FrelTec GmbH. Shielded SMD Power Inductors Power Choke

Transcription

1 GmbH Mathildenstr. 10A Starnberg Germany Power Choke 11/18/2015 1/16 GmbH

2 SPECIFICATION Part Number D * 101 * M E02 ** Type Size Value Tolerance Packing 175 : Shielded SMD Power Inductor Power Choke Refer to page 3 following The value is given in µh and u indicates the decimal point. When higher than 100µH then l the last digit is the multiplier which denotes the number of zero following Example: 3U3 : 3,3 µh 220 : 22 µh 151 : 150 µh N: ±30% E02 : Embossed tape and reel for 2k pcs (7 reel) M: ±20% L0X : Embossed tape and reel for 1,5k pcs (13 reel) L0Z : Embossed tape and reel for 3,5k pcs (13 reel) * not all combination is possible All products according to RoHS (2011/65/EU) 11/18/2015 2/16

3 Electrical Characteristics: 0315D Part Number. Nominal Inductance (uh) Inductance Tolerance D.C. Resistance ±20% (0) Saturation Current Idcl Rated Current (ma) Temperature Rise Current Idc2 Selfresonant Frequency (MHz) Min 0315D1UON 1,0 ±30% D1U5N 1,5 ±30% D2U2M 2,2 ±20% D3U3M 3,3 ±20% D4U7M 4,7 ±20% D6U8M 6,8 ±20% D100M 10 ±20% 0, D-220M 22 ±20% Test Equipment: Inductance: Chroma or equivalent. DCR: Chroma16502 or equivalent. SRF: HP4291B or equivalent. 0418D Part Number. Inductance Symbol Nominal Inductance (uh) Inductance Tolerance D.C. Resistance ±20% (mω) Saturation Current Idcl Rated Current (ma) Temperature Rise Current Idc2 Seifresonant Frequency Min (MHz) 0418D1UON A 1,0 ±30% D1U5N B 1,5 ±30% D2U2M C 2,2 ±20% D3U3M E 3,3 ±20% D4U7M H 4,7 ±20% D6U8M 1 6,8 ±20% D100M K 10 ±20% D150M M 15 ±20% D220M N 22 ±20% D330M P 33 ±20% D470M S 47 ±20% D680M T 68 ±20% ,3 0418D101M V 100 ±20% ,5 0418D151M W 150 ±20% ,5 0418D221M X 220 ±20% ,0 Test Equipment: 11/18/2015 3/16

4 Inductance: Chroma or equivalent. DCR: Chroma16502 or equivalent. SRF: HP4291B or equivalent. 0540D PART Number. Nominal Inductance (uh) Inductance Tolerance D.C. Resistance ±20% (0) Saturation Current Idcl Rated Current (ma) Temperature Rise Current Idc2 Selfresonant Frequency Min (MHz) 0540D1U5N 1,5 ±30% D2U2N 2,2 ±30% D3U3N 3,3 ±30% D4U7N 4,7 ±30% D6U8M 6,8 ±20% D100M 10 ±20% D150M 15 ±20% D220M 22 ±20% D330M 33 ±20% D470M 47 ±20% Test Equipment: Inductance: Chroma or equivalent. DCR: Chroma16502 or equivalent. SRF: HP4291B or equivalent. For all: 1. Test Frequency: 100KHz,1V. 2. Saturation Current Idc1: The value of current causes a 30% inductance reduction from initial value. 3. Temperature rise current Idc2: The value of current causes a 40 C temperature rise. 4. Rated Current: Either Idc1 or Idc2 whichever is smaller. 5. Operating Temperature Range:-25 C to +125 C (Including seif-temperature rise) 6. Storage Temp. Range : -40 C to +85 C 7. MSL : Level 1 11/18/2015 4/16

5 Dimensions and recommended land pattern: 0315D DIM. TOL. L 3,0 ±0,1 W 3,0 ±0,1 H 1,5 MAX. e 0,9 ±0.2 f 1,9 ±0.2 unit: mm 0418D DIM. TOL. M1 4,0 ±0,2 M2 4,0 ±0,2 M3 1,8 MAX. M4 1,1 ±0,2 M5 2,5 ±0,2 unit: mm 0540D 11/18/2015 5/16

6 DIM. TOL. M1 4,9 ±0,2 M2 4,9 ±0,2 M3 M3 4,1 MAX. 1R5N-100M 4,0 MAX. 150M-470M M4 1.2 ±0,2 M5 3,3 ±0,2 unit: mm Exposed wire tolerance limit of coating resin part an product side. Size of exposed wire occurring to coating resin is specified below. 1. Width direction (dimension a): Acceptable when a<=w/2 Nonconforming when a>w/2 2. Length direction (dimension b): Dimension b is not specified. 3. When total area of exposed wire occurring to each sides is not greater than 50% of coating resin area that is acceptable. 11/18/2015 6/16

