High Voltage Ceramic Disc Capacitors (Low loss type)

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Hilary Dixon
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1 High Voltage Ceramic Disc Capacitors (Low loss type) Series: KGE/Char. SL/GP, 1 to 6 kvdc Series: KP/Char. /Y5P, 1 to 3 kvdc Series: KRP/Char. R/Y5R, 1 to 3 kvdc Features Wide operating temperature range: ( 25 to 15 C or 25 to 125 C) Improved Voltage vs.temperature Rise Flame-retardant insulated coating Easy mounting through kinked leads and radial tap ing Recommended pplications Snubber circuit for switching power supply Horizontal resonance circuitry for TVs and CRT displays Inverter type lighting apparatus allast circuit for LCD backlighting inverter (For series KGE) Other high voltage pulse and DC circuitry Explanation of s E C K N K P Product Code Code ECC ECK Class Class 1 Class 2 Specifi cations Code N Lead Style Style ulk Taped Rated Voltage Code 3 3D 3F 3J Rated Volt. 1 kvdc 2 kvdc 3 kvdc 6 kvdc Nominal Capacitance Ex. Cap pf 11 1 pf 12 1 pf pf pf Cap. Tolerance Code D F J K Cap. Tol. ±.5 pf ±1. pf ±5 % ±1 % Characteristic Series KGE Series KP, KRP Temp. Char. Code Char. G SL/GP /Y5P R R/Y5R Suffix Operating Temperature Range 25 to 15 C 25 to 125 C Rated Voltage 1 kvdc to 6 kvdc 1 kvdc to 3 kvdc Dielectric Withstanding Voltage Capacitance Rated Voltage 1 to 3 kvdc: Rated Voltage 1 to 3 kvdc: 2 % of Rated Voltage 2 % of Rated Voltage for 1 to 5 seconds for 1 to 5 seconds Rated Voltage 6 kvdc: 15 % of Rated Voltage for 1 to 5 seconds Within the specifi ed tolerance, when measured at 1 MHz ± 2 %, 1 to 5 Vrms, and 2 C Within the specifi ed tolerance, when measured at 1 khz ± 2 %,1 to 5 Vrms, and 2 C Q or Dissipation Factor (tand) Insulation Resistance Temperature Characteristics 3 pf or under Q > 4+2 C (C:Cap.pF) over 3 pf Q > 1 at 1 MHz ± 2 %,1 to 5 Vrms. and 2 C 1 M min. at 5 VDC 1 minute electrifi cation Temperature Coeffi cient: +35 to 1 ppm/ C (Temperature Range:2 to 85 C) Series KP : tand >.25 Series KRP : tand >.2 at 1 khz ± 2 %,1 to 5 Vrms. and 2 C Series Temp.Char max.cap.change Temp. Range KP /Y5P ±1 % 25 to 85 C KRP R/Y5R ±15 % 25 to 85 C Design and specifi cations are each subject to change without notice. sk factory for the current technical specifi cations before purchase and/or use.

2 Rated Voltage and Capacitance Range Series Name Temp. Char. Rated Voltage Capacitance Range in pf Typical pplications 1 kvdc 47 Series KGE SL 2 kvdc 3 kvdc allast circuit of LCD backlighting inverter Snubber circuit of switching power supply 6 kvdc 15 Series KP 1 kvdc 56 Snubber circuit of switching power supply 2 kvdc 3 kvdc Horizontal resonance circuit of TV and CRT display 1 kvdc 47 Series KRP R 2 kvdc 47 Snubber circuit of switching power supply 3 kvdc 22 Dimensions D (ody Diameter) unit : mm Cap. KGE KP KRP in pf 1 kv 2 kv 3 kv 6 kv 1 kv 2 kv 3 kv 1 kv 2 kv 3 kv 12 to to Design and specifi cations are each subject to change without notice. sk factory for the current technical specifi cations before purchase and/or use.

