NPN/PNP low V CEsat Breakthrough in Small Signal (BISS) transistor pair in a SOT457 (SC-74) Surface Mounted Device (SMD) plastic package.

Transcription

1 Rev July 2005 Product data sheet 1. Product profile 1.1 General description NPN/PNP low V CEsat Breakthrough in Small Signal (BISS) transistor pair in a SOT457 (SC-74) Surface Mounted Device (SMD) plastic package. 1.2 Features Low collector-emitter saturation voltage V CEsat High collector current capability: I C and I CM High collector current gain (h FE ) at high I C High efficiency due to less heat generation Smaller required Printed-Circuit Board (PCB) area than for conventional transistors 1.3 Applications Complementary MOSFET driver Half and full bridge motor drivers Dual low power switches (e.g. motors, fans) Automotive applications 1.4 Quick reference data Table 1: Quick reference data Symbol Parameter Conditions Min Typ Max Unit TR1 (NPN) V CEO collector-emitter voltage open base V I C collector current (DC) A I CM peak collector current single pulse; t p 1 ms A R CEsat collector-emitter saturation I C = 1 A; I B = 0 ma [2] mω resistance TR2 (PNP) V CEO collector-emitter voltage open base V I C collector current (DC) ma I CM peak collector current single pulse; t p 1ms A R CEsat collector-emitter saturation resistance I C = 1 A; I B = 0 ma [2] mω Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm 2. [2] Pulse test: t p 300 µs; δ 0.02.

2 2. Pinning information Table 2: Pinning Pin Description Simplified outline Symbol 1 emitter TR1 2 base TR collector TR2 TR2 4 emitter TR TR1 5 base TR2 6 collector TR sym Ordering information 4. Marking Table 3: Ordering information Type number Package Name Description Version SC-74 plastic surface mounted package; 6 leads SOT457 Table 4: Marking codes Type number Marking code B4 5. Limiting values Table 5: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit Per transistor unless otherwise specified; for the PNP transistor with negative polarity V CBO collector-base voltage open emitter - 80 V V CEO collector-emitter voltage open base - 60 V V EBO emitter-base voltage open collector - 5 V I C collector current (DC) NPN ma [2] - 1 A PNP ma [2] ma both [3] - 1 A I CM peak collector current single pulse; t p 1ms - 2 A I B base current (DC) ma I BM peak base current single pulse; t p 1ms - 1 A _2 Product data sheet Rev July of 18

3 Table 5: Limiting values continued In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit P tot total power dissipation T amb 25 C mw [2] mw [3] mw Per device P tot total power dissipation T amb 25 C mw [2] mw [3] mw T j junction temperature C T amb ambient temperature C T stg storage temperature C Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm 2. [3] Device mounted on a ceramic PCB, Al 2 O 3, standard footprint aaa493 P tot (W) T amb ( C) Ceramic PCB, Al 2 O 3, standard footprint FR4 PCB, mounting pad for collector 1 cm 2 FR4 PCB, standard footprint Fig 1. Power derating curves _2 Product data sheet Rev July of 18

4 6. Thermal characteristics Table 6: Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit R th(j-a) thermal resistance from in free air K/W junction to ambient [2] K/W [3] K/W R th(j-sp) thermal resistance from junction to solder point K/W Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm 2. [3] Device mounted on a ceramic PCB, Al 2 O 3, standard footprint. 006aaa494 Z th(j-a) (K/W) δ = t p (s) Fig 2. FR4 PCB, standard footprint Transient thermal impedance from junction to ambient as a function of pulse time; typical values _2 Product data sheet Rev July of 18

5 006aaa495 Z th(j-a) (K/W) δ = t p (s) Fig 3. FR4 PCB, mounting pad for collector 1 cm 2 Transient thermal impedance from junction to ambient as a function of pulse time; typical values 006aaa496 Z th(j-a) (K/W) δ = t p (s) Fig 4. Ceramic PCB, Al 2 O 3, standard footprint Transient thermal impedance from junction to ambient as a function of pulse time; typical values _2 Product data sheet Rev July of 18

