Anti-Surge THICK FILM CHIP FIXED RESISTOR

Transcription

1 Anti-Surge THICK FILM CHIP FIXED ESISTO FEATUES Miniature and light weight. Suit for reflow and wave flow solder. High power,substantially increase the ability of anti-surge Stable electrical capability, high reliability. Low assembly cost, suit for automatic SMT equipment. ohs Compliant with halogen free requirement. ohs compliant Example TYPE DESIGNATION A G 06 K 1003 F T G Product Power ating Series esistance Temperature Coefficient Anti-Surge Thick Film Chip FiXED e sis tors C Q F G Power ating 1/16W 1/5W 1/4W 1/2W W U K L Power ating 200PPM/ 400PPM/ 100PPM/ 250PPM/ esistance Value esistance Tolerance Packing Style Lead-free Level (E-24 ), Three digits (E-24 series): The first two digits are significant figures and the third one denotes number of zeros. (E-96 ), Four digits(e-96 series): The first three digits are significant figures and the four one denotes number of zeros. Decimal point should be expressed by "". Example 103=10K E =100K E-96 10=1.0 Tolerance D 0.5% F 1% G 2% J 5% K 10% M 20% T B C Packing Style Tape & eel Bulk Case Case No Marking L G Lead-free Level ( 100ppm) Terminal Lead-free ( pb content in terminal 100ppm) ( 1000ppm) Low Lead ( pb content in resistor body 1000ppm) ( 100ppm) Low Lead ( pb content in resistor body 100ppm) Products marked that way, please contact the manufacturer.

2 Anti-Surge THICKFILMCHIPFIXEDESISTO CONSTUCTION AND DIMENSION TYPE L W t a b APPEAANCE, The surface of resistor is covered with Protective Coating which hard to fade, and the surface of coating should avoid unevenness. The terminal part is covered equable, the plating is hard to fade, and should avoid unevenness,flaw, pinhole and discoloration. With a clear mark, the resistor body is crack-free. GB/T GB/T IEC EFEENCE STANDAD

3 DEATING CUVE Percent rat edload Operating Temperature ange Ambient temperature ( ) 70 ( ) For resistors operated in ambient over 70,rated load (power rating or current rating) shall be derated in accordance with the above figure. ATINGS Item Power ating 1/16W 1/5W 1/4W 1/2W Max.Working Voltage 50V 50V 150V 200V Max.Overload Voltage 100V 100V 300V 400V esistance Temperature Coefficient esistance ange 10 1M : 200ppm/ 1 <10,1M < 10M : 400ppm/ 1 ~10M E-24 E M : 100ppm/ 1 <10,1M < 10M : 250ppm/ esistance Tolerance 1 ~10M : 1% 2% 5% 10% 20% 10 ~1M : 0.5% Operating Temperature ange ated Temperature -55 ~ = Note ated Voltage= Power ating esistance Value or Max. Working Voltage, whichever is lower.

4 Anti-Surge THICKFILMCHIPFIXEDESISTO CHAACTEISTICS Item Specifications GB/T Test Methods ( GB/T ) ESD ESD Characteristic 5.0%+0.05 IEC According to IEC ESD simulation - thehumanbodymodel 1KV 3 1S :1 KV 3 times interval 1S; 3KV 3 1S :3 KV 3 times interval 1S; 4KV 3 1S :4 KV 3 times interval 1S; 5KV 3 1S :5 KV 3 times interval 1S; Bending Strength 1.0%+0.05 (Bending Distance): 5mm 4mm :60s 5s Duration:60s 5s then check the resistance. T.C. within specified T.C. -55 ~+125 Measure between -55 ~+125 Temperature Cycling 1.0% ~ 2 ~3 ~ min ~normal temperature 2min~3min ~155 30min 5 cycles Short Time Overload 2.0% ated voltage or Max. Overload Voltage whichever is lower for 5 seconds esistance to Soldering Heat 1.0% s 1s Steady state humidity 3.0% ~95 H ~95 H 1000h 70 Load Life 3.0% , ,1000h, ated Voltage or Max. Working Voltage, whichever is lower. 1.5h on/0.5h off Endurance at upper temperature 3.0% h esistance to Solvent 1.0% h 1h Dip in chloroethylene for 10h 1h. Insulation esistance 1000M Min 100V, 1,. Apply DC 100V between substrate and termination for 1 minute, then check insulation resistance. Solderability Adhesion 95% 95% Cover Min s 0.5s 5N 10s 1s Applying 5N 10s 1s

5 PACKAGING Tape and reel Paper taping TYPE A B W F E TYPE P P0 P1 D0 T emark:t refers to the thickness of the paper carrier tape.

6 Anti-Surge THICKFILMCHIPFIXEDESISTO eel B A C D M W T TYPE M W T A B C D Bulk case PACKAGING QUANTITY Packaging style Tape and reel Bulk case Bulk PCS Quantity