3 Dimensions in mm (not to scale) Standard lead styles are available in and Taping shown below. Taping Type N, N1 P2 P L D W2 W W1 H h1 P1 F fd W h2 T e Type D F d±.5 2. min. 4. max. T Note:Tolerance of Lead Space Dim. F (Nominal) Tolerance of Dim. F 5. ± ± ±1.5 Type N2 P2 P1 P P P fd fd D F t2 t1 Same dimensions as Type N, N1 except for special dimensions. Unit (mm) Symbol Taping Type N N1 N2 P 12.7±1. 15.±2. 3.±2. P 12.7±.3 15.±.3 15.±.3 F 5.±.8 7.5±1. 7.5±1. P1 3.85± ± ±.8 P2 6.35± ± ±1.5 D To comply with each individual spec i fi ca tion W W 1. min. W1 9.±.5 W2 3. max. H e 4. max. fd 4.±.2 fd.6±.5.65±.5.65±.5 t1.6±.3 t2 1.5 max. T To comply with each individual specifi cation h1, h2 2. max. L 11. max. Minimum Quantity/Packing Unit Temp.Char. SL/GP 1 to 6 kvdc Series KGE Temp.Char. /Y5P 1 to 3 kvdc Series KP Temp.Char. R/Y5R 1 to 3 kvdc Series KRP Series / Type Minimum Packing Packing Quantity Quantity in Carton ulk 1 kvdc ECC3 GE 12 to 12 pf to 47 pf to 82 pf 2 1 ulk 2 kvdc ECC3D GE 1 to 15 pf to 22 pf 2 3 ulk 3 kvdc ECC3F GE 12 to 82 pf to 15 pf 2 2 ulk 6 kvdc ECC3J GE 5 to 82 pf to 15 pf 2 2 Taped Type 1 kvdc ECCN3 GE 12 to 47 pf 2 1 Taped Type 2 kvdc ECCN3D GE 12 to 22 pf 1 5 Taped Type 3 kvdc ECCN3F GE 12 to 15 pf 1 5 Taped Type 6 kvdc ECCN3J GE 5 to 15 pf to 68 pf 2 5 ulk 1 kvdc ECK3 KP 82 to 39 pf to 56 pf to 56 pf 2 4 ulk 2 kvdc ECK3D KP 68 to 39 pf to 56 pf to 39 pf 2 4 ulk 3 kvdc ECK3F KP 47 to 22 pf pf to 1 pf 2 1 ECKN3 KP 12 to 33 pf 1 5 Taped Type 1 kvdc 39 to 47 pf to 18 pf 1 5 ECKN3D KP Taped Type 2 kvdc 22 to 39 pf to 1 pf 1 5 ECKN3F KP Taped Type 3 kvdc 12 to 27 pf to 56 pf 2 5 ulk 1 kvdc ECK3 KRP 68 to 39 pf pf to 39 pf 2 4 ulk 2 kvdc ECK3D KRP 47 to 27 pf to 47 pf to 33 pf 2 4 ulk 3 kvdc ECK3F KRP 39 to 15 pf , 22 pf to 82 pf 2 1 ECKN3 KRP Taped Type 1 kvdc 1 to 22 pf to 39 pf 5 25 Taped Type 2 kvdc ECKN3D KRP 1 to 15 pf 1 5 Taped Type 3 kvdc ECKN3F KRP 1 to 82 pf 1 5 Carton L W H(mm) Design and specifi cations are each subject to change without notice. sk factory for the current technical specifi cations before purchase and/or use.

