Power LED I TECHNICAL DATA

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1 Power LED I TECHNICAL DATA W11290 N11290 B11290 G11290 R11290 C11290 A , KasanDong, KeumchunGu, Seoul, Korea TEL : FAX : Rev /04 1

2 SPECIFICATIONS Features Super high flux output and high luminance Designed for high current operation Low thermal resistance RoHS Compliant Applications General Illumination Outdoor & Indoor architectural lighting Decorative lighting Torch lighting Portable lighting (Flash and lamp) and Reading lighting Traffic signaling Description This package LEDs are designed for high current operation and high flux output application. But the package s design features better thermal management characteristics than other LED solutions. Because of these advantages, this product have many applications such as internal & external lighting and automobile lamps, and large size LCD backlight etc , KasanDong, KeumchunGu, Seoul, Korea TEL : FAX : Rev /04 2

3 Full Code explanation of ZPower LED series Full code form : X 1 X 2 X 3 X 4 X 5 X 6 X 7 X 8 X 9 X 10 X 11 X 12 X Part number X 1 : Color X 2 : ZPower LED series number X 3 : LENS type X 4 : Chip Quantity X 5 : Package outline size X 6 : Metal PCB type 2. Internal Number X 7 X 8 3. Code Labeling X 9 : Luminous Flux (or Radiant Flux for Royal) X 10 X 11 X 12 : Dominant Wavelength (or x,y coordinates rank code) X 13 : Forward Voltage For more information about binning and labeling, refer to the Application Note , KasanDong, KeumchunGu, Seoul, Korea TEL : FAX : Rev /04 3

4 1. Outline Dimensions Cathode Mark Slug (+) Notes : 1. All dimensions are in millimeters. 2. Scale : none 3. This drawing is reference only for engineering 14829, KasanDong, KeumchunGu, Seoul, Korea TEL : FAX : Rev /04 4

5 Pure white Power LED 2. ElectroOptical Characteristics (at I F =700mA, T A =25) Min Typ Max Luminous Flux Ф V [1] lm Correlated Color Temperature CCT [3] 6500 K CRI R a 76 Forward Voltage V F V View Angle 2Θ 1/2 70 deg. Thermal resistance Rθ [4] 9.1 /W 3. Absolute Maximum Ratings (at T A =25) Forward Current I F A Power Dissipation P D 3.2 W Junction Temperature T j 125 Operating Temperature T opr 30 ~ +85 Storage Temperature T stg 40 ~ +120 ESD Sensitivity [2] ±20,000V HBM *Notes : [1] Ф V is the total luminous flux output as measured with an integrating sphere. [2] It is included the zener chip to protect the product from ESD. [3] Rθ is measured with a SSC metal core pcb.(25 T J 125 ) [4] SSC maintains a tolerance of ±10% on flux and power measurements. [5] CCT ±5% tester tolerance. [6] Color Coordinate Measurement allowance is ±0.005 [7] A tolerance of ±0.006V on forward voltage measurements Caution Please do not drive a rated current more than 5 sec. without proper heat sink 14829, KasanDong, KeumchunGu, Seoul, Korea TEL : FAX : Rev /04 5

6 Warm white Power LED 2. ElectroOptical Characteristics (at I F =700mA, T A =25) Min Typ Max Luminous Flux Ф V [1] lm Correlated Color Temperature CCT [3] 3000 K CRI R a 76 Forward Voltage V F V View Angle 2Θ 1/2 70 deg. Thermal resistance Rθ [4] 9.1 /W 3. Absolute Maximum Ratings (at T A =25) Forward Current I F A Power Dissipation P D 3.2 W Junction Temperature T j 125 Operating Temperature T opr 30 ~ +85 Storage Temperature T stg 40 ~ +120 ESD Sensitivity [2] ±20,000V HBM *Notes : [1] Ф V is the total luminous flux output as measured with an integrating sphere. [2] It is included the zener chip to protect the product from ESD. [3] Rθ is measured with a SSC metal core pcb.(25 T J 125 ) [4] SSC maintains a tolerance of ±10% on flux and power measurements. [5] CCT ±5% tester tolerance. [6] Color Coordinate Measurement allowance is ±0.005 [7] A tolerance of ±0.006V on forward voltage measurements Caution Please do not drive a rated current more than 5 sec. without proper heat sink 14829, KasanDong, KeumchunGu, Seoul, Korea TEL : FAX : Rev /04 6

