3D Silicon Capacitors

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Gyles Fletcher
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1 3D Silicon Capacitors Integrated Passive Devices Product Line High Stability Silicon Capacitors Low Profile Silicon Capacitors High Temperature Silicon Capacitors Xtreme Temperature Silicon Capacitors Vertical Silicon Capacitors Wirebond & Embedded Silicon Capacitors

2 IPDiA 3D Silicon Capacitors: the Best Choice for all Demanding Applications IPDiA has developed a unique technology called PICS Passive Integrated Connecting Substrate - that allows a wide range of capacitor values to be integrated on silicon. This unprecedented integration capability - up to 250nF/mm² - is the best innovation to achieve optimized Miniaturization, Reliability and Cost Saving for your design. The Silicon High Density Capacitors can be used throughout a wide range of applications covering functions such as power supply decoupling, signal coupling, pump charging, DC/DC power conversion, etc. IPDiA s technology provides capacitance integration similar to X7R dielectrics with stability and reliability exceeding those of C0G/NP0 ceramic and tantalum capacitors. Temperature Very low temperature variation (from -55 C to 250 C) and DC voltage drifts 4 temperature ranges available From -55 C to +1 C From -55 C to +0 C From -55 C to +200 C From -55 C to +250 C Miniaturization Thin capacitors (down to 50 µm) Smaller footprint than most MLCC Overall smaller system module thanks to SiP integration Reliability Extremely low derating Negligible failure rate prediction (MTTF > C) Electrical Low ESL and tunable ESR Very low leakage current for battery operated devices Lower package parasitic effects due to shorter interconnections Passive integration on Silicon Single component Component array Assembly Chip on Board (COB) Wafer Level Chip Scale Package (WLCSP) Embedded System in Package (SiP) Wirebond Packaging Wafer forms Single bar die (waffle pack) Tape & Reel

3 Vertical Silicon Capacitors (WBSC, WTSC, WXSC) IPDiA Vertical Silicon Capacitors (WBSC) are perfectly adapted for wire bonding on PCB. The WBSC capacitor integration capability (up to 250nF/mm 2 ) gives a smaller footprint than with MLCC technology to meet strict volume constraints. Pad finishing in Aluminum. Other finishings such as copper, nickel or gold are available upon request Assembly: Compatible with standard wirebond WBSC up to 0 C / WTSC up to 200 C WXSC up to 250 C Very low profile Negligible capacitance loss through ageing Extended temperature range Capacitance range pf to nf Operating temperature range -55 C to 250 C (*) Storage temperature range - 70 C to 265 C Temperature coefficient ±1.5 %, from -55 C to +250 C (*) Equivalent Series Inductor (ESL) Max 0 ph Equivalent Series Resistor (ESR) Max 0 m Insulation resistance G min, RVDC, from -55 C to +0 C (*) Capacitor height Max 250 µm (*) i.e : nf/0303 case = WBSC = WTSC = WXSC Breakdown Voltage 7= 30V 6= 50V 5= 0V Size 0= = = 01 3 = = = = f 5 = 1n 6 = n 3 = 9 = u Typ Comp. size A B 0.26 ± ± ± ± ± ± Wirebond & EMbedded Silicon Capacitors (down to 0µm) (EMSC, ETSC, EXSC) IPDiA EMbedded Silicon Capacitors are designed to be compliant with the embedding process for printed circuit board and laminates. The EMSC can also be used with wirebond technologies. Thanks to the high robustness and performance of these silicon passive components, embedded processes are now reliable. Pad finishing in Aluminum. Other finishings such as copper, nickel or gold available are upon request Assembly: Suitable for wirebond & embedded applications EMSC up to 0 C / ETSC up to 200 C EXSC up to 250 C Very low profile 0 µm Low ESL and ESR High capacity value up to 4.7 µf High reliability Extended temperature range Capacitance range 390 pf to 4.7 µf Operating temperature range -55 C to 250 C (*) Storage temperature range - 70 C to 265 C Temperature coefficient ±1.5 %, from -55 C to +250 C(*) (*) Other temperature ranges (up to 250 C) available i.e.: 0 nf/0404 case F.6 Equivalent Series Inductor (ESL) Max 0 ph Equivalent Series Resistor (ESR) Max 0 m Insulation resistance G min, RVDC, from -55 C to +0 C (*) Capacitor height Max 0 µm Typ A Comp. size B = EMSC = ETSC = EXSC T BV S U x Breakdown Voltage 4 = 11V 1= 20V 7= 30V Size F = 0404 H = 0505 I = 0302 S =1208 V =1216 C = 0202 V = 1612 Y = 1616 X =2016 G = = f 3 = p 5 = 1n 6 = n 9 = u