4 Ratings and Characteristics Series KGE (Class 1, Temp. Char. SL/GP, 1 kvdc to 6 kvdc) Rated Volt. 1 kvdc 2 kvdc 3 kvdc Cap. Capacitance Dimensions in mm Type (ulk) Taping Type in pf Tolerance D T Dimensions in mm (%) max. max. Taped Dimensions in mm F d Type F d 12 ±5, ± ECC312 GE 5..6 ECCN312 GE N ±5, ± ECC315 GE 5..6 ECCN315 GE N ±5, ± ECC318 GE 5..6 ECCN318 GE N ±5, ± ECC322 GE 5..6 ECCN322 GE N ±5, ± ECC327 GE 5..6 ECCN327 GE N ±5, ± ECC333 GE 5..6 ECCN333 GE N ±5, ± ECC339 GE 5..6 ECCN339 GE N ±5, ± ECC347 GE 5..6 ECCN347 GE N ±5, ± ECC356 GE 5..6 ECCN356 GE N ±5, ± ECC368 GE 5..6 ECCN368 GE N ±5, ± ECC382 GE 5..6 ECCN382 GE N ±5, ± ECC311 GE 5..6 ECCN311 GE N ±5, ± ECC3121 GE 5..6 ECCN3121 GE N ±5, ± ECC3151 GE 5..6 ECCN3151 GE N ±5, ± ECC3181 GE 5..6 ECCN3181 GE N ±5, ± ECC3221 GE 5..6 ECCN3221 GE N ±5, ± ECC3271 GE 5..6 ECCN3271 GE N ±5, ± ECC3331 GE 5..6 ECCN3331 GE N ±5, ± ECC3391 GE 5..6 ECCN3391 GE N ±5, ± ECC3471 GE ECCN3471 GE N ±5, ± ECC3D12 GE ECCN3D12 GE N ±5, ± ECC3D15 GE ECCN3D15 GE N ±5, ± ECC3D18 GE ECCN3D18 GE N ±5, ± ECC3D22 GE ECCN3D22 GE N ±5, ± ECC3D27 GE ECCN3D27 GE N ±5, ± ECC3D33 GE ECCN3D33 GE N ±5, ± ECC3D39 GE ECCN3D39 GE N ±5, ± ECC3D47 GE ECCN3D47 GE N ±5, ± ECC3D56 GE ECCN3D56 GE N ±5, ± ECC3D68 GE ECCN3D68 GE N ±5, ± ECC3D82 GE ECCN3D82 GE N ±5, ± ECC3D11 GE ECCN3D11 GE N ±5, ± ECC3D121 GE ECCN3D121 GE N ±5, ± ECC3D151 GE ECCN3D151 GE N ±5, ± ECC3D181 GE ECCN3D181 GE N ±5, ± ECC3D221 GE ECCN3D221 GE N ±5, ± ECC3F12 GE ECCN3F12 GE N ±5, ± ECC3F15 GE ECCN3F15 GE N ±5, ± ECC3F18 GE ECCN3F18 GE N ±5, ± ECC3F22 GE ECCN3F22 GE N ±5, ± ECC3F27 GE ECCN3F27 GE N ±5, ± ECC3F33 GE ECCN3F33 GE N ±5, ± ECC3F39 GE ECCN3F39 GE N ±5, ± ECC3F47 GE ECCN3F47 GE N ±5, ± ECC3F56 GE ECCN3F56 GE N ±5, ± ECC3F68 GE ECCN3F68 GE N ±5, ± ECC3F82 GE ECCN3F82 GE N ±5, ± ECC3F11 GE ECCN3F11 GE N ±5, ± ECC3F121 GE ECCN3F121 GE N ±5, ± ECC3F151 GE ECCN3F151 GE N Note : Capacitance Tolerance Code J (± 5%) or K (± 1%) Design and specifi cations are each subject to change without notice. sk factory for the current technical specifi cations before purchase and/or use.

5 Ratings and Characteristics Series KGE (Class 1, Temp. Char. SL/GP, 1 to 6 kvdc) (Continuation) Rated Volt. 6 kvdc Cap. Capacitance Dimensions in mm Type (ulk) Taping Type in pf Tolerance D T Dimensions in mm (%) max. max. Taped Dimensions in mm F d Type F d 5 ±.5pF or ±1pF ECC3J5 GE ECCN3J5 GE N ±.5pF or ±1pF ECC3J6 GE ECCN3J6 GE N ±.5pF or ±1pF ECC3J7 GE ECCN3J7 GE N ±.5pF or ±1pF ECC3J8 GE ECCN3J8 GE N ±.5pF or ±1pF ECC3J9 GE ECCN3J9 GE N ±.5pF or ±1pF ECC3J1 GE ECCN3J1 GE N ±5 or ± ECC3J12 GE ECCN3J12 GE N ±5 or ± ECC3J15 GE ECCN3J15 GE N ±5 or ± ECC3J18 GE ECCN3J18 GE N ±5 or ± ECC3J22 GE ECCN3J22 GE N ±5 or ± ECC3J27 GE ECCN3J27 GE N ±5 or ± ECC3J33 GE ECCN3J33 GE N ±5 or ± ECC3J39 GE ECCN3J39 GE N ±5 or ± ECC3J47 GE ECCN3J47 GE N ±5 or ± ECC3J56 GE ECCN3J56 GE N ±5 or ± ECC3J68 GE ECCN3J68 GE N ±5 or ± ECC3J82 GE ECCN3J82 GE N ±5 or ± ECC3J11 GE ECCN3J11 GE N ±5 or ± ECC3J121 GE ECCN3J121 GE N ±5 or ± ECC3J151 GE ECCN3J151 GE N Note : Capacitance Tolerance Code D (±.5pF) or F (± 1pF) or J (± 5%) or K (± 1%) Series KP (Class 2, Temp. Char. /Y5P, 1 to 3 kvdc) Rated Cap. Capacitance Dimensions in mm Type (ulk) Taping Type Volt. in pf Tolerance D T Dimensions in mm (%) max. max. Taped Dimensions in mm F d Type F d 1 ± ECK311KP 5..6 ECKN311KP N ± ECK3121KP 5..6 ECKN3121KP N ± ECK3151KP 5..6 ECKN3151KP N ± ECK3181KP 5..6 ECKN3181KP N ± ECK3221KP 5..6 ECKN3221KP N ± ECK3271KP 5..6 ECKN3271KP N ± ECK3331KP 5..6 ECKN3331KP N ± ECK3391KP 5..6 ECKN3391KP N ± ECK3471KP 5..6 ECKN3471KP N ± ECK3561KP 5..6 ECKN3561KP N kvdc 68 ± ECK3681KP 5..6 ECKN3681KP N ± ECK3821KP 5..6 ECKN3821KP N ± ECK312KP 5..6 ECKN312KP N ± ECK3122KP 5..6 ECKN3122KP N ± ECK3152KP 5..6 ECKN3152KP N ± ECK3182KP 5..6 ECKN3182KP N ± ECK3222KP 5..6 ECKN3222KP N ± ECK3272KP 5..6 ECKN3272KP N ± ECK3332KP ECKN3332KP N ± ECK3392KP ECKN3392KP N ± ECK3472KP ECKN3472KP N ± ECK3562KP ECKN3562KP N Design and specifi cations are each subject to change without notice. sk factory for the current technical specifi cations before purchase and/or use.

