Multi-layer ceramic chip capacitors

Transcription

1 Multi-layer ceramic chip capacitors (15 (42) size, chip capacitor)!features 1) Small size (1. x.5 x.5 mm) makes it perfect for lightweight portable devices. 2) Comes packed either in tape to enable automatic mounting or in bulk cases. 3) Precise uniformity of shape and dimensions facilitates highly efficient automatic mounting. 4) Barrier layer and end terminations to improve solderability.!external dimensions (Units : mm) 1.±.5.5±.5.5±.5.5±.5!Structure.1Min..3Min..5±.5 Internal electrode Ceramic element External electrode ΙΙΙ (coating layer) External electrode ΙΙ (barrier layer) External electrode Ι (thick membrane layer)!product designation Part No. Code Product thickness Packaging specifications Reel Basic ordening unit (pcs.) K.5mm Paper tape (width 8 mm, pitch 2 mm) φ18mm (7in.) 1, L.5mm Paper tape (width 8 mm, pitch 2 mm) φ33mm (13in.) 5, C.5mm Bulk case 5, Reel (φ18, φ33mm) : compatible with EIAJ ET-72A Bulk case: compatible with EIAJ ET-721A Packaging style M C H F N 1 3 Z K Rated voltage Code Voltage 2 25V 3 16V 5 5V Capacitance-temperature Nominal Capacitance tolerance Code Code Operating temperature ( C) Temp. coefficient or percent change capacitance Code tolerance A CG(CG) 55~+125 ±3ppm/ C C ±.25pF (.5 ~ 5pF) CN R 55~+125 ±15% D ±.5pF (5.1 ~ 1pF) B 25~+85 ±1% 3-digit designation J ± 5% (11pF or more) (X7R) ( 55~+125) (±15%) according to IEC FN F 25~+85 +3%, 8% K ± 1% (Y5V) ( 3~+85) (+22%, 82%) Z + 8%, 2%

2 !Capacitance range For thermal compensation Capacitance (pf) Part number Temperature Rated voltage (V) Tolerance C ( ±.25pF) D ( ±.5pF) J ( ± 5%) A (CG) (CG) 5V Capacitance (pf) Part number Temperature Rated voltage (V) Tolerance J ( ± 5%) A (CG) (CG) 5V Product thickness (mm).5 ±.5

3 High dielectric constant Capacitance (pf) , 1,2 1,5 1,8 2,2 2,7 3,3 3,9 4,7 5,6 6,8 8,2 1, (.1µF) 12, 15, 18, 22, 27, 33, 39, 47, 56, 68, 82, 1, (.1µF) 12, 15, 18, 22, 27, 33, 39, 47, 56, Part number Temperature Rated voltage (V) Tolerance CN (R) (B) (X7R) 5V 16V 5V 25V K ( ±1%) FN (F) (Y5V) Z ( +8, 2%) 16V Product thickness (mm).5 ±.5

