Nominal Frequency MHz

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1 Issue Rev. 1.0 Page 8 Customer Leviton Customer P/N Product 49SMA Crystal Nominal Frequency MHz HOSONIC P/N ESB F10M33F Drawn Checked Approved KEN John Rock Page:1

2 Revised Record Rev. Rev. Date Item Content Remark Initial released Page:2

3 ELECTRICAL PARAMETERS No. Item Symb. Electrical Specification Min. Type Max. Units Remark 1 Nominal Frequency F MHz 2 Mode of Vibration Fundamental 3 Frequency Tolerance F/F ppm at 25 ±3 4 Operating Temperature Range TOPR Frequency Stability TC ppm 6 Storage Temperature TSTG Load capacitance CL 10 - pf 8 Equivalent Series Resistance ESR Ω 9 Drive Level DL μw 10 Insulation Resistance IR MΩ At 100V DC 11 Shunt Capacitance C pf 12 Aging Per Year Fa -5-5 ppm First Year 13 Package type HC-49SMA Page:3

4 REFLOW PROFILES Profiles Feature Pb-Free Assembly Average Ramp-up Rate (Ts max to Tp) 3 /second max. Preheat Temperature Min (Ts min) 125 Temperature Max (Ts max) 200 Time (ts min to ts max) 60~180 seconds Time maintained above Temperature (T L ) 217 Time (t L ) 60~150 seconds Peak/Classification Temperature (Tp) 260 Time within 5 of actual Peak Temperature (t p ) 20~40 seconds Ramp-down rate 6 /second max. Time 25 to Peak Temperature 8 minutes max. Suggest reflow times 3 Times max Remark:To reference JEDEC J-STD-020C Page:4

5 Outline Dimensions (unit: mm) H = 4.2 MAX MARKING H1A EX: = Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec A B C D E F G H J K L M Page:5

6 J 350 HANGZHOU HOSONIC ELECTRONIC CO., LTD. Package (units : mm) Model A B C D E F L1 W HC-49SMA Φ1.50± ±0.1 12± ±0.1 24± ±0.1 15± ±0.1 HC-49SMB Φ1.50± ±0.1 12± ±0.1 24± ±0.1 15± ±0.1 M H I K G L Model G H I J K L M HC-49SMA 2.4±0.1 Φ ± ± ± ± ±0.1 HC-49SMB 2.4±0.1 Φ ± ± ± ± ± Notes: 1 units: mm 2 折痕 1 REEL = 1 INNER BOX Page:6

7 Package (units : mm) (Continued) INNER BOX = 1 OUTER BOX 10,000 pcs = 1 OUTER BOX Page:7

8 RELIABILITY SPECIFICATIONS No. Test Item Test Conditions Reference 1 High Temperature Temperature: 125 ±5 Storage Time: 1000±24 Hours MIL-STD-883E-1016 Temperature 1: -55 ±5 Temperature 2: 125 ±5 2 Temperature Cycle Temperature change between T1 and T2 at soonest Run 10 cycles, maintain T1 and T2 15minutes each in one cycle MIL-STD-883E B 3 Pre-heat: ~120 Seconds Solder Heat Solder Temperature: 260 ±5 Resistance Time: 30 Seconds MIL-STD-202F 210 E 3 Times Free Fall from 75cm height 4 Drop Test table to 3cm thickness hard wood MIL-STD-202F-203B board 5 High Temperature, High Humidity Storage Temperature: 85 ±5 Relative Humidity: 80%--85% Time: 250Hours±24 Hours MIL-STD-202 F-103B 6 Steam Aging Temperature: 97 ±5 MIL-STD-883 Time: 8 Hours C B 260 solder pot to check solderability Dip in flux 5~10 seconds 7 Solderability Temperature: 245 ±5 MIL-STD-883E 2003 Time: 10 Seconds 8 Aging Temperature: 85 ±5 Time: 250±12Hours MIL-STD-202 F-108A B 9 Thermal Shock Temperature 1: -55 ±5 Temperature 2: 125 ±5 Temperature change between T1 and T2: 5 seconds 10 cycles, maintain T1 and T2 for 30 minutes each in one cycle MIL-STD-883E B Frequency Range: 10Hz~2000Hz 10 Vibration Amplitude: 1.5mm or 20G MIL-STD-202F 4Hours in each direction, total 12Hours 1 Page:8

Nominal Frequency MHz

Nominal Frequency MHz Issue February 13, 2012 Rev. Page 10 Customer Future Customer P/N Product 3225 OSC Nominal Frequency 12.000000MHz HOSONIC P/N DSEB12.0000WNS Drawn Checked Approved Page:1 Revised Record Rev. Rev. Date