7 Core Chipping: The appearance standard of the chipping size in top side, of bottom side ferrite Core is following dimension L W 0315D 0,6 mm Max 0,6 mm Max 0418D 1,0 mm Max 1,0 mm Max 0540D 1,5 mm Max 1,5 mm Max Material list 0315D, 0418D, 0540D 1. Ferrite core. Ni-Zn ferrite 2. Winding wire Polyurethane-copper wire 3. Over-coating resin. Epoxy resin, containing ferrite powder 4. Electrode External electrode (substrate) Ag External electrode (base plating) Ni-Sn External electrode (top surface solder coating) Sn-Ag-Cu 11/18/2015 7/16

8 Electrical Curve: 0315D 0418D 0540D 11/18/2015 8/16

9 11/18/2015 9/16

10 SPECIFICATION Tape And Reel Package P0 E P2 D W F B P1 A In Accordance with EIA Size A B W F E P 1 P 2 P 0 D T 1 T D 3,2±0,1 3,2±0,1 8,0±0,2 3,5±0,1 1,75±0,10 4,0±0,1 2,0±0,1 4,0±0,1 1,50+0,1/-0 1,6±0,1 0,3±0,5 0418D 4,3±0,1 4,3±0,1 12,0±0,2 5,5±0,1 1,75±0,10 8,0±0,1 2,0±0,1 4,0±0,1 1,50+0,1/-0 2,1±0,1 0,3±0,5 0540D 5,15±0,1 5,15±0,1 12,0±0,2 5,5±0,1 1,75±0,10 8,0±0,1 2,0±0,1 4,0±0,1 1,50+0,1/-0 4,2±0,1 0,4±0,5 Lead Dimensions: Cover Tape Peel off Strength Specifications: 0315D: 0,1 N~0,7 N 0418D, 0540D: 0,1 N~1,3 N Angle of between 165 and 180 degrees with the top of the carries tape. The cover tape, shall be pulled with a velocity of 300 mm minute, relative to the carrier tape. 11/18/ /16

11 Reel Type / Tape Reel size Quantity per reel [pcs.] A N C B G T D ±0,5 10,0±1,5 15, D ,0±0,5 2,0±0, ±3 80±2 13,5±1,0 18,5 max 0540D 1500 in mm 11/18/ /16

12 Storage Temperature: 25±3 C Humidity < 80%RH Characteristics Operating temperature range: -25 C to +125 C Isat: For Inductance drop 35% from its value with current. Irms: The value of D.C current, measured when the temperature rise is ΔT 40 C (Ta=25 C) Stock period The performance of these products, including the solderability, is guaranteed for one year after production date code, provided that they remain packed as they were when delivered and stored at a temperature of 25 C ± 3 C and a relative humidity less than 80%RH Lead Free Reflow Soldering Profile The products may be exposed to reflow soldering process of above profile up to two times. 11/18/ /16

13 Mechanical Performance /Environmental Test Performance Specifications: Test Item Standard Test method Resistance to Deflection No damage. The test samples shall be soldered to the test board by the reflow soldering conditions show in Reflow Profile Chart As illustrated below, apply force in the direction of the Arrow indicating until deflection of the test board Reaches to 2 mm. Land dimension Unit: mm Adhesion of Terminal Electrode Shall not come off PC board Test board size :100x40x10 Test board material I: glass epoxy-resin Solder cream thickness:0,1 The test samples shall be soldered to the test board By the reflow soldering conditions shown in Reflow Profile Chart Applied force:10 N to X and Y directions Duration:5 s. Solder cream thickness: 0,1mm (Refer to recommended Land Pattern Dimensions Defined in "Precaution") Body strength No damage Applied force : 0315D: 30 N 0540D, 0418D: 20 N Duration :10 s 11/18/ /16

