Lead (Pb)-free Thick Film, Rectangular Commodity Chip Resistors

Transcription

1 ...BC e3 Lead (Pb)-free Thick Film, Rectangular Commodity Chip Resistors STANDARD ELECTRICAL SPECIFICATIONS TYPE CASE SIZE IMPERIAL CASE SIZE METRIC POWER RATING P 70 W LIMITING ELEMENT VOLTAGE U max. AC RMS /DC V FEATURES High volume product suitable for commercial applications Excellent stability ( R/R 1 % for 1000 h at 70 C) Lead (Pb)-free solder contacts on Ni barrier layer Metal glaze on high quality ceramic Protective overglaze Material categorization: for definitions of compliance please see TEMPERATURE COEFFICIENT ppm/k TOLERANCE % RESISTANCE RANGE SERIES ± to 1M ± 2, ± 5 E BC RR0402M 1.0 to / +600 ± 2, ± to 9.1 E24 Zero-Ohm-Resistor: R max. = 50 m, I max. = 0.5 A ± R to 10M ± 0.5 E96-200/ R0 to 9R R to 1M ± R to 10M BC 0201 RR 0603M / R0 to 9R76 ± R to 10M ± 5 E / R0 to 9R1 Zero-Ohm-Resistor: R max. = 50 m, I max. at 70 C = 1.0 A BC 0402 RR 1005M Zero-Ohm-Resistor: R max. = 20 m, I max. at 70 C = 1.5 A BC 0603 RR 1608M Zero-Ohm-Resistor: R max. = 20 m, I max. at 70 C = 2.0 A BC 0805 RR 2012M Zero-Ohm-Resistor: R max. = 20 m, I max. at 70 C = 2.5 A BC 1206 RR 3216M Zero-Ohm-Resistor: R max. = 20 m, I max. at 70 C = 3.5 A BC 1210 RR 3225M Zero-Ohm-Resistor: R max. = 20 m, I max. at 70 C = 4.0 A BC 2010 RR 5025M Zero-Ohm-Resistor: R max. = 20 m, I max. at 70 C = 5.0 A BC 2512 RR 6332M Zero-Ohm-Resistor: R max. = 20 m, I max. at 70 C = 7.0 A Notes These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift increasing over operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a functional lifetime. Power rating depends on the maximum temperature at the solder point, the component placement density and the substrate material. Revision: 19-Oct-17 1 Document Number: 28743

2 ...BC e3 TECHNICAL SPECIFICATIONS PARAMETER UNIT BC BC BC BC BC BC BC BC BC Rated Dissipation W P (1) 70 Limiting Element Voltage U max. AC RMS /DC Insulation Voltage U ins (1 min) Insulation Resistance Operating Temperature Range V V > 10 9 C -55 to to +155 Failure Rate C 0.3 x 10-9 Mass mg Note (1) The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow support of the printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature of 155 C is not exceeded. PART NUMBER AND PRODUCT DESCRIPTION PART NUMBER: RFKTCBC C R C W R F K T C B C TYPE RESISTANCE TOLERANCE TCR PACKAGING Special R = decimal K = thousand M = million 0000 = jumper D = ± 0.5 % F =.0 % G = ± 2.0 % J = ± 5.0 % Z = Jumper PRODUCT DESCRIPTION: 0603-BC R 1 % RT6 e3 K = 00 ppm/k N = ± 200 ppm/k R = ± 250 ppm/k X = -200 ppm/k / +400 ppm/k Y = -200 ppm/k / +600 ppm/k 0 = Jumper TA, TB, TC, TD, TE, TF, TH, TI, TL Up to 2 digits BC = commodity 0603-BC R 1 % RT6 e3 TYPE TCR RESISTANCE BC 0201-BC 0402-BC 0603-BC 0805-BC 1206-BC 1210-BC 2010-BC 2512-BC 00 ppm/k ± 200 ppm/k ± 250 ppm/k -200 ppm/k / +400 ppm/k -200 ppm/k / +600 ppm/k 10R = R = K = 10.0 k 1M = 1 M 0R0 = Jumper TOLERANCE VALUE ± 0.5 % % ± 2 % ± 5 % PACKAGING RT1, RT2, RT3, RT5, RT6, RT7, RF4, R02, R82 LEAD (Pb)-FREE e3 = pure tin termination finish Revision: 19-Oct-17 2 Document Number: 28743

3 ...BC e3 PACKAGING TYPE CODE QUANTITY CARRIER TAPE WIDTH PITCH REEL DIAMETER BC TL = RT mm 2 mm TD = RT BC TI = RT mm 2 mm 254 mm/10" TE = RF mm/13" TD = RT BC TI = RT mm 2 mm 254 mm/10" TE = RF mm/13" 0603 BC Paper tape acc. to , Type 1a 0805 BC 1206 BC 1210 BC 2010 BC TF = R mm 4 mm 2512 BC TH = R mm 4 mm DIMENSIONS in millimeters SIZE DIMENSIONS RECOMMENDED SOLDER PAD DIMENSIONS (1) REFLOW SOLDERING WAVE SOLDERING IMPERIAL METRIC L W H T1 T2 a b l a b l ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± ± Notes (1) The rated dissipation applies only if the permitted film temperature is not exceeded. Furthermore, a high level of ambient temperature or of power dissipation may raise the temperature of the solder joint, hence special solder alloys or boardmaterials maybe required to maintain the reliability of the assembly. The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards x, or in publication IPC They do not guarantee any supposed thermal properties, particularly as these are also strongly influenced by many other parameters. Still the given solder pad dimensions will be found adequate for most general applications. (2) No marking for 01005, 0201, and 0402 sizes. Revision: 19-Oct-17 3 Document Number: 28743

