Non Magnetic Chip C0G & X7R

Transcription

1 Non Magnetic Chip CG & X7R This range of MLC chip capacitors that are completely non magnetic. They are designed to operate in non magnetic environments such as Magnetic Resonance Imaging (MRI) and Nuclear Magnetic Resonance (NMR) systems. Copper barrier terminations are available for soldering applications and palladium silver terminations for conductive epoxy. Consult the Sales Office if your specific requirements exceed our catalog maximums (size, cap. value, and ). Capacitance and Voltage Selection Size Min cap. R3 121 R5 121 R3 121 R R 121 5R 121 5R Tmax inches: mm: CG X7R CG X7R CG X7R CG X7R CG X7R CG X7R CG X7R CG X7R CG X7R CG X7R CG X7R 16V V V V V V V V V V V kV kV kV kV kV kV Note: Maximum capacitance values are shown above as 3 digit code: 2 significant figures followed by the no. of zeros e.g. 183 = 18,pF. R denotes decimal e.g. 2R7 = 2.7pF. l For characteristics of dielectrics M (CG) and C (X7R) see pages 4 & 6. l For dimensions see page 12. l For termination options see pages 3 & 15. l For capacitance tolerances available see page 15. l For ordering information see page Phone:

2 Chip Ordering Information Prefix Case Size Capacitance Capacitance Tolerance Voltage Termination Special Thickness High Reliability Testing Packaging Marking High Reliability Test Criteria XX 126 N 472 J 11 N X5 H T M - HB Capacitance Code 1st two digits are significant, third digit denotes number of zeros, R = decimal Examples: Codes 1R = 1.pF 12 = 12pF 471 = 47pF 12 = 1,pF 273 =.27µF 474 =.47µF 15 = 1.µF N CG/NP Ultra Stable M CG/NP Ultra Stable Magnetic Free F CG/NP High Temp. (up to 16ºC) D CG/NP High Temp. (up to 2ºC) K R3L Ultra Stable R R2D Pulse Energy Y Y5V General Purpose Z Z5U General Purpose B X7R Stable C X7R Stable Magnetic Free X BX MIL S X8R High Temp. (up to 15ºC) E Class II High Temp. (up to 2ºC) G Class II High Temp. (up to 16ºC) W X5R Stable RN Lead free CG/NP Ultra Stable RB Lead free X7R Stable BB X7R BME Stable BW X5R BME Stable Prefix Definitions None Standard chip RF Improved ESR Capacitor p. 23 LS Y 3 Certified Safety Capacitor p ES Y 2 Certified Safety Capacitor p ST Stacked Capacitor Assembly p SM Stacked Hi-Rel Capacitor Assembly p CR Cap-Rack Capacitor Array p. 54 RC Bleed Resistor p Voltage Code 1st two digits are significant, third digit denotes number of zeros. For example: 16 = 16 Volts 11 = 1 Volts 51 = 5 Volts 12 = 1, Volts 52 = 5, Volts 13 = 1, Volts Capacitance Tolerance Codes Code Tolerance B Special Thickness None X Standard thickness as per Novacap catalog specifications Denotes a special thickness other than standard. Specify in inches if required. (As shown above X =.5 ) * Not RF series ±.1pF Cap. Value < 1pF Packaging None T W Bulk Tape & Reel Waffle Pack Termination Codes Marking None Unmarked M Marked *Marking not available on sizes < 63 Hi-Reliability Testing Criteria None Standard product { HB MIL-PRF Group A H High Reliability Testing HV MIL-PRF Group A H High Temp Screening HS MIL-PRF-123 Group A P Palladium Silver PR Palladium Silver* K Solderable Palladium Silver* N Nickel Barrier* 1% tin Y Nickel Barrier 9% tin, 1% lead NG Nickel Barrier Gold Flash* C FlexiCap /Nickel Barrier* 1% tin D FlexiCap /Nickel Barrier 9% tin, 1% lead B Copper Barrier* 1% tin E Copper Barrier 9% tin, 1% lead S Silver* * Indicates RoHS terminations CG/NP R3L R2D Y5V Z5U C ±.25pF D ±.5pF F ±1% G ±2% High Reliability Testing X7R BX X8R Class II X5R Positive VTC N M F/D K R Y/Z B C X S E/G W P J ±5% * * K ±1% M ±2% Z +8% -2% * P +1% -% * Phone:

3 Technical Summary T W Technical Information Novacap provides application notes throughout this catalog as a guide to chip selection and attachment methods. Refer to the Novacap Technical Brochure found at com for more details. This technical information includes the nature of capacitance, dielectric properties, electrical properties, classes of dielectrics, ferroelectric behavior, test standards, and high reliability test plans. Please do not hesitate to contact the sales office for any product or technical assistance. Capacitor Size Size availability is based primarily on capacitance values and rating. Smaller units are generally less expensive. Because mass affects the thermal shock susceptibility of chip capacitors, size selection should consider the soldering method used to attach the chip to the board. Sizes 1812 and smaller can be wave, vapor phase, or reflow soldered. Larger units require reflow soldering. Chip Selection Multilayer capacitors (MLC) are categorized by dielectric performance with temperature. The Temperature Coefficient of Capacitance describes the variance of capacitance value with temperature. The choice of components is therefore largely determined by the temperature stability required of the device and the size necessary for the desired capacitance value and rating. Packaging Units are available reeled, in waffle pack, or bulk packaged. Bar coded labels are standard for reeled and bulk packaging. Primary Types CG/NP: Ultra stable Class I dielectric, with negligible dependence of capacitance on temperature,, frequency, and time. Used in circuitry requiring very stable performance. X7R: Stable Class II dielectric, with predictable change in properties across a temperature range of -55 C to +125 C. Used as blocking, decoupling, bypassing, and frequency discriminating elements. This dielectric is ferroelectric and provides higher capacitance than Class I materials. BX: The military specification for ceramic chip capacitors (MIL- PRF-55681) defines a mid-k stable dielectric designated as BX. The BX specification has temperature limits in addition to temperature limits of capacitance. The BX dielectric is limited to ±15% maximum change in capacitance between 25 C and -55 C or +125 C and also has a restriction of +15% / -25% maximum change in capacitance between 25 C and -55 C or +125 C at rated. Z5U/Y5V: General purpose Class III dielectrics with higher dielectric constant and greater variation of properties over temperature and. Very high capacitance per volume is attainable for general purpose applications where stability over a wide temperature range is not critical. Termination Combinations Palladium Silver Palladium Silver Solderable Palladium Silver Nickel Barrier 1% tin Nickel Barrier 9/1% tin/lead Nickel Barrier Gold flash FlexiCap /Nickel Barrier 1% tin FlexiCap /Nickel Barrier 9/1% tin/lead Copper Barrier 1% tin Copper Barrier 9/1% tin/lead RoHS RoHS RoHS RoHS RoHS RoHS RoHS Code P PR K N Y NG C D B E S CG/NP N/RN R3L K X7R B/RB X7R BME BB X5R BME BW BX X Y5V Y Z5U Z CG/NP (Mag free) M X7R (Mag free) C X8R S CG/NP (16ºC) F CG/NP (2ºC) D Class II (16ºC) G Class II (2ºC) E Pulse Power P R2D R Solderable Silver Termination Material We recommend the following termination types: Solder Attachment: N Nickel Barrier, 1% matte tin plated - RoHS C FlexiCap with Nickel Barrier, 1% tin plated - RoHS Y Nickel Barrier, tin-lead plated D FlexiCap Nickel Barrier, tin-lead plated B Copper Barrier 1% matte tin plated - RoHS E Copper Barrier, tin-lead plated K Solderable Palladium Silver - RoHS (suitable for conductive epoxy attach) S Solderable Silver - RoHS Conductive Epoxy attachment: P Palladium Silver PR Palladium Silver - RoHS NG Nickel Barrier Gold Flash - RoHS (suitable for soldering attach) Phone:

4 Characteristics CG/NP (N) Ultra Stable and RoHS 213 (RN) type ±3 ppm/ºc Dissipation factor:.1% 25ºC Insulation resistance >1GW or >1WF whichever is >1GW or >1WF whichever is less <2V: 21-5V: >5V: 15% or 5V whichever is greater % per decade 1MHz for Capacitance <1pF CG/NP (M) Ultra Stable Non Magnetic ±3 ppm/ºc Dissipation factor:.1% 25ºC Insulation resistance >1WF or >1WF whichever is >1WF or >1WF whichever is less <2V: 21-5V: >5V: 15% or 5V whichever is greater % per decade 1MHz for Capacitance <1pF CG/NP (F) Ultra Stable High Temperature (up to 16ºC) Operating temperature range: -55 C to 16 C ±3 ppm/ºc Dissipation factor:.1% 25ºC Insulation resistance >1GW or >1WF whichever is >1GW or >1WF whichever is less <2V: 21-5V: >5V: 15% or 5V whichever is greater % per decade 1MHz for Capacitance <1pF CG/NP (D) Ultra Stable High Temperature (up to 2ºC) Operating temperature range: -55 C to 2 C Temp. coefficient <2ºC: Dissipation 25ºC: Insulation <2V: 21-5V: >5V: ±3 ppm/ºc.1% Max. >1GW or >1WF whichever is less >1GW or >1WF whichever is less 15% or 5V whichever is greater % per decade 1MHz for capacitance <1pF Phone:

5 Characteristics X7R (B) Stable and RoHS 213 (RB) type Temperature coefficient : Dissipation factor >25V rating: Insulation <2V: 21-5V: >5V: >1GW or >1WF whichever is less >1GW or >1WF whichever is less 15% or 5V whichever is greater <2.% per decade %CAPACITANCE CHANGE X7R (C) Stable Non Magnetic Dissipation factor >25V rating: Insulation <2V: 21-5V: >5V: >1GW or >1WF whichever is less >1GW or >1WF whichever is less 15% or 5V whichever is greater <2.% per decade %CAPACITANCE CHANGE BX (X) Stable Temp- coefficient: Dissipation factor Insulation resistance: >25V <2V: 21-5V: >5V: +15% -25% DC Max. >1GW or >1WF whichever is less >1GW or >1WF whichever is less 15% or 5V whichever is greater <2.% per decade %CAPACITANCE CHANGE X8R (S) Stable Operating temperature range: -55 C to 15 C Temp. coefficient <15ºC: Dissipation factor Insulation resistance >25V <2V: 21-5V: >5V: >1GW or >1WF whichever is less >1GW or >1WF whichever is less 15% or 5V whichever is greater <2.% per decade Phone:

6 Chip Dimensions L T MB W Dimensions - inches (mm) Size Length (L) Width (W) Max. Thickness (T)* Termination Band (MB) 42.4 ±.4 (1.2 ±.12).2 ±.4 (.58 ±.12).24 (.61).1 ±.6 (.254 ±.152) 54.5 ±.6 (1.27 ±.152).4 ±.6 (1.2 ±.152).44 (1.12).14 ±.6 (.356 ±.152) RF ( ).55 ±.15 (1.4 ±.381).57 (1.45).14 ±.6 (.356 ±.152) 63.6 ±.6 (1.52 ±.152).3 ±.6 (.762 ±.152).35 (.889).14 ±.6 (.356 ±.152) 85.8 ±.8 (2.3 ±.23).5 ±.8 (1.27 ±.23).54 (1.37).2 ±.1 (.58 ±.254) 97.9 ±.8 (2.29 ±.23).7 ±.8 (1.78 ±.23).6 (1.52).2 ±.1 (.58 ±.254) 15.1 ±.8 (2.54 ±.23).5 ±.8 (1.27 ±.23).54 (1.37).2 ±.1 (.58 ±.254) RF ( ).11 ±.15 (2.79 ±.381).12 (2.59).2 ±.1 (.58 ±.254) ±.8 (3.18 ±.23).6 ±.8 (1.52 ±.23).64 (1.63).2 ±.1 (.58 ±.254) ±.8 (3.18 ±.23).1 ±.8 (2.54 ±.23).65 (1.65).2 ±.1 (.58 ±.254) ±.15 (3.81 ±.381).15 ±.15 (3.81 ±.381).13 (3.3).3 ±.15 (.762 ±.381) ±.12 (4.57 ±.35).8 ±.8 (2.3 ±.23).65 (1.65).24 ±.14 (.61 ±.356) ±.12 (4.57 ±.35).125 ±.8 (3.18 ±.23).65 (1.65).24 ±.14 (.61 ±.356) ±.12 (4.57 ±.35).25 ±.15 (6.35 ±.381).8 (2.3).24 ±.14 (.61 ±.356) 22.2 ±.15 (5.8 ±.381).2 ±.15 (5.8 ±.381).18 (4.57).24 ±.14 (.61 ±.356) ±.15 (5.59 ±.381).21 ±.15 (5.33 ±.381).8 (2.3).3 ±.15 (.762 ±.381) ±.15 (5.59 ±.381).25 ±.15 (6.35 ±.381).8 (2.3).3 ±.15 (.762 ±.381) ±.15 (6.35 ±.381).2 ±.15 (5.8 ±.381).18 (4.57).3 ±.15 (.762 ±.381) RF ( ).25 ±.15 (6.35 ±.381).165 (4.19).3 ±.15 (.762 ±.381) ±.17 (8.38 ±.432).33 ±.17 (8.38 ±.432).25 (6.35).3 ±.15 (.762 ±.381) ±.18 (8.89 ±.457).3 ±.15 (7.62 ±.381).25 (6.35).3 ±.15 (.762 ±.381) 44.4 ±.2 (1.2 ±.58).4 ±.2 (1.2 ±.58).3 (7.62).4 ±.2 (1.2 ±.58) ±.23 (11.4 ±.584).4 ±.2 (1.2 ±.58).3 (7.62).4 ±.2 (1.2 ±.58) ±.27 (13.7 ±.686).4 ±.2 (1.2 ±.58).3 (7.62).4 ±.2 (1.2 ±.58) ±.28 (14. ±.711).5 ±.25 (12.7 ±.635).3 (7.62).4 ±.2 (1.2 ±.58) ±.33 (16.5 ±.838).6 ±.3 (15.2 ±.762).3 (7.62).4 ±.2 (1.2 ±.58) ±.38 (19.1 ±.965).65 ±.33 (16.5 ±.838).3 (7.62).4 ±.2 (1.2 ±.58) * Non standard thicknesses are available - consult the sales office for details. 12 Phone: