INPAQ. Specification RDP201208T-05EACME1BE. Product Name. RF Diplexer. Global RF/Component Solutions

Transcription

1 RDP201208T-05EACME1BE Specification Product Name Series Part No RF Diplexer RDP2012 Series RDP201208T-05EACME1BE Size EIAJ 2012

2 RDP2012 SERIES (RF Diplexer) Engineering Specification Scope RDP series (RF Diplexer Filter) is SMD type of design with LTCC (Low-Temperature Co-fired Ceramic) process technology and function as a two pass band diplexer filtering for RF applications. Features: LTCC (Low-Temperature Co-fired Ceramic Technology) design/process Miniaturized SMD packaged in low profile and lightweight. Low-Band(LB)/High-Band(HB) filtering:dual Band-pass Filter(BPF/BPF) Lead Free, RoHS Compliance Mirror pin design of E1 type, PN: RDP201208T-05EACE1BE Applications: 0~6GHz band of wireless communication systems, used in 2G/3G/4G-LTE mobile phones, NB/tablet, and SiP/modules of Bluetooth/WLAN(802.11b/g/a/N/ac/ad,..)/Zee-Bee/ISM-band,..etc. 1. General Electrical specification Part Number RDP201208T-05EACME1BE Item Common to Low Freq. Port Common to High Freq. Port Common Port Pass Insertion (MHz) 2400~ ~ ~ ~5850 (db) 2.00 Max Max (db) 10 Min. 10 Min. 10 Min. 10 Min. Attenuation (db) ~915 MHz ~1605 MHz ~1990 MHz MHz ~5000 MHz ~7500 MHz ~1610 MHz ~2500 MHz ~11700 MHz RF Diplexer RDP2012 Series Engineer Specification Version: P0 Page 1 of 8

3 2. Part number code RDP T - 05 E AC ME1 B E (1) (2) (3) (4) (5) (6) (7) (8) (9) (1) Series type:rdp - RF DiPlexer Filter Series (2) Size(mm):Length Width Thickness, x1.25x0.8 mm 3 (3) Terminal type:l-lga, Bottom Pad;T-Termination (4) Impedance:05 - standard 50 ohm system match (5) Material:E (6) Frequency:AC - Wireless LAN Dual Band, IEEE802.11n+ac (2.45/5GHz) (7) Specification code:me1 - Mirror pin design of E1 type, PN: RDP201208T-05EACE1BE (8) Soldering:B Lead-Free for whole chip (9) Packing:E - Embossed plastic tape, 7 reel 3. Dimensions and termination configuration Dimensions L W T 2.00± ± ±0.10 a b c 0.30± ± ±0.15 g p 0.35± ±0.10 NOTE: Dimensions in mm Termination configuration Pin Name Pin Name Low band GND GND ANT/Common High band GND RF Diplexer RDP2012 Series Engineer Specification Version: P0 Page 2 of 8

4 4. Solder land pattern Line-width should be designed to match 50 Ω characteristic impedance, And it depends on PCB s material and thickness. 5. Measurement setup DUT= Diplexer filter, T RF 3-ports S-parameter Measurement Test Instrument: Network Analyzer [Agilent ENA E5071C] RF Diplexer RDP2012 Series Engineer Specification Version: P0 Page 3 of 8

5 6. Typical electrical performance PN: RDP201208T-05EACME1BE RF Diplexer RDP2012 Series Engineer Specification Version: P0 Page 4 of 8

6 7. Tape and reel specifications Taping dimensions Tape material:plastic Leader and Trailer Tape Peel-off force Peel-off force should be in the range of 30±20g at a peel-off of 300mm/min RF Diplexer RDP2012 Series Engineer Specification Version: P0 Page 5 of 8

7 8. Reel dimensions Width Unit:mm 9. Standard quantity for packaging Packaging style:taping Reel packaging quantity:3,000 pcs/reel Inner box:5 reel/inner box RF Diplexer RDP2012 Series Engineer Specification Version: P0 Page 6 of 8

8 10. Recommended soldering conditions 11. General technical data Operating temperature range: - 40 ~ +85 Storage Condition:Less than 40 and 70% RH Storage Time:6 months Max. Soldering method: Reflow or Wave Soldering RF Diplexer RDP2012 Series Engineer Specification Version: P0 Page 7 of 8

9 12. Reliability and test condition Test item Test condition Criteria 1. Temperature : -40 ~ No mechanical damage Temperature Cycle 2. Cycle : 100 cycles 3. Dwell time : 30minutes Measurement : at ambient temperature 24 hrs after test completion 1. Temperature : 85 ± 5 1. No mechanical damage High Temperature 2. Test time : 1000 hrs Measurement : at ambient temperature 24 hrs after test completion Humidity Resistance 1. Temperature : 40 ± 2 2. Humidity : 90 ~ 95 % RH 3. Test time : 1000 hrs Measurement : at ambient temperature 24 hrs after test completion 1. No mechanical damage Resistance to Solder Heat 1. Solder temperature : 260 ± 5 2. Flux : Rosin 3. DIP time : 10 ± 1 sec 1. No mechanical damage Bending Test Adhesive Strength of Termination Drop shock 1. Solder specimen onto test jig (FR4, 0.80mm) using the recommend soldering profile. 2. Apply a bending force of 2mm deflection 1. Solder specimen onto test jig. 2. Apply push force at 0.30mm/s until electrode pads are peeled off or ceramic are broken. Dropped onto printed circuit board from 100cm height three times in x, y, z directions. The terminals shall be protected. 1. No apparent damage 5N minimum 1. No apparent damage RF Diplexer RDP2012 Series Engineer Specification Version: P0 Page 8 of 8