14 Resistance to Vibration Resistance to Soldering heat (Reflow) ΔL/L: within±10% No abnormality observed In appearance ΔL/L:within±10% No abnormality observed In appearance The test samples shall be soldered to the test board by The reflow soldering conditions shown in Reflow Profile Chart. Then it shall be submitted to below test conditions Frequency range 10Hz-55Hz 1,5mm (May not exceed acceleration Total Amplitude 196 m/s 2 ) Sweeping Method 10Hz to 55Hz to 10 Hz for 1 min. Time For 2 hours an each X, Y, and Z axis. The test sample shall be exposed to reflow oven at 230±5 C for 40 seconds, with peak temperature at 260±5 C for 5 seconds, 2 times. Test board thickness: 1,0 mm Test board material: glass epoxy-resin Solder ability At least 90% of surface of terminal electrode is covered by new solder. The test samples shall be dipped in flux, and then Immersed in molten solder as shown in below table. Flux: Methanol solution containing rosin 25% Solder Temperature 245± C Time 5±1,0s Temperature Characteristics Thermal shock ΔL/L:within±20% No abnormality observed in appearance ΔL/L:within±10% No abnormality observed In appearance Immersing Speed 25 mm/s Measurement of inductance shall be taken at temperature Range within -25 C to +85 C. With reference to inductance value at +20 C, change Rate shall be calculated. The test samples shall be soldered to test board By the reflow soldering conditions shown in Reflow Profile Chart The test samples shall be placed at specified temperature for specified time by step 1 to 4 as shown in below table in sequence. Shown in below table in sequence. The temperature cycle shall be repeated 100 cycles. Conditions of steps for 1 cycle Low Temperature life Test ΔL/L:within±10% No abnormality observed In appearance Step Temperature Time(min) 1-40±3 C 30±3 2 Room Temp 3 maximum 3 85±2 C 30±3 4 Room Temp 3 maximum The test samples shall be soldered to the test board by The reflow soldering conditions shown in Reflow Profile Char. After that, the test samples shall be placed at test Conditions as shown in below table. Temperature -40±2 C Time /-0 h 11/18/ /16

15 Loading at high temperature life test ΔL/L:within±10% No abnormality observed in appearance. The test samples shall be soldered to the test board by the reflow soldering conditions shown in Reflow Profile Chart. The test samples shall be placed in thermostatic oven set at specified temperature and applied the rated current continuously as shown in below table. Damp heat life test Loading under Damp heat life test ΔL/L:within±10% No abnormality observed in appearance. ΔL/L:within±10% No abnormality observed in appearance. Temperature 85±2 C Applied current Rated current (Refer to Page 3 following) Time /-0 h The test samples shall be soldered to the test board by the reflow soldering conditions shown in Reflow Profile Chart. The test samples shall be placed in thermostatic oven set at specified temperature and applied the rated current continuously as shown in below table. Temperature 60±2 C Applied current Time 0-95% RH /-0 h The test samples shall be soldered to the test board by the reflow soldering conditions shown in Reflow Profile Chart. The test samples shall be placed in thermostatic oven set at specified temperature and humidity and applied the rated current continuously as shown in below table. Temperature Humidity Applied current Time 60±2 C 0-95% RH Rated current (Refer to Page3 following) /-0 h 11/18/ /16

16 Published by GmbH Mathildenstr. 10A; Starnberg; Germany 2015 GmbH. All Rights Reserved. The following applies to all products named in this publication: 1. The information describes the type of component and shall not be considered as assured characteristics. 2. Terms of delivery and rights to change design reserved. 3. Some parts of this publication contain statements about the suitability of our products for certain areas of application. These statements are based on our knowledge of typical requirements that are often placed on our products in the areas of application concerned. Nevertheless, we explicitly point out that such statements cannot be regarded as binding statements about the suitability of our products for a particular customer application. As a rule, is either unfamiliar with individual customer applications or less familiar with them than the customers themselves. For these reasons, it is always ultimately incumbent on the customer to check and decide whether a product with the properties described in the product specification is suitable for use in a particular customer application. 4. We also point out that in individual cases, a malfunction of electronic components or failure before the end of their usual service life cannot be completely ruled out in the current state of the art, even if they are operated as specified. In customer applications requiring a very high level of operational safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health (e.g. in accident prevention or life-saving systems), it must therefore be ensured by means of suitable design of the customer application or other action taken by the customer (e.g. installation of protective circuitry or redundancy) that no injury or damage is sustained by third parties in the event of malfunction or failure of an electronic component. 5. The warnings, cautions and product-specific notes must be observed. 6. In order to satisfy certain technical requirements, some of the products described in this publication may contain substances subject to restrictions in certain jurisdictions (e.g. because they are classed as hazardous ). Useful information on this will be found in our Material Data Sheets. Should you have any more detailed questions, please contact our sales offices. 7. We constantly strive to improve our products. Consequently, the products described in this publication may change from time to time. The same is true for the corresponding product specifications. Please check therefore to what extent product descriptions and specifications contained in this publication are still applicable before or when you place an order. We also reserve the right to discontinue production and delivery of products. Consequently, we cannot guarantee that all products named in this publication will always be available. 8. Unless otherwise agreed in individual contracts, all orders are subject to the current version of the General conditions for the supply of products and services of the electrical and electronics industry published by the German Electrical and Electronics Industry Association (ZVEI), available at 9. As far as patents or other rights of third parties are concerned, liability is only assumed for components per se, not for applications, processes and circuits implemented within components or assemblies. 10. The trade name is a trademark registered or pending in Europe and in other countries. 11/18/ /16