7 Blue Power LED 2. ElectroOptical Characteristics (at I F =700mA, T A =25) Min Typ Max Luminous Flux Ф V [1] lm Dominant Wavelength λ D nm Forward Voltage V F V View Angle 2Θ 1/2 40 deg. Thermal resistance Rθ [4] 9.1 /W 3. Absolute Maximum Ratings (at T A =25) Forward Current I F A Power Dissipation P D 3.2 W Junction Temperature T j 125 Operating Temperature T opr 30 ~ +85 Storage Temperature T stg 40 ~ +120 ESD Sensitivity [2] ±20,000V HBM *Notes : [1] Ф V is the total luminous flux output as measured with an integrating sphere. [2] It is included the zener chip to protect the product from ESD. [3] Rθ is measured with a SSC metal core pcb.(25 T J 125 ) [4] SSC maintains a tolerance of ±10% on flux and power measurements. [5] A tolerance of ±0.5nm for dominant wavelength and ±2nm for peak wavelength [6] A tolerance of ±0.006V on forward voltage measurements [7] Blue power light sources represented here are IEC825 Class 2 for eye safety Caution Please do not drive a rated current more than 5 sec. without proper heat sink 14829, KasanDong, KeumchunGu, Seoul, Korea TEL : FAX : Rev /04 7

8 Green Power LED 2. ElectroOptical Characteristics (at I F =700mA, T A =25) Min Typ Max Luminous Flux Ф V [1] lm Dominant Wavelength λ D nm Forward Voltage V F V View Angle 2Θ 1/2 40 deg. Thermal resistance Rθ [4] 9.1 /W 3. Absolute Maximum Ratings (at T A =25) Forward Current I F A Power Dissipation P D 3.2 W Junction Temperature T j 125 Operating Temperature T opr 30 ~ +85 Storage Temperature T stg 40 ~ +120 ESD Sensitivity [2] ±20,000V HBM *Notes : [1] Ф V is the total luminous flux output as measured with an integrating sphere. [2] It is included the zener chip to protect the product from ESD. [3] Rθ is measured with a SSC metal core pcb.(25 T J 125 ) [4] SSC maintains a tolerance of ±10% on flux and power measurements. [5] A tolerance of ±0.5nm for dominant wavelength and ±2nm for peak wavelength [6] A tolerance of ±0.006V on forward voltage measurements Caution Please do not drive a rated current more than 5 sec. without proper heat sink 14829, KasanDong, KeumchunGu, Seoul, Korea TEL : FAX : Rev /04 8

9 Red Power LED 2. ElectroOptical Characteristics (at I F =700mA, T A =25) Min Typ Max Luminous Flux Ф V [1] lm Dominant Wavelength λ D nm Forward Voltage V F V View Angle 2Θ 1/2 40 deg. Thermal resistance Rθ [4] 13 /W 3. Absolute Maximum Ratings (at T A =25) Forward Current I F A Power Dissipation P D 2.4 W Junction Temperature T j 100 Operating Temperature T opr 30 ~ +85 Storage Temperature T stg 40 ~ +120 ESD Sensitivity [2] ±20,000V HBM *Notes : [1] Ф V is the total luminous flux output as measured with an integrating sphere. [2] It is included the zener chip to protect the product from ESD. [3] Rθ is measured with a SSC metal core pcb.(25 T J 100 ) [4] SSC maintains a tolerance of ±10% on flux and power measurements. [5] A tolerance of ±0.5nm for dominant wavelength and ±2nm for peak wavelength [6] A tolerance of ±0.006V on forward voltage measurements Caution Please do not drive a rated current more than 5 sec. without proper heat sink 14829, KasanDong, KeumchunGu, Seoul, Korea TEL : FAX : Rev /04 9

