1. Packaging Outline Dimensions Specifications ) Absolute Maximum Ratings (Ta=25 C)... 4

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2 Table of contents 1. Packaging Outline Dimensions Specifications ) Absolute Maximum Ratings (Ta=25 C) ) Typical Electro-Optical Characteristics (Ta=25 C) Product Code & Ranks ) Chromaticity Coordinates Ranks(I F =120mA,Ta=25 ) ) Forward Voltage Ranks(Ta=25 ) ) Luminous Flux Ranks(Ta=25 ) Composition of Package Environmental Pollution Free Typical Electro-optical Characteristics Curves Reliability Precautions for Use Package / 20

3 Features Top view white LED with PLCC package. Package dimensions: 7.0x2.0x0.7 mm 3 Lambertian Emitter, with viewing angle 125 High luminous flux output. Wide colour gamut (NTSC>95% with CSOT OpenCell ) ESD protection design (ESD HBM > 8000 V). Pb-free. ROHS compliant. 1. Packaging Outline Dimensions Cathode mark Notes:All dimensions are in millimeters and tolerance is +/-0.10mm. Heatsink(connected to the Cathode) 3 / 20

4 2. Specifications 1) Absolute Maximum Ratings (Ta=25 C) Items Symbol Maximum Power P d 1 W Forward current I F 150 ma Pulse forward current (Duty I FP 400 ma Operating temperature T opr -40 C ~ +85 C Storage temperature T stg -40 C ~ +100 C Maximum Junction temperature Maximum Solder-point temperature T j 125 C T s 80 Soldering temperature T sol Reflow Soldering : 260 C for 10 sec. Hand Soldering : 350 C for 3 sec. Notes:LEDs are NOT designed to be driven in reverse bias. 4 / 20

5 2) Typical Electro-Optical Characteristics (Ta=25 C) Items Symbol Forward Current I F =120mA Unit Forward Voltage V F 6.0 V Luminous Flux Φ 60 lm Luminous Efficiency - 84 lm/w Color Coordinates _ (0.260, 0.230) - Viewing Angle 2θ 1/2 125 Thermal Resistance R th(j-s) 10 /W ESD HBM _ >8000 V 3. Product Code & Ranks LL - QB XXXX - FF X GG - T LL: APTE/Linlux Technology QB:SMD7020 for Backlight application(2 chips in 1 package) XXXE: Reserved code T: Package T: tape and reel FF:Chromaticity Coordinates Ranks X: Forward Voltage Ranks GG: Luminous Flux Ranks 5 / 20

6 1) Chromaticity Coordinates Ranks(I F =120mA,Ta=25 ) A6 B6 C6 D6 E6 F6 G A7 B7 C7 D7 E7 F7 G A8 B8 C8 D8 E8 F8 G Notes:Measurement Uncertainty of the Color Coordinates : ± / 20

7 2) Forward Voltage Ranks(Ta=25 ) V F Rank Condition Min. Typ. Max. Unit H J I F =120mA K (ΔV F =0.2V) V L Notes:Measurement Uncertainty of the Forward Voltage : ± 0.05V 3) Luminous Flux Ranks(Ta=25 ) Luminous Flux Rank Condition Min. Typ. Max. Unit G H H I F =120mA H lm S S Notes:Measurement Uncertainty of the Luminous Flux : ± 5% 4. Composition of Package Component Materials 7 / 20

8 Number Items Description Materials 1 Chip Blue LED InGaN/Sapphire 2 Die adhesive Silicone 3 Encapsulant Silicone(Phosphor Mixed) 4 Leadframe Electrodes Metal Ag Plating Copper Alloy 5 Leadframe Body Thermo Plastic Heat-resistant Polymer 6 Zener Diode V R =14V Si 7 Conductive adhesive Silver-filled Epoxy 8 Wire 1.2mil Au 5. Environmental Pollution Free 1) Testing Institute:Shenzhen AOV Testing Technology Co., Ltd. 2) Test Method: 8 / 20