4 !Characteristics Class 1 (For thermal compensation) Temperature Item Operating temperature Nominal capacitance (C) (IR) Withstanding voltage Temperature A (CG) (CG) 55 C ~ 125 C Must be within the specified tolerance range. 1/(4+2C)% or less: Less than 3 pf.1% or less : 3 pf or larger 1,MΩ or 5MΩ µf, whichever is smaller The insulation must not be damaged. Within ± 3ppm/ C Test methods/conditions (based on JIS C 512) Based on paragraph 7.8 and paragraph 9 Measured at room temperature and standard humidity, 1pF or less Measurement frequency : 1 ±.1MHz Measurement voltage : 1 ±.1Vrms. Over 1pF Measurement frequency : 1 ±.1kHz Measurement voltage : 1 ±.1Vrms. Based on paragraph 7.6 Measurement is made after rated voltage is applied for 6 ± 5s. Based on paragraph 7.1 Apply 3% of the rated voltage for 1 to 5s then measure. The temperature coefficients in table 12, paragraph 7.12 are calculated at 2 C and high temperature. Terminal adherence No detachment or signs of detachment. Based on paragraph Apply 5N for 1 ± 1s in the direction indicated by the arrow. Pressure (5N) Test board Capacitor Resistance to vibration Must be within initial tolerance. Chip is mounted to a board in the manner shown on the right, subjected to vibration (type A in paragraph 8.2), and measured 24 ± 2 hrs. later. Board Solderability At least 3/4 of the surface of the two terminals must be covered with new solder. Based on paragraph 8.13 Soldering temperature: 235 ± 5 C Soldering time : 2 ±.5s Resistance to soldering heat ± 2.5% or ±.25 pf, whichever is larger. 1,MΩ or 5MΩ µf, whichever is smaller Based on paragraph Soldering temperature: 26 ± 5 C Soldering time : 5 ±.5s Preheating : 15 ± 1 C for 1 to 2 min. Withstanding voltage The insulation must not be damaged. Temperature cycling ± 2.5% or ±.25 pf, whichever is larger. 1,MΩ or 5MΩ µf, whichever is smaller Based on paragraph 9.3 Number of cycles : 5 Capacitance measured after 24 ± 2 hrs. Humidity load test ± 7.5% or ±.75 pf, whichever is larger..5% or less 5MΩ or 25MΩ µf, whichever is smaller Based on paragraph 9.9 Test temperature: 4 ± 2 C Relative humidity: 9% to 95% Applied voltage : rated voltage Test time : 5 to 524 hrs. Capacitance measured after 24 ± 2 hrs. Hightemperature load test ± 3.% or ±.3 pf, whichever is larger..3% or less 1,MΩ or 5MΩ µf, whichever is smaller Based on paragraph 9.1 Test temperature : Max. operating temp. Applied voltage : rated voltage 2% Test time : 1, to 1,48 hrs. Capacitance measured after 24 ± 2 hrs.

5 Class 2 (High dielectric constant) Item Temperature CN (R) (B) (X7R) FN (F) (Y5V) Test methods/conditions (based on JIS C 512) Operating temperature 55 C ~ +125 C 3 C ~ +85 C Nominal capacitance (C) (IR) Withstanding voltage Must be within the specified tolerance range. Based on paragraph 7.8 Measured at room temperature and standard humidity, 2.5% or less 5.% or less Measurement frequency: 1 ±.1 khz (when rated voltage is 16V: 3.5% or less) (when rated voltage is 16V: 7.5% or less) Measurement voltage : 1. ±.2 Vrms. Based on paragraph 7.6 1,MΩ or 5MΩ µf, whichever is smaller Measurement is made after rated voltage is applied for 6 ± 5s. Based on paragraph 7.1 The insulation must not be damaged. Apply 25% of the rated voltage for 1 to 5s then measure. Temperature Within ± 15% + 22, + 82% The temperature coefficients in paragraph 7.12, table 8, condition B, are based on measurements carried out at 2 C, with no voltage applied. Terminal adherence No detachment or signs of detachment Based on paragraph Apply 5N for 1 ± 1s in the direction indicated by the arrow. Pressure (5N) Test board Capacitor Resistance to vibration Must be within initial tolerance. Chip is mounted to a board in the manner shown on the right, subjected to vibration (type A in paragraph 8.2), and measured 48 ± 4 hrs. later. Board Solderability At least 3/4 of the surface of the two terminals must be covered with new solder. Based on paragraph Soldering temperature Soldering time : 235 ± 5 C : 2 ±.5s Resistance to soldering heat Within ± 5.% Within ± 2.% 1,MΩ or 5MΩ µf, whichever is smaller Based on paragraph Soldering temperature : 26 ± 5 C Soldering time : 5 ±.5s Preheating : 15 ± 1 C for 1 to 2 min. Withstanding voltage The insulation must not be damaged. Temperature cycling Within ± 7.5% Within ± 2.% Based on paragraph 9.3 Number of cycles : 5 Capacitance measured after 48 ± 4 hrs. 1,MΩ or 5MΩ µf, whichever is smaller Humidity load test ± 12.5% or less Within ± 3.% 5.% or less 7.5% or less (when rated voltage is 16V: 1.%) 5MΩ or 25MΩ µf, whichever is smaller Based on paragraph 9.9 Test temperature: 4 ± 2 C Relative humidity: 9% to 95% Applied voltage : rated voltage Test time : 5 to 524 hrs. Capacitance measured after 48 ± 4 hrs. Hightemperature load test Within ± 1.% Within ± 3.% 5.% or less 7.5% or less (when rated voltage is 16V: 1.%) 1,MΩ or 5MΩ µf, whichever is smaller Based on paragraph 9.1 Test temperature: Max. operating temp. Applied voltage : rated voltage 2% Test time : 1, to 1,48 hrs. Capacitance measured after 48 ± 4 hrs.