6 Ratings and Characteristics Series KP (Class 2, Temp. Char. /Y5P, 1 to 3 kvdc) (Continuation) Rated Cap. Capacitance Dimensions in mm Type (ulk) Taping Type Volt. in pf Tolerance D T Dimensions in mm (%) max. max. Taped Dimensions in mm F d Type F d 1 ± ECK3D11KP ECKN3D11KP N ± ECK3D121KP ECKN3D121KP N ± ECK3D151KP ECKN3D151KP N ± ECK3D181KP ECKN3D181KP N ± ECK3D221KP ECKN3D221KP N ± ECK3D271KP ECKN3D271KP N ± ECK3D331KP ECKN3D331KP N ± ECK3D391KP ECKN3D391KP N ± ECK3D471KP ECKN3D471KP N ± ECK3D561KP ECKN3D561KP N kvdc 68 ± ECK3D681KP ECKN3D681KP N ± ECK3D821KP ECKN3D821KP N ± ECK3D12KP ECKN3D12KP N ± ECK3D122KP ECKN3D122KP N ± ECK3D152KP ECKN3D152KP N ± ECK3D182KP ECKN3D182KP N ± ECK3D222KP ECKN3D222KP N ± ECK3D272KP ECKN3D272KP N ± ECK3D332KP ECKN3D332KP N ± ECK3D392KP ECKN3D392KP N ± ECK3D472KP ± ECK3D562KP ± ECK3F11KP ECKN3F11KP N ± ECK3F121KP ECKN3F121KP N ± ECK3F151KP ECKN3F151KP N ± ECK3F181KP ECKN3F181KP N ± ECK3F221KP ECKN3F221KP N ± ECK3F271KP ECKN3F271KP N ± ECK3F331KP ECKN3F331KP N ± ECK3F391KP ECKN3F391KP N kvdc 47 ± ECK3F471KP ECKN3F471KP N ± ECK3F561KP ECKN3F561KF N ± ECK3F681KP ECKN3F681KP N ± ECK3F821KP ECKN3F821KP N ± ECK3F12KP ECKN3F12KP N ± ECK3F122KP ECKN3F122KP N ± ECK3F152KP ECKN3F152KP N ± ECK3F182KP ECKN3F182KP N ± ECK3F222KP ECKN3F222KP N ± ECK3F272KP ECKN3F272KP N Design and specifi cations are each subject to change without notice. sk factory for the current technical specifi cations before purchase and/or use.

