Molding Power Inductor

Transcription

1 Marking Outline: Magnetic shielded structure: excellent resistance to electro magnetic interference(emi). A composite structure, ultra low buzz noise. Low loss, high efficiency, wide application frequency. Lightweight design, save space, suitable for high density SMT. Die-casting by low loss alloy powder: low impedance, small parasitic capacitance. 1 Appearance and dimensions (mm) Operating temperature : (Including coil s temperature rise) ( ) 4.4± ±.2.8± ±.2 1.5± ± /- 2 Marking 3 Reference land pattern (mm) 4 Schematic Marking / 6

2 5 Electrical characteristics Part No. Inductance (μh) D.C.R. (mω) Saturation current (A) Temperature rise current (A) % Typical Max Typical Max Typical CSHB421-R33M CSHB421-R47M CSHB421-R56M CSHB421-R68M CSHB421-1RM CSHB421-1R5M CSHB421-2R2M CSHB421-3R3M CSHB421-4R7M CSHB421-5R6M CSHB421-6R8M CSHB421-8R2M CSHB421-M CSHB421-1M CSHB421-2M All data is tested based on 25 ambient temperature Inductance measure condition at khz, 1V. khz, 1V 2 Saturation current the value of DC current when the inductance decrease % of its initial value. % 3 Temperature rise current the actual value of DC current when the temperature rise is ΔT (Ta=25 ). ΔT (Ta=25 ) Special remind Circuit design, component placement, PWB size and thickness, cooling system and etc. all will affect the product temperature. Please verify the product temperature in the final application. (PWB) 2 / 6

3 6 Saturation current VS temperature rise current curve L(μH) CSHB421-R33M ΔT( ).42 L(μH) CSHB421-R47M ΔT( ).56 L(μH) CSHB421-R56M ΔT( ). L(μH) CSHB421-R68M ΔT( ) L(μH) CSHB421-1RM ΔT( ) 1. L(μH) CSHB421-1R5M ΔT( ) 2. L(μH) CSHB421-2R2M ΔT( ) 2.8 L(μH) CSHB421-3R3M ΔT( ) L(μH) CSHB421-4R7M ΔT( ) 5. L(μH) CSHB421-5R6M ΔT( ) 7. L(μH) CSHB421-6R8M ΔT( ) 8. L(μH) CSHB421-8R2M ΔT( ) L(μH) CSHB421-M ΔT( ) 14. L(μH) CSHB421-1M ΔT( ) 21. L(μH) CSHB421-2M ΔT( ) / 6

4 7 Packing specification 7.1 Carrier tape dimensions (mm) 2.4 Ref 2.2±.1 A 4.±.1 2.±.1 Φ ± ±.1 5.5±.1 12.±.3 A-A.4±.5 B B A 8.±.1 4.5±.1 (4.75) B-B Packing is referred to the international standard IEC IEC Tape direction End Feeding direction Sprocket hole Start Carrier tape Marking Marking Marking Marking No component 1mm Min. Component No component mm Min. mm Min. 7.3 peel off condition peel force shall be.1 to 1.3N N Reference peel speed ±mm/min. ±mm/ Pull direction 165 ~18 Unreeling direction Carriertape 4 / 6

5 7.4 Reel dimensions (mm) 18.4Max W2 W Label 13.±.5 21.±.8 2.±.5 3±2. Min. Sprocket hole Unreeling direction W3 11.9Min 7.5 Carton dimensions and packing quantity Inner Carton mm Out Carton mm Product Series Quantity / Reel / Inner Carton Quantity Out Carton Quantity CSHB421 pcs ( 4) = 8pcs (8 3) = pcs 7.6 Label making The following items will be marked on the reel of product label and shipping label. Production Label Shipping Label Part No. Electrical Information Quantity Packing No. Customer Name Customer Part No. Supplier Part No. Supplier Name Country of origin 5 / 6

6 Temperature 8 Soldering specification 8.1 Reflow profile for SMT components SMT T( ) T P Max. Ramp Up Rate = 3 /s Max. Ramp Down Rate = 6 /s t P ~s T C -5 T L 217 T S Max. Preheat Area t L ~1s T S Min. 1 t S ~1s 25 48s Max. (Time of 25 to peak temperature) Time t(s) 8.2 Classification of peak package body temperature (T P ) (T P) PB-Free Assembly Package Volume Package Thickness <3 mm 3 3 mm 3 > mm 3 <1.6mm mm mm Reflow is referred to standard IPC/JEDEC J-STD-D. IPC/JEDEC J-STD-D 6 / 6