6 !Packaging specifications (Units : mm) Taping Reel φ18 mm plastic reel t φj E 9. ± ± 1. A B D C φ13 ±.2 φ φ t1 (Paper taping) F H Pulling direction Label position φ33 mm plastic reel 9.5 ± ± 1. Symbol Dimensions Size C 8. ±.3 Symbol D 3.5 ±.5 A E 1.75 ±.1 F 2. ±.5 B H 4. ±.1 J φ t t1.7.8 ±.5 MAX. φ13 ±.2 φ8 ± 1 φ33 ± ± ±.1 Label position EIAJ ET-72A compliant Bulk case slider shutter EIAJ ET-721 A compliant 5,pcs/case

7 !Electrical ga (CG) Characteristics IMPEDANCE (Ω) pF 1pF 1pF TEMPERATURE ( C) FREQUENCY (MHz) Fig.1 Capacitance-temperature Fig.2 Impedance-frequency gcn (X7R) Characteristics CAPACITANCE CHANGE : (%) TEMPERATURE : ( C) Fig.3 Capacitance-temperature 1 5 Dissipation factor (%) 1 IMPEDANCE (Ω) ,pF 1,pF FREQUENCY (MHz) Fig.4 Impedance-frequency gfn (Y5V) Characteristics CAPACITANCE CHANGE : (%) TEMPERATURE : ( C) Fig.5 Capacitance-temperature Dissipation factor (%) 1 IMPEDANCE (Ω) ,pF 1,pF.1 1,pF FREQUENCY (MHz) Fig.6 Impedance-frequency

8 gtemperature cycling test A (CG) Characteristics (1pF) JIS C / +125 C 1cyc JIS C / +125 C 1cyc JIS C / +125 C 1cyc Fig.7 Fig.8 tanδ Fig CN (X7R) Characteristics (1,pF) JIS C / +125 C 1cyc JIS C / +125 C 1cyc I JIS C / +125 C 1cyc Fig.1 Fig.11 tanδ Fig FN (Y5V) Characteristics (1,pF) JIS C / +85 C 1cyc JIS C / +85 C 1cyc JIS C / +85 C 1cyc Fig.13 Fig.14 tanδ Fig.15

9 ghigh-temperature load test A (CG) Characteristics (1pF) JIS C C 1,h OVERLOAD : 2% RATED VOLTAGE JIS C C 1,h OVERLOAD : 2% RATED VOLTAGE JIS C C 1,h OVERLOAD : 2% RATED VOLTAGE Fig.16 Fig.17 tanδ Fig CN (X7R) Characteristics (1,pF) JIS C C 1,h OVERLOAD : 2% RATED VOLTAGE JIS C C 1,h OVERLOAD : 2% RATED VOLTAGE JIS C C 1,h OVERLOAD : 2% RATED VOLTAGE Fig.19 Fig.2 tanδ Fig FN (Y5V) Characteristics (1,pF) JIS C C 1,h OVERLOAD : 2% RATED VOLTAGE JIS C C 1,h OVERLOAD : 2% RATED VOLTAGE JIS C C 1,h OVERLOAD : 2% RATED VOLTAGE Fig.22 Fig.23 tanδ Fig.24

10 ghumidity load test A (CG) Characteristics (1pF) JIS C C 9 ~ 95%RH 1,h JIS C C 9 ~ 95%RH 1,h JIS C C 9 ~ 95%RH 1,h Fig.25 Fig.26 tanδ Fig CN (X7R) Characteristics (1,pF) JIS C C 9 ~ 95%RH 1,h JIS C C 9 ~ 95%RH 1,h JIS C C 9 ~ 95%RH 1,h Fig.28 Fig.29 tanδ Fig FN (Y5V) Characteristics (1,pF) JIS C C 9 ~ 95%RH 1,h JIS C C 9 ~ 95%RH 1,h JIS C C 9 ~ 95%RH 1,h Fig.31 Fig.32 tanδ Fig.33