7 Ratings and Characteristics Series KRP (Class 2, Temp. Char. R/Y5R, 1 to 3 kvdc) Rated Cap. Capacitance Dimensions in mm Type (ulk) Taping Type Volt. in pf Tolerance D T Dimensions in mm (%) max. max. Taped Dimensions in mm F d Type F d 1 ± ECK311KRP 5..6 ECKN311KRP N ± ECK3121KRP 5..6 ECKN3121KRP N ± ECK3151KRP 5..6 ECKN3151KRP N ± ECK3181KRP 5..6 ECKN3181KRP N ± ECK3221KRP 5..6 ECKN3221KRP N ± ECK3271KRP 5..6 ECKN3271KRP N ± ECK3331KRP 5..6 ECKN3331KRP N ± ECK3391KRP 5..6 ECKN3391KRP N ± ECK3471KRP 5..6 ECKN3471KRP N ± ECK3561KRP 5..6 ECKN3561KRP N kvdc 68 ± ECK3681KRP 5..6 ECKN3681KRP N ± ECK3821KRP 5..6 ECKN3821KRP N ± ECK312KRP 5..6 ECKN312KRP N ± ECK3122KRP 5..6 ECKN3122KRP N ± ECK3152KRP 5..6 ECKN3152KRP N ± ECK3182KRP 5..6 ECKN3182KRP N ± ECK3222KRP 5..6 ECKN3222KRP N ± ECK3272KRP ECKN3272KRP N ± ECK3332KRP ECKN3332KRP N ± ECK3392KRP ECKN3392KRP N ± ECK3472KRP ± ECK3D11KRP ECKN3D11KRP N ± ECK3D121KRP ECKN3D121KRP N ± ECK3D151KRP ECKN3D151KRP N ± ECK3D181KRP ECKN3D181KRP N ± ECK3D221KRP ECKN3D221KRP N ± ECK3D271KRP ECKN3D271KRP N ± ECK3D331KRP ECKN3D331KRP N ± ECK3D391KRP ECKN3D391KRP N ± ECK3D471KRP ECKN3D471KRP N ± ECK3D561KRP ECKN3D561KRP N kvdc 68 ± ECK3D681KRP ECKN3D681KRP N ± ECK3D821KRP ECKN3D821KRP N ± ECK3D12KRP ECKN3D12KRP N ± ECK3D122KRP ECKN3D122KRP N ± ECK3D152KRP ECKN3D152KRP N ± ECK3D182KRP ± ECK3D222KRP ± ECK3D272KRP ± ECK3D332KRP ± ECK3D392KRP ± ECK3D472KRP Design and specifi cations are each subject to change without notice. sk factory for the current technical specifi cations before purchase and/or use.

8 Ratings and Characteristics Series KRP (Class 2, Temp. Char. R/Y5R, 1 to 3 kvdc) (Continuation) Rated Cap. Capacitance Dimensions in mm Type (ulk) Taping Type Volt. in pf Tolerance D T Dimensions in mm (%) max. max. Taped Dimensions in mm F d Type F d 1 ± ECK3F11KRP ECKN3F11KRP N ± ECK3F121KRP ECKN3F121KRP N ± ECK3F151KRP ECKN3F151KRP N ± ECK3F181KRP ECKN3F181KRP N ± ECK3F221KRP ECKN3F221KRP N ± ECK3F271KRP ECKN3F271KRP N ± ECK3F331KRP ECKN3F331KRP N ± ECK3F391KRP ECKN3F391KRP N kvdc 47 ± ECK3F471KRP ECKN3F471KRP N ± ECK3F561KRP ECKN3F561KRP N ± ECK3F681KRP ECKN3F681KRP N ± ECK3F821KRP ECKN3F821KRP N ± ECK3F12KRP ± ECK3F122KRP ± ECK3F152KRP ± ECK3F182KRP ± ECK3F222KRP Typical Temperature Characteristics Series KGE (Char. SL/GP) (Temp. Coeff. : +35 to 1 ppm/ C) Series KP (Char. /Y5P) Temp. Range : 25 to 85 C ( max. Cap. Change : ±1 % ) Capacitance Change (%) Temperature ( C) Capacitance Change (%) Temperature ( C) Series KRP (Char. R/Y5R) Temp. Range : 25 to 85 C ( max. Cap. Change : ±15 % ) Capacitance Change (%) Temperature ( C) Design and specifi cations are each subject to change without notice. sk factory for the current technical specifi cations before purchase and/or use.

9 Characteristics of Voltage Frequency 1 Series KP 1 kvdc 1 Series KRP 1 kvdc Voltage (Vp-p) pf 47 pf 1 pf 22 pf 47 pf Voltage (Vp-p) pf 47 pf 1 pf 22 pf 47 pf Frequency (khz) Frequency (khz) Series KP 2 kvdc Series KRP 2 kvdc 5 5 Voltage (Vp-p) pf 47 pf 1 pf 22 pf 47 pf Frequency (khz) Voltage (Vp-p) pf 47 pf 1 pf 22 pf 47 pf Frequency (khz) Series KP 3 kvdc Series KRP 3 kvdc 5 5 Voltage (Vp-p) pf 47 pf 1 pf 22 pf Voltage (Vp-p) pf 47 pf 1 pf 22 pf Frequency (khz) Frequency (khz) The graphs above show the maximum permissable voltage when using a capacitor with an C sine wave voltage. When measuring this voltage in room temperature (25 C), the capacitor self-heat generation will rise a maximum of 2 C. When using a pulse voltage or an C voltage other than a sine wave, con fi rm that the capacitor self-heat generation is less than 2 C in an ambient room temperature of 25 C. The self-heat generation temperature is the difference be tween the surface temperature and the ambient room temperature. s for the situation when the self-heat generation temperature is more than 25 C, refer to the fi gure on the right. Permission self generation of heat temperature ( C) Permission self generation of heat tem per a ture vs. ambient temperature ambient temperature ( C) Design and specifi cations are each subject to change without notice. sk factory for the current technical specifi cations before purchase and/or use.

