MULTILAYER CHIP BEADS EMI SUPPRESSORS

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1 MULTILAYER CHIP BEADS EMI SUPPRESSORS FEATURES Multilayer technology, offering Monolithic structure, excellent for high reliability % Magnetic Shielding, absolutely ZERO CROSS TALK Excellent solderability and very high heat resistance Several different sizes from 0402 to 1210 Wide impedance levels from 7 ohms to 2 ohms Variety of noise suppression levels from different frquencies RoHS compliant and % Lead and Halogen free Very low price ELECTRICAL CHARACTERISTICS Impedance tolerance ±25% Test frequency Standard MHz Special either MHz or MHz Test equipment for Z HP-4921A with test fixture HP-16192A for Digital Milliohm Meter for current HP-6632DC Power Supply with HP-16A and HP-4291A current Obtained when component exhibits temperature rise of 28 C max. PHYSICAL CHARACTERISTICS Operating temperature -55 C to C Soldering heat resistance 2 C ± 5 C for 10 ±1 sec. Terminal construction Electroplating with 3 layers: Silver, Nickel and Tin Solderability Lead free solder reflow profile, referred to J-STD-020C Reflow times: 3 times max. Tape and reel specifications 8 mm or 12 mm embossed carrier tape with 178 mm reel for standard packaging, and with 3 mm reel for pieces packaging Quantity per reel Special reel size 3 mm 10,000 Standard 0402 size 10, size 4, size 4,000 6 size 3, size 2, DIMENSIONS IN MILLIMETERS REFLOW PROFILE Size A B C D ± ± ± ± ± 0.2 ± 0.1 ± ± ± ± 0.2 ± 0.1 ± ± ± ± 0.2 ± 0.1 ± 0.2

2 PART NUMBERING SYSTEM CB G (1) Indicates Chip Bead (1) (2) (3) (4) (5) (2) levels G for General applications H for High speed signal C for high Z for high Impedance P for Power supply line (3) Sizes From 0402 to 1210 (4) Impedance value examples 07 = 7 ohms 70 = 70 ohms = ohms 702 = 0 ohms (5) current examples 05 = ma = ma 2 = 0 ma DETAILS OF EACH APPLICATION LEVELS 1. The General application level G type Chip bead generates impedance from relatively low frequencies. It is effective in noise suppression for a wide frequency range from MHz to several hundred MHz. 2. The High speed signal H type Chip bead can minimize attenuation of the signal waveform due to its sharp impedance characteristics. Various impedance values are available to match a signal frequency. 3. The high C type Chip bead is very good for use in high current circuits up to 0 milliamps DC due to its very low DC resistance. 4. The high Impedance value Z type Chip bead features high impedance values up to 2 ohms. 5. The Power supply line P type Chip bead was developed for noise suppression in DC power lines for USB interface circuitry and hard disk drives. P type features low DC resistance with coupled high current capability. LAND PATTERN RECOMMENDED Size A ( mm ) B (mm) C ( mm )

3 Prior Z ( Ω MHz ± 25% Max ( Ω ) Max (ma ) CBG CBG CBG CBG CBG CBG CBG CBG GENERAL CBG CBG CBG CBG CBG03-- CBG03-- CBG CBG03-0- CBG CBG CBG CBG CBG CBG CBG CBG CBG CBG05-- CBG CBG CBG CBG05-- CBG05-- CBG05-1- CBG CBG CBG CBG CBG05-0- ACB-03 BCB-03 DCB-03 ICB-03 & 03A KCB-03 & 03A JCB-03 HCB-03 LCB-03 & 03A ACB-05A ACB-05 BCB-05 DCB-05 ICB-05 ECB-05 KCB-05 NCB-05 JCB-05 MCB-05 LCB-05-S & CBG6-26- CBG6-31- CBG6-42- CBG6-- CBG6-70- CBG6-90- CBG6--90 CBG6--90 CBG6--70 CBG CBG6--40 CBG ACB-6 BCB-6 & 6-S ECB-6 DCB-6 ICB-6 JCB-6 HCB-6 KCB CBG BCB

4 Max (ma) max (Ω) CBH CBH CBH CBH CBH CBH03-- CBH03-- CBH03-- CBH03-- CBH CBH CBH CBH CBH CBH CBH CBH05-- CBH05-- CBH CBH CBH CBH05-0- CBH CBH6-19- CBH6--70 CBH6--70 CBH6-- CBH6-0- CBH6--55 CBH6-0- CBH CBH CBC03--2 CBC03--2 CBC CBC CBC CBC CBC CBC CBC CBC05--2 CBC05--2 CBC05--2 CBC Z MHz ±25% Prior High Speed High LCB A BCB A ICB A DCB A

5 Prior Z MHz ±25% max (Ω) Max (ma) CBC CBC CBC CBC CBC JCB A LCB A High CBC6--2 CBC CBC6--2 CBC6--2 CBC6--2 CBC CBC CBC CBC CBC6--2 CBC CBC BCB-6-1.5A ECB-6-3.0A DCB-6-3.0A ICB-6-3.0A KCB-6-2.0A CBZ CBZ CBZ CBZ CBZ MCB-03 NCB-03 PCB-03 YCB-03 ZCB High Impedance CBZ CBZ CBZ CBZ CBZ CBZ * CBZ HCB-05 PCB-05 YCB-05 ZCB Notes * Nom height is 1.15 CBZ6-0- CBZ LCB Power Line CBP05--2 CBP CBP05--2 CBP CBP CBP

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