6 7. Characteristics Table 7: Characteristics T amb = 25 C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Per transistor unless otherwise specified; for the PNP transistor with negative polarity I CBO collector-base cut-off current V CB =60V; I E = 0 A na V CB =60V; I E =0A; µa T j = 150 C I CES collector-emitter cut-off V CE =60V; V BE = 0 V na current I EBO emitter-base cut-off current V EB =5V; I C = 0 A na V BEsat base-emitter saturation I C = 1 A; I B =50mA V voltage V BEon base-emitter turn-on V CE =5V; I C =1A V voltage TR1 (NPN) h FE DC current gain V CE =5V; I C = 1 ma V CE =5V; I C = 500 ma V CE =5V; I C =1A V CEsat collector-emitter saturation voltage I C = 0 ma; I B = 1 ma mv I C = 500 ma; mv I B =50mA I C = 1 A; I B = 0 ma mv R CEsat collector-emitter saturation I C = 1 A; I B = 0 ma mω resistance t d delay time I C = 0.5 A; ns t I Bon =25mA; r rise time ns I Boff = 25 ma t on turn-on time ns t s storage time ns t f fall time ns t off turn-off time ns f T transition frequency V CE =V; I C = 50 ma; f = 0 MHz MHz C c collector capacitance V CB =V; pf I E =i e = 0 A; f = 1 MHz TR2 (PNP) h FE DC current gain V CE = 5 V; I C = 1 ma V CE = 5 V; I C = 500 ma V CE = 5 V; I C = 1 A _2 Product data sheet Rev July of 18

7 Table 7: Characteristics continued T amb = 25 C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit V CEsat R CEsat collector-emitter saturation voltage collector-emitter saturation resistance Pulse test: t p 300 µs; δ I C = 0 ma; I B = 1 ma I C = 500 ma; I B = 50 ma I C = 1 A; I B = 0 ma I C = 1 A; I B = 0 ma mv mv mv mω t d delay time I C = 0.5 A; ns t I Bon = 25 ma; r rise time ns I Boff =25mA t on turn-on time ns t s storage time ns t f fall time ns t off turn-off time ns f T transition frequency V CE = V; I C = 50 ma; f = 0 MHz MHz C c collector capacitance V CB = V; I E =i e = 0 A; f = 1 MHz pf _2 Product data sheet Rev July of 18

8 aaa aaa506 h FE 600 V BE (V) Fig V CE =5V T amb = 0 C T amb = 25 C T amb = 55 C TR1 (NPN): DC current gain as a function of collector current; typical values Fig V CE =5V T amb = 55 C T amb = 25 C T amb = 0 C TR1 (NPN): Base-emitter voltage as a function of collector current; typical values 1 006aaa aaa514 V CEsat (mv) 1 V CEsat (V) I C /I B =20 T amb = 0 C T amb = 25 C T amb = 55 C Fig 7. TR1 (NPN): Collector-emitter saturation voltage as a function of collector current; typical values Fig T amb = 25 C I C /I B = 0 I C /I B = 50 I C /I B = TR1 (NPN): Collector-emitter saturation voltage as a function of collector current; typical values _2 Product data sheet Rev July of 18

9 aaa aaa515 V BEsat (V) 1.0 R CEsat (Ω) Fig I C /I B =20 T amb = 55 C T amb = 25 C T amb = 0 C TR1 (NPN): Base-emitter saturation voltage as a function of collector current; typical values I C /I B =20 T amb = 0 C T amb = 25 C T amb = 55 C Fig. TR1 (NPN): Collector-emitter saturation resistance as a function of collector current; typical values 2.0 I C (A) aaa511 I B (ma) = R CEsat (Ω) 006aaa V CE (V) T amb = 25 C T amb = 25 C I C /I B = 0 I C /I B = 50 I C /I B = Fig 11. TR1 (NPN): Collector current as a function of collector-emitter voltage; typical values Fig 12. TR1 (NPN): Collector-emitter saturation resistance as a function of collector current; typical values _2 Product data sheet Rev July of 18

10 aaa aaa476 h FE V BE (V) V CE = 5 V T amb = 0 C T amb = 25 C T amb = 55 C Fig 13. TR2 (PNP): DC current gain as a function of collector current; typical values V CE = 5 V T amb = 55 C T amb = 25 C T amb = 0 C Fig 14. TR2 (PNP): Base-emitter voltage as a function of collector current; typical values 1 006aaa aaa490 V CEsat (mv) V CEsat (V) I C /I B =20 T amb = 0 C T amb = 25 C T amb = 55 C Fig 15. TR2 (PNP): Collector-emitter saturation voltage as a function of collector current; typical values T amb = 25 C I C /I B = 0 I C /I B = 50 I C /I B = Fig 16. TR2 (PNP): Collector-emitter saturation voltage as a function of collector current; typical values _2 Product data sheet Rev July 2005 of 18