4 High Stability Silicon Capacitors (JEDEC/EIA compatible) (HSSC) IPDiA High Stability Silicon Capacitors avoid the need to oversize the capacitor value for sensitive capacitive circuitry and offer a higher DC voltage stability. The PICS technology developed by IPDiA provides outstanding capacitor stability over the full operating voltage & temperature ranges. The very high and stable insulation resistance of silicon capacitors can improve battery lifetime up to 30 % in mobile applications. automatic soldering technologies (reflow and manual) Capacitance range pf to 3.3 µf (*) Operating temperature range -55 C to 0 C (*) Storage temperature range - 70 C to 165 C Temperature coefficient <±0.5 %, from -55 C to +0 C i.e.: 0 nf/0402 case (temperature, voltage, ageing) (high insulation resistance) Very low ESR and ESL Negligible capacitance change with temperature variation Low profile Equivalent Series Inductor (ESL) Max 0 ph (*) Equivalent Series Resistor (ESR) Max 400 m (*) Insulation resistance 0 G RVDC, 25 C Capacitor height Max 400 µm (*) = HSSC 4 = 11V 3 = = f 5 = 1n 3 = p 6 = n 9 = u Low Profile Silicon Capacitors (0 µm thickness) (LPSC) Low Profile Silicon Capacitors are the most appropriate solution in applications with height constraints. LPSC is the perfect choice for embedded technologies, modules, systems in package, when designers are looking for utmost decoupling behavior. IPDiA PICS technology offers a capacitor integration capability that can reach 250 nf/mm ² and allows considerable downsizing compared with other technologies based on tantalum or ceramic. A thickness of 80 µm is available upon request. automatic soldering technologies (reflow and manual) Very low profile: standard thickness = 0µm (80µm thickness available upon request) Extended operating temperature range with negligible capacitance change with temperature variation Capacitance range pf to 3.3 µf (*) Operating temperature range - 55 C to 0 C (*) Storage temperature range - 70 C to 165 C Temperature coefficient <±0.5 %, from -55 C to +0 C (*) i.e.: 1 µf/1206 case Equivalent Series Inductor (ESL) Max 0 ph (*) Equivalent Series Resistor (ESR) Max 400 m (*) Insulation resistance 0 G RVDC, 25 C Capacitor height Typ 0 µm (*) = LPSC 4 = 11V 2 = 05 0 = f 5 = 1n 3 = = p 6 = n 9 = u

5 High Temp. Silicon Capacitors (up to 200 C - JEDEC/EIA compatible) (HTSC) Thanks to the unique IPDiA silicon capacitor technology, most of the problems encountered in demanding applications can now be solved. High Temperature Silicon Capacitors are dedicated to applications where reliability up to 200 C is the main parameter. The capacitor integration capability (up to 250 nf/mm ² ) offers capacitance value similar to what is obtained with X7R dielectric, but with better electrical performance than C0G/NP0 dielectrics at 200 C. HTSC provides the highest capacitor stability ever reached over the full temperature range -55 C/+200 C with a temperature coefficient lower than ±1%. automatic soldering technologies (reflow and manual) Capacitance range pf to 3.3 µf (*) Operating temperature range -55 C to 200 C (*) Storage temperature range - 70 C to 2 C Temperature coefficient <±1 %,, from -55 C to +200 C i.e.: 0 nf/0402 case Extended operating temperature range (up to 200 C) with low capacitance variation Very low ESR and ESL Equivalent Series Inductor (ESL) Max 0 ph (*) Equivalent Series Resistor (ESR) Max 400 m (*) 50 RVDC, 25 C Insulation resistance 20 RVDC, 200 C Capacitor height Max 400 µm (*) = HTSC 4 = 11V 3 = = f 5 = 1n 3 = p 6 = n 9 = u Xtreme Temp. Silicon Capacitors (up to 250 C - JEDEC/EIA compatible) (XTSC) Xtreme Temperature Silicon Capacitors are ideal for applications subject to extreme conditions up to 250 C. For instance, XTSC range offers a 1 µf in 1206 with a TC<±1.5% over the full -55 C/+250 C temperature range. Ageing, stability of insulation resistance and capacitor value have been optimized to obtain the best product for Hi-Rel applications. automatic soldering technologies (reflow and manual) Extended operating temperature range (up to 250 C) with low capacitance variation Very low ESR and ESL (*) Other values upon request Capacitance range pf to 3.3 µf (*) Operating temperature range -55 C to 250 C Storage temperature range - 70 C to 265 C Temperature coefficient <±1.5 %, from -55 C to +250 C i.e.: 1 µf/1206 case Equivalent Series Inductor (ESL) Max 0 ph **) Equivalent Series Resistor (ESR) Max 400 m **) 50 RVDC, 25 C Insulation resistance RVDC, 250 C Capacitor height Max 400 µm (*) = XTSC 4 = 11V 3 = = f 5 = 1n 3 = p 6 = n 9 = u

6 All rights reserved. Reproduction in whole or part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequences of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights. Date of release: October 2012 / Rev1.7 Document order number:

LPSC424.xxx Low Profile Silicon Capacitor

LPSC424.xxx Low Profile Silicon Capacitor LPSC424.xxx - 42 Low Profile Silicon Capacitor Rev 3. Key features Ultra low profile (1µm) High stability of capacitance value: Temperature