9 3) Test Flow: 9 / 20

10 10 / 20

11 4) Test results: 11 / 20

12 6. Typical Electro-optical Characteristics Curves 1) Spectrum 2) I-V Curve (Ta=25 C) 12 / 20

13 3) Iv-I Curve (Ta=25 C) 4) Intensity distribution 13 / 20

14 5) Ambient Temp. Vs. Relative Luminous Flux 6) Ambient Temp. Vs. Forward Voltage 7) Ambient Temp. Vs. Chromaticity Coordinate 14 / 20

15 8) Duty Ratio Vs. Allowable Forward Current 15 / 20

16 9) L70 Lifetime Prediction 16 / 20

17 7. Reliability Items Condition Cycle Ref. Standard Operating life at room temperature T a=25 C, I F=120mA 1000 hours JESD22-A108C Operating life at high temperature T a=85 C, I F=120mA 1000 hours JESD22-A108C Operating life at high temperature and high humidity T a=85 C, RH=85%, I F=120mA 1000 hours JESD22-A101B Storage life at high temperature T a=100 C 1000 hours JESD22-A103B Storage life at low temperature T a=-20 C 1000 hours JESD22-A1119 Thermal shock -20 C /120 C, 20mins dwell, 10sec transfer 200 cycles JESD22-A106B Thermal cycle -40 C /120 C, 15mins dwell, 15 mins transfer 200 cycles JESD22-A104B ESD-HBM JESD22-A114D Notes: Failure Criteria: (1) Forward voltage shift Delta VF 0.1V; (2)Flux output degradation Delta Iv 10%. (3)1 REJ and 0 ACC of 22 samples of each test item. 17 / 20

18 8. Precautions for Use 1) Soldering Characteristics i. Reflow Soldering Characteristics IPC/JEDEC J-STD-020C Classification Reflow Profiles Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate 3 /second max. 3 /second max. ( Ts to max T P ) Preheat -Temperature Min( Ts ) min -Temperature Max( Ts ) max -Time( Ts to min Ts )(ts) max seconds seconds Time maintained above: -Temperature( T L ) -Time( t L ) seconds seconds Peak Temperature( T P ) Time within 5 of actual Peak 10-30seconds 20-40seconds Temperaturet P Ramp-down Rate 6 /second max. 6 /second max. Time 25 to Peak Temperature 6 minutes max. 8 minutes max. Note : All temperatures refer to the application Printed Circuit Board (PCB), measured on the surface adjacent to the package body. 18 / 20

19 ii. Hand Soldering(Lead Part) Temperature Max. 340 Soldering Time Max. 3 sec(only one time) iii. Soldering Iron Basic spec is 5sec when 260. If temperature is higher, time shorter (+10-1sec). Power dissipation of Iron should be smaller than 15W, and temperature should be controllable. Surface temperature of the device should be under 230 iv. Rework 1. Customer must finish rework within 5 sec under The head of iron can not touch the resin and copper foil. 3. Twin-head type is preferred. 2) Storage Before opening the package The LEDs should be kept at 30 or less and 90% RH or less. The LEDs should be used within a year. When storing the LEDs, moisture proof packaging with absorbent material(silica gel) is recommended. After opening the package The LEDs should be kept at 30 or less and 70% RH or less. The LEDs should be soldered within 168 hours(7days) after opening the package. If unused LEDs remain, they should be stored in moisture proof packages, such as sealed containers with package of moisture absorbent material(silica gel). It is also recommended to return the LEDs to the original moisture proof bag and to reseal the moisture proof bag again. If the moisture absorbent material(silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions. Baking treatment : more than 4hours at 70 LED operating environment and sulfur element composition cannot be over 100PPM in the LED mating usage material. 19 / 20

20 9. Package 1) Label pattern 2) Package: Tape and Reel (3 k-pcs) 20 / 20

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