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1 Chip Bead Cores Type: ECCL ECML ECB Features Effective noise suppression for power lines and high speed signal lines Easy pattern layout on PC Board ohs compliant Type: ECCL, ECML Low DC esistance to 8 mω typical: ated current ( and 4 mperes) (type: ECML) Low impedance ecommended pplications Digital equipment such as PCs, word processors, print ers, HDD, PCC, CD-OMs, DVD-OMs. Digital audio and video equipment such as VCs, DVC, CD Players, DVD Players. C adapters, and switching power supplies. Electronic musical instruments, and other digital equipment. Type: ECB High impedance for high speed signal line noise Increased attenuation 6 Ω-1, 12 Ω-.5 are achieved by using 168 size (type: ECBP) Type: ECCL Explanation of Part Numbers Product Type Part kind Size Form Suffix Noise Filter Chip type Bead core Packing U 2 Nov. 212

2 Construction Dimensions in mm (not to scale) H L Ferrite core Electrode Type (inch size) ECCL452 (1812) ECCL225 (121) ECCL216 (126) Mass (eight) L H [mg/pc.] 4.5±.4.2±. 1.8±.2.5± ±. 2.5±. 1.6±..5± ±. 1.6±. 1.6±..5±. 7 Type: ECML Explanation of Part Numbers Product Type Part kind Size Material Nominal Impedance Form Noise Filter Molded Chip type Bead core The first two digits are significant figure of impedance value and the third one denotes the number of zeros following U H Packing (ECML16 to 2) (ECML45) Construction Dimensions in mm (not to scale) e T Ferrite core L Conductor Electrode Type (inch size) ECML16 (6) ECML2 (85) ECML2 (126) ECML45 (186) Mass (eight) L T e [mg/pc.] 1.6±.2.8±.2.8±.2 (.4) ± ±.2.9±.2 (.5) 1.5.2±. 1.6±..9±.2 (.6) ±. 1.6±. 1.1±.2 (.6) 6. 2 Nov. 212

3 Type: ECB Explanation of Part Numbers Product Size Type Characteristics Nominal Impedance Form Suffix Noise Filter Multilayer Chip type Bead Core B P High frequency High attenuation for signal Lines High frequency High attenuation for Power Lines The first two digits are significant figure of impedance value and the third one denotes the number of zeros following H Packing Construction Dimensions in mm (not to scale) Ferrite core e T L Inner Conductor Electrode Type (inch size) ECBB (6) ECBP (6) L T e Mass (eight) [mg/pc.] 1.6±.2.8±.2.8±.2.± ±.2.8±.2.8±.2.± atings Type Part Number Impedance ated Current DC esistance (Ω) at 1 MHz tol.(%) (m DC) (Ω) max. 452 ECCL452U ECCL225U ECCL216U ECML4591H ECML268U ECML29U ± ECML1627U ECBP6H ECBP121H ECBB221H ECBB61H ECBB12H Category Temperature ange 25 C to +85 C 2 Nov. 212

4 Impedance Characteristics (eference Data) Measured by HP4291 : Impedance : esistance : eactance ECCL452U1 (452),, () ECCL225U1 (225),, () ECCL216U1 (216) ECML1627U (168),, () ECML29U (212),, () ECML268U (216),, () ,, () ECML4591H (4516),, () Nov. 212

5 Impedance Characteristics (eference Data) Measured by HP4291 : Impedance : esistance : eactance ECBB221H (168) ECBP121H (168),, () ,, () ECBB61H (168) ECBP6H (168),, () ,, () ECBB12H (168),, () Nov. 212

6 Packaging Methods (Taping) Standard Quantity Part Number Kind of Taping Pitch (P 1 ) Quantity ECCL452U1 ECCL225U1 ECCL216U1 ECML4591H ECML268U ECML29U ECML1627U ECB H 8 mm 1 pcs./reel 2 pcs./reel pcs./reel 4 mm 4 pcs./reel Taping eel T Sprocket hole fd Compartment f C B F f D f B t2 P1 P2 P Chip component Tape running direction E f Embossed Carrier Part Number B F P 1 P 2 P D t 2 ECCL452U1.6±.2 4.9±.2 12.±.2 5.5±.1 8.± max. ECCL225U1 2.9±.2.6±.2 ECCL216U1 2.±.2.6±.2 8.±.2.5± max. ECML4591H 1.9±.2 4.8±.2 12.±.2 5.5±.1 4.±.1 2.±.1 4.±.1 1.5± max. ECML268U 1.9±.2.5±.2 ECML29U 1.5±.2 2.±.2 ECML1627U 1.±.2 1.8±.2 8.±.2.5± max. ECB H 1.±.1 1.8±.1 Standard eel Part Number B C D E T ECCL452U1 1.± max. ECCL225U1 ECCL216U1 9.±. 1 max. ECML4591H ±1. 1.±.5 21.±.8 2.±.5 1.± max.. ECML268U ECML29U ECML1627U 9.±. 1 max. ECB H 2 Nov. 212

7 ecommended Land Pattern Dimensions in mm (not to scale) C B (mm) Part Number B C ECCL452U ECCL225U ECCL216U ECML4591H 2.6 to 5.5 to to 1.6 ECML268U 1.6 to 2 4 to to 1.6 ECML29U.8 to 1.2 to 4 1 to 1.2 ECML1627U.6 to 1 2 to.8 to 1 ECB H.8 to 1 2 to to 1 ecommended Soldering Conditions ecommendations and precautions are described below. ecommended soldering conditions for refl ow efl ow soldering shall be performed a maximum of two times. Please contact us for additional information when used in conditions other than those specifi ed. Please measure the temperature of the terminals and study every kind of solder and printed circuit board for solderability be fore ac tu al use. Peak For soldering (Example : Sn-7Pb) Temperature Time Preheating 14 C to 16 C 6 s to 12 s Main heating bove 2 C s to 4 s Peak 25 ± 1 C max. 1 s Temperature Preheating Heating For lead-free soldering (Example : Sn/g/.5Cu) Temperature Time Preheating 15 C to 17 C 6 s to 12 s Main heating bove 2 C s to 4 s Peak max. 26 C max. 1 s Time Flow soldering Flow soldering may cause this product to come off because the adhesiveness of the product element is low. Please consult our sales representative in advance about fl ow soldering. <epair with hand soldering> Preheat with a blast of hot air or similar method. Use a soldering iron with a tip temperature of 5 C or less. Solder each electrode for seconds or less. Never touch this product with the tip of a soldering iron. Safety Precautions The following are precautions for individual products. Please also refer to the common precautions for Noise Suppression Device shown on this catalog. 1. Use rosin-based fl ux or halogen-free fl ux. 2. For cleaning, use an alcohol-based cleaning agent. Before using any other type, consult with our sales per son in advance.. Do not apply shock to Chip Bead Cores (hereafter called the bead cores) or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, their bodies may be chipped, affecting their per for mance. Excessive mechanical stress may damage the bead cores. Handle with care. 4. Store the bead cores in a location with a temperature ranging from -5 C to +4 C and a rel a tive humidity of 4 % to 6 %, where there are no rapid changes in temperature or humidity. 5. Use the bead cores within a year (ECB Type: within half a year) after the date of the out go ing in spec tion indicated on the packages. 2 Nov. 212