10 Multilayer Ceramic Capacitors Packaging Specifi cations Standard Packing Quantity Size Style Thickness Tape Width (mm) Paper Taping Embossed Taping ulk Case Pitch (mm) E F W Quantity (pcs./reel) Tape Width (mm) t1 Pitch (mm) fd Quantity (pcs./reel) Quantity (pcs./case) (mm) , , (5,) 5, , (1,) 15, , (2,) 1, , (1,) , , (2,) , (1,) , , , , , , , , , ( ) for f33 reel applied Low Profi le Type: Please contact us. Paper Taping 2 mm (Pressed Carrier Taping): Size 21 4 mm (Punched Carrier Taping): Size 63, 85, 126, 54, 58, 612 t Feeding hole Chip pocket fd Feeding hole Chip pocket E F W K Chip component P1 P2 P Tape running direction t2 Chip component P1 P2 P Tape running direction W F E P1 P2 P fd t K ±.3 ±.3 ±.2 ±.5 ±.1 ±.5 ±.5 ±.1 max..36 ±.3 2 mm (Punched Carrier Taping): Size ±.5 t2 t1 Feeding hole fd Chip component Chip pocket E F W P1 P2 P Tape running direction Unit:mm Unit:mm W F E P1 P2 P fd t1 t ±.5 ±.2 ±.5 ±.1 ±.5 ±.5 ±.1 max. 1. max. t1 Feeding hole fd Chip pocket t2 Chip component P1 P2 P E F W Tape running direction Unit:mm Size t W F E P1 P2 P fd t1 t ±.1 ± ±.1 ± ±.2 ±.5 ±.1 ±.1 ±.5 ± ±.2 ±.2 max. max ±.2 ± Embossed Taping Unit:mm Size t W F E P1 P2 P fd t1 t ±.2 ± ±.2 ± ±.2 ± ± ±.2 ± ± ±.3 ±.3 ±.5 4. ± ±.5 ± max. 8. ± max. 3.5 max. 4. max. Design and specifi cations are each subject to change without notice. sk factory for the current technical specifi cations before purchase and/or use.

11 Multilayer Ceramic Capacitors Reel for Taping E C W1 D W2 Unit:mm Tape Width C D E W1 W f18 f ±.3 ±1. 3 ±.5 ±.5 ±.8 ± ±.3 ±1. Leader Part and Taped End Leader part Top cover tape Tape end 1 min. Vacant position 4 min. 16 min. Vacant position unit:mm ulk Case (pplicable standards: EIJ ET-721) unit:mm Design and specifi cations are each subject to change without notice. sk factory for the current technical specifi cations before purchase and/or use.

12 Multilayer Ceramic Capacitors Temperature Characteristics [Ex.] Capacitance Change (%) Class 1 (T.C. Type) 6 4 CH(±6 ppm/ C) SL(+35 to 1 ppm/ C) Temp. ( C) Capacitance - DC bias Voltage [Ex.] Capacitance Change (%) 2 Temp. Char. CD (DC 5 V) 2 4 Temp. Char. (DC 5 V) 6 Temp. Char. F (DC 5 V) DC Voltage (V) Temperature Characteristics [Ex.] Capacitance Change (%) Class 2 (Hi-K Type) Temp. Char Temp. Char. F Temp. ( C) Capacitance - C Voltage [Ex.] Capacitance Change (%) 1 5 Temp. Char. F (DC 5 V) Temp. Char. (DC 5 V) Temp. Char. CD (DC 5 V) C Voltage (V) Capacitance aging [Ex.] Capacitance Change (%) Temp. Char. CD Temp. Char. Temp. Char. F Impedance - Frequency [Ex.] Class 1, Temp. Char. CH, Size 42 Impedance ( ) pf 1 pf 1pF Time (h) Impedance - Frequency [Ex.] Class 2, Temp. Char., Size Frequency (MHz) Impedance - Frequency [Ex.] Class 2, Temp. Char. X5R, Size 42 and 63 Impedance ( ) µf.1 µf 1 pf Impedance ( ) Size 63 1 µf Size 42 1 µf Frequency (MHz) Frequency (khz) Design and specifi cations are each subject to change without notice. sk factory for the current technical specifi cations before purchase and/or use.

