) ± 25% (ex:61=6ω) 5 Fixed Decimal Point 6 Rated Current Code C=1mA D=15mA E=2mA F=3mA G=4mA H=5mA L=1mA M=15mA N=2mA Y=25mA 7 Soldering : Green Parts: A Soldering Lead-Free Lead-Free for whole chip 8 Packaging: P - Embossed paper tape, 7" reel. 3.SHAPES AND DIMENSIONS T L E W TYPE 155 (EIA 42) L 1.±.1 W.5±.1 T.5±.1 E.25±.1 TITLE : MG Series Engineering Specification SPEC REV.: A7 Page 2 of 8

3 4.TYPICAL CHARACTERISTIC MG15G61 IMPEDANCE vs. FREUQENCY CHARACTERISTICS INSERTION LOSS vs. FREUQENCY CHARACTERISTICS 2, 1,8 1,6-1 Impedance (ohm) 1,4 1,2 1, Z Intertion loss(d) S21 2 X R , 1, Frequency (MHz) , 1, Frequency(MHz) MG15G12 IMPEDANCE vs. FREUQENCY CHARACTERISTICS INSERTION LOSS vs. FREUQENCY CHARACTERISTICS 3, 2,5-1 Impedance (ohm) 2, 1,5 1, Intertion loss(d) -2-3 S21 5 Z X R , 1, Frequency (MHz) , 1, Frequency(MHz) TITLE : MG Series Engineering Specification SPEC REV.: A7 Page 3 of 8

4 MG15G182 IMPEDANCE vs. FREUQENCY CHARACTERISTICS INSERTION LOSS vs. FREUQENCY CHARACTERISTICS 5, 4,5 4, -1 Impedance (ohm) 3,5 3, 2,5 2, 1,5 1, Z Intertion loss(d) S21 5 X R , 1, Frequency (MHz) , 1, Frequency(MHz) 5.RECOMMENDED SOLDERING CONDITIONS TITLE : MG Series Engineering Specification SPEC REV.: A7 Page 4 of 8

5 6.LAND PATTERNS FOR REFLOW SOLDERING Unit : mm (inches) Size A C 15.4 ~ ~ ~.7 (.15 ~.23) (.63 ~.12) (.16 ~.27) 7.RELIAILITY AND TEST CONDITION Test item Test condition Criteria a. Temperature : -4 ~ +85 Temperature Cycle b. Cycle : 1 cycles a. No mechanical damage c. Dwell time : 3minutes b. Impedance value should be d. Measurement : at ambient within ± 2 % of the initial temperature 24 hrs after test value completion Operational Life iased Humidity a. Temperature : 125 ± 5 b. Test time : 1 hrs c. Apply current : full rated current d. Measurement : at ambient temperature 24 hrs after test completion a. Temperature : 4 ± 2 b. Humidity : 9 ~ 95 % RH c. Test time : 1 hrs d. Apply current : full rated current e. Measurement : at ambient temperature 24 hrs after test completion a. No mechanical damage b. Impedance value should be within ± 2 % of the initial value a. No mechanical damage b. Impedance value should be within ± 2 % of the initial value TITLE : MG Series Engineering Specification SPEC REV.: A7 Page 5 of 8

6 Test item Test condition Criteria Resistance to Solder Heat a. Solder temperature : 26 ± 5 b. Flux : Rosin c. DIP time : 1 ± 1 sec a. More than 95 % of terminal electrode should be covered with new solder b. No mechanical damage c. Impedance value should be within ± 2 % of the initial value Adhesive Test Steam Aging Test a. Reflow temperature : 245 It shall be Soldered on the substrate applying direction parallel to the substrate b. Apply force(f) : 5 N c. Test time : 1 sec a. Temperature : 93 b. Test time : 4 hrs c. Solder temperature : 235 ± 5 d. Flux : Rosin e. DIP time : 5 ± 1 sec a. No mechanical damage b. Soldering the products on PC after the pulling test force > 5 N More than 95 % of terminal electrode should be covered with new solder Rated Current Test a. Apply current : full rated current / 5min Temperature rise should be less than 25 8.GENERAL TECHNICAL DATA Operating temperature range : - 55 ~ +125 Storage Condition : Less than 4 and 7% RH Storage Time: 6 months Max. Soldering method: Reflow or Wave Soldering TITLE : MG Series Engineering Specification SPEC REV.: A7 Page 6 of 8

7 9.TAPE AND REEL SPECIFICATIONS PAPER CARRIER 1.TAPING DIMENSIONS Unit: mm 155 Symbol PAPER W 8.±.1 P 2.±.5 E 1.75±.5 F 3.5±.5 D 1.55±.5 D1 NA Po 4.±.1 Po1 NA P2 2.±.5 Ao.62±.3 o 1.12±.3 Ko(T).6±.3 t NA TITLE : MG Series Engineering Specification SPEC REV.: A7 Page 7 of 8

8 11.REEL DIMENSIONS Unit: mm Reel Packaging Quantity PART SIZE (EIA SIZE) 7 REEL Qty. (pcs) 15 (42) 1, The Contents of a box: 15 (42): 5 reels / inner box; TITLE : MG Series Engineering Specification SPEC REV.: A7 Page 8 of 8