Current Sensing Resistor Shunt Type >SMS Series. General. Application

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1 Page: 1/ 7 General Chip size from 2512 to 5931 Resistance value from 0.2m to 4m Low thermal EMF Low TCR Lead free, RoHS compliant for global pplications and halogen free pplication Switching model power supply. Battery pack. Notebook, personal computer. Test Instrument. Power mplifier. Electrical Specifications Power Rating at 70 (W) Resistance Range (mω) TCR (ppm/ ) Resistance tolerance Operation Temp. Range ± ± ± ± ± ±75 ±1%(F) ±2%(G) ±5%(J) -55 ~+170

2 Page: 2/ 7 Part Number information SMS 39 M 5 F R002 T Series Name: SRT Shunt 2 Chip size: 25: : : Material Code: M:MnCu F:FeCr 4 Power Code: 3:3W 5:5W 7:7W 5 Resistance Tolerance: F:±1% G:±2% J:±5% 6 Resistance Code:0L20=0.2mΩ R002=2mΩ 7 Packaging Code: T: Tape& Reel B:Bulk Pack Dimensions Resistance Materials Range (mω) MnCu 0.2 L W H D1 D2 1.70± ±0.10 MnCu ± ±0.10 MnCu ± ±0.10 FeCr ± ± ± ± ± ±0.10 FeCr ± ±0.10 FeCr ± ±0.10 FeCr ± ±0.10 MnCu ± ±0.10 MnCu ± ±0.10 MnCu ± ± ± ± ± ±0.10 FeCr ± ±0.10 FeCr ± ±0.10 FeCr ± ±0.10 MnCu ± ±0.10 MnCu ± ± ± ± ± ±0.10 FeCr ± ±0.10 FeCr ± ±0.10

3 Page: 3/ 7 Recommended Land Patterns B C Materials No. Materials 1 Copper electrode 2 MnCu/FeCr 3 Copper electrode Power Derating Curve

4 Page: 4/ 7 Recommended Solder Curve 1. Infrared Reflow Temperature: 260 Time: 5sec Max. Recommend Reflow profile: Profile Feature verage Ramp-up Rate (Tsmax to Tp) Preheat Temperature Min.(Tsmin) Temperature Max.(Tsmax) Time(Tsmin to Tsmax) Pb-Free ssembly 3 /sec Max sec~120sec Peak Temperature(Tp) 260 Time within 5 of actual Peak Temperature(Tp) Melting tin time(tl) Ramp-down Rate Time 25 to peak Temperature 5sec 20sec~30sec 6 /sec Max. 8minMax. 2. Wave soldering 3. Hand Soldering Reservoir Temperature: 260 Temperature: 350 Time in Reservoir: 10sec Max. Time: 5sec Max.

5 Page: 5/ 7 Product Characteristics Item Test condition/ Methods Performance Standard Resistance Measuring resistance value at room temperature 25 ±5 Refer to SRT Spec IEC Temperature TCR =(R-R0)/R0(T2-T1)X 10 6 coefficient of T1 T2 Refer to SRT Spec Method 304 resistance Test temperature:+25 ~+125 Short time Overload 5 times the rated power for 5 seconds R ±1% MIL-R-26E Resistance to 260 ± 5 time:12sec± 0.5sec R ±1% Soldering Heat Method 210 Thermal shock -55 (15min)/+150 (15min), 1000 cycles R ±1% Low temperature operation High Temperature Storage Temperature Humidity Bias Test Method107G Rating power at -65 for 45 min R ±1% MIL-STD-26E 170 for 1000hours, No power R ±1% IEC ,85% RH,10%bias, 1000hours R ±0.5% Mechanical shock 100 g s,6 msec, 5pulses R ±0.5% Vibration Load life Moisture resistance The frequency varies from 10HZ to 2000HZ, 1 min, 3 directions, and 12 hours 70 ± 2, 1000 hours, at rated power 1.5 hours ON, 0.5 hours OFF,method106, No power, 7b not required R ±0.5% R ±1% R ±1% Method103B Method 213 Method 204B MIL-STD-26E Method 106

6 Page: 6/ 7 Packaging 1. Embossed Tape Dimensions Top Tape Embossed Tape Resistor B E F W ± ± ± ± ± ± ± ± ± ± ± ± ± ± ±0.20 P0 P1 P2 D0 T ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± Reel Dimensions N C D B G T ± ± ± Min. 2.00± ± Max ± ± ± Min. 2.00± ± Max ± ± ± Min. 2.00± ± Max.

7 Page: 7/ 7 3. Quantity of Package Quantity(pcs) Peeling Test Storage The ambient temperature shall between 5 ~30. The relative humidity recommended for storage is between 25%RH~60%RH. Sealed plastic bags with desiccant shall be used to reduce the oxidation of the termination and shall only be opened prior to use. The products shall not be stored in areas where harmful gases containing sulfur or chlorine are present.