13 Packaging Specifi cations Multilayer Ceramic Capacitors Product Series Style Size Dim. T (mm) Series ECJ Series ECY Series ECD Paper Taping Embossed Taping Pitch (mm) Explanation of s Minimum Packing Quantity Packing Quantity In Carton ECJZE ECDGZE ECJE ECDGE ECJUV 4.8 ECJUV ECJ1V ECJ2V ECJ2V.85 4 ECJGV 4 8 ECJTV ECY29R V ECJ3V 5 1 ECJ3V 126 ECJDV.85 4 ECJHV 4 8 ECJRV ECY39R V ECJ2F 3 6 Carton LuWuH (mm) ECJ3F 3 6 ECJMF ECJ3Y ECJ9F ECJ4Y ECJ4Y ECJ5Y Design and specifi cations are each subject to change without notice. sk factory for the current technical specifi cations before purchase and/or use.

14 Ceramic Capacitors High Voltage Ceramic Capacitors (SMD) (1 to 5 kvdc, Class 1 and 2) Ceramic Disc Capacitors for Safety Regulations High Voltage Ceramic Disc Capacitors (1 to 6 kvdc, Class 1 and 2) Precautions for Handling Safety Precautions The Ceramic Capacitors (hereafter referred to as The Capacitors ) may fail in a short-circuit mode or in open-circuit mode when subjected to severe conditions of electrical, mechanical and/or environmental stresses beyond their specified Ratings and Operating Conditions in the Catalog or the Specifications, resulting in burnout, flaming or glowing in the worst case. Following Safety Precautions and pplication Notes shall be noted in applications of the Capacitors. If you have a question about the Precautions for Handling, please contact our engineering section or factory. Notes; means Safety Precautions to be observed without fail. means General pplication Notes High Voltage Disc Type Safety Regulations Recognized Surface Mount Type (High Voltage Ratings) 1. Operating Conditions and Circuit Designs 1.1 Operating Conditions (General) Operating conditions of the Capacitors shall conform to the individual Specifi cations of the devices. The Capacitors shall not be operated beyond their specifi ed Ratings, llowable/ Maximum Operating Ranges in their performance characteristics. 1.2 Operating Temperature Range The specifi ed Operating Temperature Range in the catalog is absolute maximum and minimum temperature rating. So in any case, each Capacitor shall not be operated be yond the specified Operating Temperature Range. 1.3 Self-generated heat If a capacitor for DC rated voltage is used in an High frequency C voltage circuit or pulse circuit and self-generated heat (the difference between the surface temperature and the ambient temperature of capacitor) by the current, the temperature of the capacitor shall not rise by more than +2 C, when measured at room temperature (at 25 C). Check the self-generated heat temperature by using the capacitor in the actual equipment. The Self-generated heat temperature changes according to ambient temperature. s for the permissable self-generated heat temperature when the ambient temperature is more than 25 C, refer to the fi gure of the page 48 of this catalog. 1.4 Designs of Voltage pplications The Capacitors shall not be operated exceeding the specifi ed Rated Voltage in the catalog. If voltage ratings are exceeded, the Capacitors could result in failure or damage. In case of application of DC and C voltages to the capacitors, the designed peak voltage shall be within the specifi ed Rated Voltage. In case of C or pulse voltage, the peak voltage (peak to peak) shall be within the specifi ed Rated Voltage. If high frequency voltage or fast rising pulse voltage is applied continuously even with in the Rated Voltage, contact our engineering section before use. Note: The C rated Capacitors in the Catalog can be operated beyond the Nominal Voltage Ratings within the limits of voltage fl uctuations on the C primary lines.

