M90 20W. High Power LED PRODUCT DATASHEET. RoHS Compliant

Transcription

1 M90 20W High Power LED Table of Contents Features. 1 Applications. 1 Absolute Maximum Ratings Flux Characteristics. 2 Typical Electro Optical Characteristics Curves.. Thermal Design Curve.. Chromaticity Coordinate Groups Mechanical Dimensions. 7 Shipping Package Information.. 8 Reflow Soldering Conditions LED Handling Information.. Lens Handling.. Lens Cleaning Carrier Tape Handling

2 Features General purpose white Very low thermal resistance: < 1.0 K/W High luminous flux in a compact footprint: 9.00mm x 9.00mm package size 8KV (HBM) ESD protection Reflow solder able JEDEC J STD 020D Applications General lighting Retail lighting Architectural lighting Directional replacement lamps Industrial and commercial lighting Absolute Maximum Ratings (Tj = 25 ) Parameters Symbol Rating Unit DC Forward current (7S7P) I F 840 ma Operating temperature T opr 40 ~ 85 LED Storage temperature T stg1 40 ~ 110 LED Junction temperature T j 125 Soldering temperature at tp (JEDEC 020 D) T sol 20 ~ 40 Second ESD MIL STD 883G HBM 8000 (Class 3B) V classification JESD22 A115 B MM 400 (Class C) V Notes: 1. Proper current derating must be observed to maintain junction temperature below the maximum. 1

3 Flux Characteristics (Tj = 25 ) Part number M EA Color Cool White 70 CRI CCT Range Base Order Codes Minimum Luminous (Im) Forward (V) Min. Max. Min. Max M CA M WC Warm White 80 CRI Notes: 1. Forward voltage is measured with an accuracy of ±0.1V (tester tolerance) 2. Flux is measured with an accuracy of ±10% and ±2 on CRI measurements. 3. The typical CRI (Cool Rendering Index) for Cool White 70 CRI is 70, and for Warm White 80 CRI is SemiLEDs M90 20W product is tested and binned at 840mA. 2

4 Typical Electro Optical Characteristics Curves (Tj=25 ) Forward Current vs. Forward Voltage Relative Luminous Flux vs. Forward Current Relative Radiant Power vs. Wavelength Typical Spatial Distribution Typical Polar Radiation Pattern 3

5 Thermal Design Curve The junction temperature can be correlated to the thermal resistance between the junction and ambient (Rja) by the following equation. Tj=Ta + Rja*W Tj: LED junction temperature Ta: Ambient temperature Rja: Thermal resistance between the junction and ambient W: Input power (I F *V F ) 4

6 Chromaticity Coordinate Groups Product Binning (Cool White) ES ~7040K Rank CIE X CIE Y Rank CIE X CIE Y Rank CIE X CIE Y Rank CIE X CIE Y A B 1C 1D ES ~6020K Rank CIE X CIE Y Rank CIE X CIE Y Rank CIE X CIE Y Rank CIE X CIE Y A B 2C 2D

7 Product Binning (Warm White) ES ~3220K Rank CIE X CIE Y Rank CIE X CIE Y Rank CIE X CIE Y Rank CIE X CIE Y A B1 7C1 7D A B2 7C2 7D

8 Mechanical Dimensions Notes: 1. All dimensions are in millimeters. 2. Drawings not to scale. 3. General tolerances are ±0.13 mm unless otherwise indicated. Pad configuration Pad Function 1 Cathode 2 Anode 3 Thermal 7

9 Shipping Package Information Tape Dimensions (Unit: mm) Item Specification Tol.(+/ ) W ±0.30 E 1.75 ±0.10 F 7.50 ±0.10 D , 0 D , 0 P ±0.10 P ±0.10 P ±0.10 P0X ±0.20 t 0.35 ±0.05 A ±0.10 B ±0.10 K ±0.10 Trailer 35 pockets (min) of empty pockets Loaded Pockets Leader 35 pockets (min) of empty pockets Reel 8