10 Cyan Power LED 2. ElectroOptical Characteristics (at I F =700mA, T A =25) Min Typ Max Luminous Flux Ф V [1] lm Dominant Wavelength λ D nm Forward Voltage V F V View Angle 2Θ 1/2 40 deg. Thermal resistance Rθ [4] 9.1 /W 3. Absolute Maximum Ratings (at T A =25) Forward Current I F A Power Dissipation P D 3.9 W Junction Temperature T j 125 Operating Temperature T opr 30 ~ +85 Storage Temperature T stg 40 ~ +120 ESD Sensitivity [2] ±20,000V HBM *Notes : [1] Ф V is the total luminous flux output as measured with an integrating sphere. [2] It is included the zener chip to protect the product from ESD. [3] Rθ is measured with a SSC metal core pcb.(25 T J 125 ) [4] SSC maintains a tolerance of ±10% on flux and power measurements. [5] A tolerance of ±0.5nm for dominant wavelength and ±2nm for peak wavelength [6] A tolerance of ±0.006V on forward voltage measurements Caution Please do not drive a rated current more than 5 sec. without proper heat sink 14829, KasanDong, KeumchunGu, Seoul, Korea TEL : FAX : Rev /04 10

11 Amber Power LED 2. ElectroOptical Characteristics (at I F =700mA, T A =25) Min Typ Max Luminous Flux Ф V [1] lm Dominant Wavelength λ D nm Forward Voltage V F V View Angle 2Θ 1/2 40 deg. Thermal resistance Rθ [4] 13 /W 3. Absolute Maximum Ratings (at T A =25) Forward Current I F A Power Dissipation P D 2.4 W Junction Temperature T j 100 Operating Temperature T opr 30 ~ +85 Storage Temperature T stg 40 ~ +120 ESD Sensitivity [2] ±20,000V HBM *Notes : [1] Ф V is the total luminous flux output as measured with an integrating sphere. [2] It is included the zener chip to protect the product from ESD. [3] Rθ is measured with a SSC metal core pcb.(25 T J 100 ) [4] SSC maintains a tolerance of ±10% on flux and power measurements. [5] A tolerance of ±0.5nm for dominant wavelength and ±2nm for peak wavelength [6] A tolerance of ±0.006V on forward voltage measurements Caution Please do not drive a rated current more than 5 sec. without proper heat sink 14829, KasanDong, KeumchunGu, Seoul, Korea TEL : FAX : Rev /04 11

12 orw3.8fardvoltage(v)4. Forward Voltage vs. Forward Current (Ta=25 ) ForwardCurent(mARED GREEN BLUE )5. Forward Current vs. Normalized Relative Luminous Flux (Ta=25 ) ForwardCurent(mA)Relative Luminous Flux(a.u) RED GREEN BLUE 14829, KasanDong, KeumchunGu, Seoul, Korea TEL : FAX : Rev /04 12

13 6. White Color spectrum of Typical CCT (Ta=25 ) 1.0 Relative Spectral Power Distribution Wavelength (nm) 7. Wavelength Curve for Red, Green, Blue (Ta=25 ) 1.0 Relative Spectral Power Distribution Wavelength (nm) 14829, KasanDong, KeumchunGu, Seoul, Korea TEL : FAX : Rev /04 13

14 8. Radiant pattern White Blue, Green, Red, Cyan, Amber With lens 70 With lens Relative intensity Relative intensity Directional angle[deg] Directional angle[deg] 9. Forward Current Vs Wavelength shift (Ta=25 ) Dominant wavelength shift(nm) RED GREEN BLUE Forward current(i ) 14829, KasanDong, KeumchunGu, Seoul, Korea TEL : FAX : Rev /04 14

15 10. Temperature of Junction vs. Relative Light Output for Blue,Green,Red (Ta=25 ) Relative Light Output (%) RED GREEN BLUE Junction Temperature ( o C) 14829, KasanDong, KeumchunGu, Seoul, Korea TEL : FAX : Rev /04 15