15 Ceramic Capacitors Notes; means Safety Precautions to be observed without fail. means General pplication Notes High Voltage Disc Type Safety Regulations Recognized Surface Mount Type (High Voltage Ratings) 1.5 Operating Current If C voltage or pulse voltage is applied continuously and the charging/discharing current is large, contact our engineering section or factory before use. 1.6 Environmental Conditions The Capacitors shall not be operated and/or stored under following environmental conditions; a) To be exposed directly to water or salt water. b) Under conditions of dew formation. c) Under conditions of corrosive atomosphere such as hydrogen sulfi de, sulfurous acid, chlorine and ammonia. d) Under the severe conditions of vibrations beyond the Specifi ed values. 2. ssembly and Soldering Conditions 2.1 utomated ssembly Dimensions and tolerances of the piercing holes and spacings on printed circuit boards shall conform to the dimensions of the each Capacitor in individual Specifi cation. In an automated assembly of the Capacitors, abnormal mechanical stresses such as pushing/bending/crinching forces and excessive shocks to the Capacitors shall be kept minimum to prevent mechanical/electrical failures of the devices. 2.2 Soldering Fluxes Rosin-based and non-activated soldering fl ux is recommended. The content of halogen in the fl ux shall be.1 wt. % or less, not to corrode copper wires of the devices and not to deteriorate the insulation resistance of circuit board. 2.3 Flow Soldering (For leaded type) Soldering Do not immerse the capacitor body into the solder. pply only the lead wires to solder. When soldering this product to the PW, do not exceed the solder heat specifi cation of the capacitor. Subjecting this product to excessive heating could melt the internal junction solder and/or crack the ceramic element. Recommended profi le for fl ow soldering [Ex.] Preheating : Temperature difference between melted solder and capacitor surface : T<15 C Preheating temperature. T<12 C Soldering :Lead wires shall be immersed into a soldering bath of 24 C to 26 C within 5 seconds. Cooling :The capacitor shall be cooled gradually to room temperature for preventing mechanical damages such as cracking. Fig. Recommended profi le for Flow Soldering [Ex.] 24 to 26 C Temperature ( C) ot 3 to 12 seconds within 5 seconds time Soldering limits Soldering limits are temperature : 26 C maximum, time : within 1 seconds. However, these conditions are subject to change according to the preheating conditions and soldering machines. Make sure the performance of the capacitor before use. 2.4 Refl ow Soldering (For surface mounting molded type) Sudden heating of the capacitor results in distortion due to high internal temperature difference, causing cracked the capacitor. Do not immerse the capacitor body into melted solder.

16 Ceramic Capacitors Notes; means Safety Precautions to be observed without fail. means General pplication Notes High Voltage Disc Type Safety Regulations Recognized Surface Mount Type (High Voltage Ratings) Recommended profi le for refolw soldering [Ex.] Preheating zone : 15 to 17 C Temperature up zone : 2 to 5 seconds Heating zone : 22 C, within 2 seconds Peak temperature : 25 C, within 5 seconds Cooling : Gradual cooling in the room temperature Fig. Recommended profi le for Refl ow Soldering [Ex.] 25 C 22 C 15 to 17 C Temperature ( C) ot 1 Preheating 6 seconds min. 6 to 18 seconds max. 3 Heating 2 Temperature up within 2 seconds 4 Cooling (In the room temperature) Time (s) There is no problem with twice refl ow soldering under the recommended profi le for refl ow soldering [Ex.]. However, make sure the performance of capacitor to avoid the mechanical damages such as cracking. Soldering Limits Soldering limits are temperature : 25 C maximum, time : within 5 seconds, twice refl ow soldering. However, these conditions are subject to change according to the preheating conditions and soldering machines. Make sure the performance of the capacitor before use. 2.5 Post Soldering Cleaning When using water-soluble soldering fl uxes, allow suffi cient cleaning with water and then drying in the fi nal step of the cleaning to remove corrosive remains of the soldering fl ux on printed circuit board. If the capacitors are cleaned with the printed circuit board, check the infl uence on quality by the cleaning under actual conditions. 2.6 Plastic Molding If another plastic molding is applied to the Capacitors on your option, investigate a infl uence on reliability of the devices in your equipment. Some plastic molding may damage the Capacitors with the mechanical stresses by thermal expansion or shrinkage, or deteriorate the performance characteristics of the Capacitors with cracked gas or reaction gas from the resin, or deteriorate the humidity resistance. 3. Testing 3.1 C Dielectric Withstanding Test Perform C dielectric withstanding test for the noise suppression capacitors in C primary circuit, under the sine wave voltage and specifi ed conditions (voltage, time). Some test equipment may deform the wave form of applied voltage and apply a voltage of peak value more than 2 times of rms value, resulting in dielectric breakdown of the Capacitors. The C test voltage shall be applied gradually from volt to the specifi ed test voltage after the Capacitor s terminals are connected securely to the test equipment. When the specifi ed voltage is applied directly for some reasons, apply it in the zero cross start method. If the voltage is applied directly from equipment which does not use the zero cross start method, an abnormal voltage higher than the specifi ed voltage may be generated, resulting in dielectric breakdown of the Capacitors. 4. Long Term Storage The Capacitors shall not be stored under severe conditions of high temperatures and high humidities. Store them indoors under 4 C max. and 75 % RH max.. Use them within one year and check the solderability before use. The Capacitors shall not be exposed to direct sunlight and dew formation.

E C K T H C K B

E C K T H C K B Ceramic Capacitors (Safety Regulations) For Surface Mounting s HC (Sub-Class Y1) FC (Sub-Class Y2) C (Sub-ClassY2 ) Features Resin molded SMD type for flow/reflow soldering (HC) and reflow soldering (FC,C)