10 Packaging Humidity Indicator Card Humidity indicator card Static Shielding Bag Static Shielding bag Label Desiccants Packing after MFG Packing for shipping 1 bag in an inner box= 200pcs 1 reel in a bag = 200pcs Small size: 5 inner box in an outer box= 1000pcs Large size: 10 inner box in an outer box= 2000pcs 9

11 Reflow soldering conditions The LEDs can be soldered using the parameters listed below. As a general guideline, the users are suggested to follow the recommended soldering profile provided by the manufacturer of the solder paste. Although the recommended soldering conditions are specified in the list, reflow soldering at the lowest possible temperature is advised for the LEDs. Profile Feature Sn Pb Eutectic Assembly Pb Free Assembly Average Ramp up Rate (Ts max to Tp) 3 /second max. 3 /second max. Preheat - Temperature Min(Ts min ) Temperature Max(Ts max ) Time(ts min to ts max ) seconds seconds Time maintained above: - Temperature(T L ) Time(t L ) seconds seconds Peak/classification Temperature(Tp) Time within 5 of actual Peak Temperature(tp) seconds seconds Ramp Down Rate 6 /second max. 6 /second max. Time 25 to Peak Temperature 6 minutes max. 8 minutes max. Note: 1. The housing side wall is composed by silicon which is a kind of semiconductor. 2. Please avoid solder ball or excessive solder around side wall during SMT process. 10

12 LED Handling Information The following items are recommended when handling the LEDs: 1. The lens of the LEDs should not be exposed to dust and debris. Excessive dust and debris may cause a drastic decrease in light output. 2. Avoid mechanical stress on the LED lens. 3. Do not touch the LED lens surface. It would affect the optical performance of the LED due to the LED lens damage. 4. Pick and place tool is recommended when removing the LEDs from the factory tape and reel packaging. Lens Handling Please follow the following guidelines when handling the LEDs: 1. Use tweezers to hold the LEDs. 2. Do not touch the lens with the tweezers or fingers. 3. Do not apply more than 4N (400g) of force directly onto the lens. Correct ( ) Wrong (X) Lens Cleaning A suitable cleaning solution can be applied to the lens surface to remove dirt and dust particles: 1. Try gentle swabbing using a lint free swab. 2. If needed, isopropyl alcohol can be used with a lint free swab to gently remove dirt from the lens surface. 3. Do not use other solvents as they may directly react with the LED assembly. 4. Do not use ultrasonic cleaning which may damage the LED. 11

13 Carrier Tape Handling The following items are recommended when handling the carrier tape of the LEDs: 1. Do not twist the carrier tape 2. The inward bending diameter should not be smaller than 6cm for carrier tape 3. Do not bend the tape outward 4. Storage temperature should not exceed Ten reels per box 6. Box dimensions: 49cm x 22cm x 21 cm 7. Full box weight: 3±0.5 Kg. <6cm 12

14 About Us SemiLEDs Corporation is a US based manufacturer of ultra high brightness LED chips with state of the art fabrication facilities in Hsinchu Science Park, Taiwan. SemiLEDs specializes in the development and manufacturing of vertical LED chips in blue (white), green, and UV using a patented copper alloy base. This unique design allows for higher performance and longer lumen maintenance. The World Economic Forum recognized SemiLEDs innovations with the 2009 Technology Pioneer Award. SemiLEDs is fully ISO 9001:2008 Certified SemiLEDs is a publicly traded company on NASDAQ Global Select Market (stock symbol LEDS ). investor information, please contact us at investors@semileds.com. For For further company or product information, please visit us at or please contact sales@ semileds.com. ASIA PACIFIC 3F, No. 11, KeJung Rd. Chu Nan Site Hsinchu Science Park Chu Nan 350, Miao Li County Taiwan, ROC Tel: Fax: sales@semileds.com 13