16 11. Ambient Temperature vs Allowable Forward Current for 2 chip White, Blue, Green, Cyan Current (ma) Rja T = 30 o C / W Rja T = 25 o C / W Rja T = 20 o C / W Ambient Temperature T A ( o C) 12. Ambient Temperature vs Allowable Forward Current for 2chip Red, Amber Current (ma) Rja T = 30 o C / W Rja T = 25 o C / W Rja T = 20 o C / W Ambient Temperature T A ( o C) 14829, KasanDong, KeumchunGu, Seoul, Korea TEL : FAX : Rev /04 16

17 13. Reel Packaging Dimensions(Rectangular type) MIN pitch cumlative tolerance on tape ±0.2 Cathode mark CENTER 5 TYPICAL Note : 1. Pocket numbers are 500 ea 2. All dimensions are in millimeters 3. Scale : none 4. This drawing is reference only engineering 14829, KasanDong, KeumchunGu, Seoul, Korea TEL : FAX : Rev /04 17

18 14. Packaging structure Aluminum Vinyl Bag PART NO. : ######## QUANTITY : 750 LOT NO. : ########## BIN CODE NO. : ##### SEOUL SEMICONDUCTOR CO., LTD Outer Box TYPE SIZE(mm) a b c c Z POWER LED Z POWER LED a PART NO. : ######## ORDER CODE : ###### Q'YT : ###### DATE : ###### b SEOUL SEMICONDUCTOR CO.,LTD Note : 1. 5 reels are loaded in box 2. Scale none 3. This drawing is reference only engineering 4. For more information about binning and labeling, refer to the Application Note , KasanDong, KeumchunGu, Seoul, Korea TEL : FAX : Rev /04 18

19 15. Precaution for use (1) Storage In order to avoid the absorption of moisture, it is recommended to store in the dry box (or desiccator) with a desiccant. Otherwise, to store them in the following environment is recommended. Temperature : 5 ~30 Humidity : 60%HR max. (2) Attention after opened However LED is correspond SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed. a. After opened and mounted, the soldering shall be quickly. b. Keeping of a fraction Temperature : 5 ~ 40 Humidity : less than 30% (3) In case of more than 1 week passed after opening or change color of indicator on desiccant components shall be dried 1012hr. at 60±5. (4) In case of supposed the components is humid, shall be dried dipsolder just before. 100Hr at 80±5 or 12Hr at 100±5. (5) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temp. after soldering. (6) Quick cooling shall avoid. (7) Components shall not be mounted on warped direction of PCB. (8) Anti radioactive ray design is not considered for the products listed here in. (9) Gallium arsenide is used in some of the products listed in this publication. These products are dangerous if they are burned or smashed in the process of disposal. It is also dangerous to drink the liquid or inhale the gas generated by such products when chemically disposed. (10) This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When washing is required, IPA should be used. (11) When the LEDs are illuminating, operating current should be decided after considering the package maximum temperature. (12) LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3 months or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage. (13) The LEDs must be soldered within seven days after opening the moistureproof packing. (14) Repack unused products with antimoisture packing, fold to close any opening and then store in a dry place. (15) The appearance and specifications of the product may be modified for improvement without notice. (16) The PKG with LENS can t reflow soldering (17) Long time exposure of sunlight or UV occasions discolorment of PKG (18) Polarity of slug is a anode 14829, KasanDong, KeumchunGu, Seoul, Korea TEL : FAX : Rev /04 19

20 16. Handling of silicone resin LEDs ZPower LED is encapsulated by silicone resin for the highest flux efficiency. Notes for handling of Silicone resin ZPower LEDs 1) Avoid touching silicone resin parts especially by sharp tools such as Pincette(Tweezers) 2) Avoid leaving fingerprints on silicone resin parts. 3) Dust sensitivity silicone resin need containers having cover for storage. 4) When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevent. This is assured by choosing a pick and place nozzle which is larger than the LEDs silicone resin area 14829, KasanDong, KeumchunGu, Seoul, Korea TEL : FAX : Rev /04 20

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