Current Sensing Resistors FBF Series Metal Paste Type High Power Lead Free Chip Resistors

Transcription

1 1. SCOPE 1.1 Purpose Current Sensing Resistors Fixed Thick-Film Metal Paste High-Power Chip Resistors. Rated power up to 2W and apply to Current Sensing in : Consumer Electronics SMPS M/B BTC Portable Device Electronic equipment etc. The product is RoHS compliant &. Halogen Free Guide of Current Sensing Resistors Series Product Type Resistance Range (<1 ) FMF Metal Strip 3m ~50m FBF Metal Paste Thick Film *. Please refer detail of table m ~ 910 m 1.2 Configuration Type 1. 40m Type 2. 39m page 2 of 9

2 1.3 Part Number: FBF 06 F T - R100 Type Size Toleranc e Packing Power Code FBF 03 : 0603 F : T : Paper tape P 5 Kpcs 05 : 0805 J : ± 5% Power 06 : : : : 2512 Resistance Marking (E-24 Series) P : Plastic tape 4 Kpcs Enhance Marking R150 R50 47M 4 digit marking for ±1%,±5% 0805, 1206, 1210,2010, 2512 Examples. R150 = 150 m, R020 = 20 m 3 digit marking for ±1%,±5% 0603 Examples. R12 = 120 m, R50 = 500 m 3 digit marking for ±1%,±5% 0603 (47m ~91m Examples. 20M = 20 m 2. PERFORMANNCE CHARCTERISTICS 2.1 Power Derating Curve by Ambient Temperature page 3 of 9

3 2.2 Mechanical Dimensions unit: mm. DIMENSIONS Type 1. L W C D T FBF ± ± ± ± ±0.10 FBF ± ± ± ± ±0.10 FBF ± ± ± ± ±0.10 FBF ± ± ± ± ±0.10 FBF ± ± ± ± ±0.10 FBF ± ± ± ± ±0.15 DIMENSIONS Type 2. L W C D T FBF ± ± ± ± ±0.10 FBF ± ± ± ± ±0.10 FBF ± ± ± ± ±0.10 FBF ± ± ± ± ±0.10 FBF ± ± ± ± ±0.15 L Marking W Marking T D C 2.3 Recommended Solder Pad Dimensions W Type W D L FBF mm 2.45 mm 7.60 mm FBF mm 1.50 mm 6.80 mm FBF mm 1.30 mm 4.70 mm FBF mm 1.30 mm 4.70 mm FBF mm 1.15 mm 3.50 mm FBF mm 1.00 mm 3.00 mm L D page 4 of 9

4 3. SPECIFICATION 3.1 Rating Table. Current Sensing Resistors Standard Type Type Size Max. Power RCWV Rating at 70 Max. Overloa d Voltage Resistanc Temperature Resistance Range e Coefficient Tolerance (TCR; ppm/ ) Min. Max. (%) Standard Resistanc e Values FBF /8W 331mV 754mV ±400 10m 19m ±200 20m 99m ± 5% ± m 910m FBF /4W FBF /3W 477mV 1067mV 551mV 1231mV ±200 10m 46m E-24 FBF /2W 675mV 1508mV ±200 40m 46m FBF /2W FBF mV 1508mV 1W 954mV 2133mV Special Request Please Contact Factory Note (i) RCWV (P R) 1/2 or Max. RCWV listed above, whichever is lower. RCWV Working Voltage(V) P Rated Power(W) R Resistance Value( ) page 5 of 9

5 Power Enhance Type Type Size Power Rating at 70 Max. RCWV Current Sensing Resistors Max. Overloa d Voltage Resistanc Temperature Resistance Range e Coefficient Tolerance (TCR; ppm/ ) Min. Max. (%) Standard Resistanc e Values ±400 10m 19m FBF /4W 477mV 1067mV ± 5% ±200 20m 99m ± m 910m FBF /2W 675mV 1508mV FBF /4W 826mV 1847mV ±200 10m 46m E-24 FBF /4W 826mV 1847mV ±200 40m 46m FBF W 954mV 2133mV FBF W 1349mV 3017mV Special Request Please Contact Factory Note (i) 2W loading with total solder-pad and trace size of 300 mm 2 (ii) RCWV (P R) 1/2 or Max. RCWV listed above, whichever is lower. RCWV Working Voltage(V) P Rated Power(W) R Resistance Value( ) page 6 of 9

6 3.2 Reliability Performance Test Item Specification Test Method DC Resistance F ±1% ; J ±5% IEC / JIS C , Clause 4.5 Measure the resistance Value. Short Time Overload Solderability Resistance to solder Heat Temperature Coefficient of Resistance (TCR) Load Life Insulation Resistance Bending strength J: R ±(2% F: R ±(1% Over 95% of termination must be covered with solder J: R ±(1% F: R ±(0.5% No mechanical damage Test Temperature: 25~155 Refer to T.C.R specification in 3.1 Electrical table. J R ±(3% F R ±(1% 5 Rated power for 5 seconds IEC / JIS C ,Clause 4.17 After immersing flux, dip in the 245±2 Between termination and coating must be over 1000M J R ±(1% 1m ) F R ±(0.5% 1m ) No mechanical damage molten solder bath for 3±0.5 sec. IEC / JIS C ,Clause 4.18 With 260±5 for 10±1sec. IEC / JIS C , Clause 4.8 T 1 T 2 Test temperature 25 ~ 155 TCR(ppm/ ) (R 2 R 1 ) / R 1 1 / (T 2 -T 1 ) 10 6 IEC / JIS C ,Clause 4.25 Rated voltage for 1.5hours for followed by a pause 0.5 hour at 70±3. Cycle repeated 1000 hours IEC / JIS C , Clause 4.6 Test voltage 100±15V IEC / JIS C ,Clause 4.33 Resistance change after bended on the 90mm PCB. Bending width 3mm for mm for page 7 of 9

7 4. PACKAGING 4.1 Peel Strength of Top Cover Tape The peel speed shall be about 300 mm/min The peel force of top cover tape shall between 0.1 to 0.7N 4.2 Tape Packaging Dimensions E P 2 P 0 D W F B P 1 Accumulated dimensional tolerance 40±0.2mm Size A B W F E P1 P2 P0 D ± ± ± ± ± ± ± ± / ± ± ± ± ± ± ± ± / ± ± ± ± ± ± ± ± / ± ± ± ± ± ± ± ± / ± ± ± ± ± ± ± ± / ± ± ± ± ± ± ± ± /-0 A unit mm page 8 of 9

8 4.3 Reel Dimensions Size Packaging Q ty A N C D B G T kpcs/Reel 10kpcs/Reel 20kpcs/Reel 178.0± ± ±0.5 20(Min.) 2.0± ± max ± ± ±0.5 20(Min.) 2.0± ± max ± ± ±0.5 20(Min.) 2.0± ± max kpcs/Reel 8kpcs/Reel 178.0± ± ±0.5 20(Min.) 2.0± ± max ± ± ±0.5 20(Min.) 2.0± ± max. 16kpcs/Reel 330.0± ± ±0.5 20(Min.) 2.0± ± max. unit mm All product specification and data are subject to change without notice. page 9 of 9