4 ...BC e3 DERATING Rated Power in % BC e BC e Ambient Temperature in C S AND REQUIREMENTS EN CLAUSE REQUIREMENTS PERMISSIBLE CHANGE ( R) CLASS 1 CLASS 2 SIZE BC e3 1 to 10 M 1 to 10 M 1 to 10 M Resistance - % ± 5 % ± 0.5 %, %, ± 5 % Temperature coefficient (20 / -55 / 20) C and (20 / 125 / 20) C 00 ppm/k, ± 200 ppm/k ± 200 ppm/k 00 ppm/k, ± 200 ppm/k, ppm/k/ ppm/k Short time overload U = 2.5 x P 70 x R 2 x U max.; duration: Acc. to the style ± (0.25 % R )± (0.5 % R ) ± (1 % R ) (Td) Solderability Pre-aging 4 h at 155 C, dryheat Solder bath method; Sn60Pb40 non activated flux; (235 ± 5) C (2 ± 0.2) s Solder bath method; Sn96.5Ag3Cu0.5 non activated flux; (245 ± 5) C (3 ± 0.3) s (Td) (Na) Resistance to soldering heat Rapid change of temperature Solder bath method (260 ± 5) C; (10 ) s ± (0.25 % R )± (0.5 % R ) ± (1 % R ) 30 min. at - 55 C; 30 min. at 125 C; 5 cycles ± (0.25 % R )± (0.5% R ) ± (0.5% R ) 1000 cycles ± (1 % R ) ± (1 % R ) ± (1 % R ) (Cab) Damp heat, steady state (40 ± 2) C; 56 days; (93 ± 3) % RH ± (1 % R ) ± (2 % R ) ± (2 % R ) Revision: 19-Oct-17 4 Document Number: 28743

5 S AND REQUIREMENTS EN CLAUSE BC e3 REQUIREMENTS PERMISSIBLE CHANGE ( R) CLASS 1 CLASS 2 SIZE Climatic sequence: -...BC e3 1 to 10 M 1 to 10 M 1 to 10 M (Ba) Dry heat 125 C; 16 h (Db) Damp heat, cyclic 55 C; 90 % RH; 24 h; 1 cycle (Aa) Cold -55 C; 2 h ± (1 % R ) ± (2 % R ) ± (2 % R ) (M) (Db) Low air pressure Damp heat, cyclic 1 kpa; (25 0) C; 1 h 55 C; 90 % RH; 24 h; 5 cycles DC load U = P 70 x R U max Endurance at 70 C Endurance at 125 C U = P 70 x R U max.; 1.5 h on; 0.5 h off; 70 C; 1000 h ± (1 % R ) ± (2 % R ) ± (2 % R ) 70 C; 8000 h ± (2 % R ) ± (4 % R ) ± (4 % R ) 125 C, 1000 h ± (1 % R ) ± (2 % R ) ± (2 % R ) S AND REQUIREMENTS REQUIREMENTS PERMISSIBLE CHANGE ( R) EN CLASS 1 CLAUSE e3 1 to 1 M Resistance - %; ± 2 %; ± 5 % Short time overload (Td) Solderability Temperature coefficient U = 2.5 x P 70 x R 2 x U max. ; duration according to style Solder bath method; Sn60Pb40 non activated flux; (235 ± 5) C (2 ± 0.2) s Solder bath method; Sn96.5Ag3Cu0.5 non-activated flux; (235 ± 3) C (2 ± 0.5) s (20/-55/20) C and (20/125/20) C (Uu 1 ) Substrate bending Depth 3 mm; 1 time ± (2 % R ) ppm/k/+600 ppm/k, ± 250 ppm/k No visible damage, no open circuit in bent position ± (1 % R ) Revision: 19-Oct-17 5 Document Number: 28743

6 ...BC e3 S AND REQUIREMENTS EN CLAUSE (Na) Rapid change of temperature Endurance at 70 C (Td) Resistance to soldering heat (Cab) Damp heat, steady state (XA) Endurance at upper category temperature Component solvent resistance e3 15 min. at -55 C; 15 min. at 125 C; 300 cycles U = P 70 x R U max. ; 1.5 h on; 0.5 h off; 70 C; 1000 h Solder bath method (260 ± 5) C; (10 ) s (40 ± 2) C; (90 to 95) % RH; 1000 h ± (2 % R ) ± (5 % R ) ± (2 % R ) ± (5 % R ) 125 C, 1000 h ± (2 % R ) Isopropyl alcohol; (20 to 25) C; (5 ± 0.5) min REQUIREMENTS PERMISSIBLE CHANGE ( R) CLASS 1 1 to 1 M No visible damage APPLICABLE SPECIFICATIONS EN Generic specification EN Sectional specification EN Detail specification X Environmental test procedures Packaging of SMD components Revision: 19-Oct-17 6 Document Number: 28743