11 aaa aaa491 V BEsat (V) 0.9 R CEsat (Ω) I C /I B =20 T amb = 55 C T amb = 25 C T amb = 0 C Fig 17. TR2 (PNP): Base-emitter saturation voltage as a function of collector current; typical values I C /I B =20 T amb = 0 C T amb = 25 C T amb = 55 C Fig 18. TR2 (PNP): Collector-emitter saturation resistance as a function of collector current; typical values 2.0 I C (A) 1.6 I B (ma) = aaa R CEsat (Ω) 006aaa V CE (V) T amb = 25 C T amb = 25 C I C /I B = 0 I C /I B = 50 I C /I B = Fig 19. TR2 (PNP): Collector current as a function of collector-emitter voltage; typical values Fig 20. TR2 (PNP): Collector-emitter saturation resistance as a function of collector current; typical values _2 Product data sheet Rev July of 18

12 8. Test information I B 90 % input pulse (idealized waveform) I Bon (0 %) % I Boff I C output pulse (idealized waveform) 90 % I C (0 %) % t t d t r t s t f ton toff 006aaa003 Fig 21. TR1 (NPN): BISS transistor switching time definition V BB V CC R B R C oscilloscope (probe) 450 Ω V o (probe) 450 Ω oscilloscope V I R2 DUT R1 mlb826 I C = 0.5 A; I Bon = 25 ma; I Boff = 25 ma; R1 = open; R2 = 0 Ω; R B = 300 Ω; R C = 20 Ω Fig 22. TR1 (NPN): Test circuit for switching times _2 Product data sheet Rev July of 18

13 I B 90 % input pulse (idealized waveform) I Bon (0 %) % I Boff I C output pulse (idealized waveform) 90 % I C (0 %) % t t d t r t s toff t f ton 006aaa266 Fig 23. TR2 (PNP): BISS transistor switching time definition V BB V CC R B R C oscilloscope (probe) 450 Ω V o (probe) 450 Ω oscilloscope V I R2 DUT R1 mgd624 I C = 0.5 A; I Bon = 25 ma; I Boff = 25 ma; R1 = open; R2 = 0 Ω; R B = 300 Ω; R C = 20 Ω Fig 24. TR2 (PNP): Test circuit for switching times _2 Product data sheet Rev July of 18

14 9. Package outline pin 1 index Dimensions in mm Fig 25. Package outline SOT457 (SC-74). Packing information Table 8: Packing methods The indicated -xxx are the last three digits of the 12NC ordering code. Type number Package Description Packing quantity SOT457 4 mm pitch, 8 mm tape and reel; T1 [2] mm pitch, 8 mm tape and reel; T2 [3] For further information and the availability of packing methods, see Section 17. [2] T1: normal taping [3] T2: reverse taping _2 Product data sheet Rev July of 18

15 11. Soldering solder lands solder resist occupied area solder paste msc422 Dimensions in mm Fig 26. Reflow soldering footprint 5.30 solder lands solder resist occupied area solder paste MSC Dimensions in mm Fig 27. Wave soldering footprint _2 Product data sheet Rev July of 18

16 12. Revision history Table 9: Revision history Document ID Release date Data sheet status Change notice Doc. number Supersedes _ Product data sheet - - _1 Modifications: Product status changed Table 7 Characteristics : Switching times parameters t d, t r, t on, t s, t f and t off added Figure 21 TR1 (NPN): BISS transistor switching time definition : added Figure 22 TR1 (NPN): Test circuit for switching times : added Figure 23 TR2 (PNP): BISS transistor switching time definition : added Figure 24 TR2 (PNP): Test circuit for switching times : added Section Packing information : added Section 11 Soldering : added Section 16 Trademarks : added _ Objective data sheet _2 Product data sheet Rev July of 18

17 13. Data sheet status Level Data sheet status Product status [2] [3] Definition I Objective data Development This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data Production This data sheet contains data from the product specification. reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Please consult the most recently issued data sheet before initiating or completing a design. [2] The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL [3] For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 14. Definitions Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 15. Disclaimers customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify for any damages resulting from such application. Right to make changes reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status Production ), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. 16. Trademarks Notice All referenced brands, product names, service names and trademarks are the property of their respective owners. Life support These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. 17. Contact information For additional information, please visit: For sales office addresses, send an to: sales.addresses@ _2 Product data sheet Rev July of 18

18 18. Contents 1 Product profile General description Features Applications Quick reference data Pinning information Ordering information Marking Limiting values Thermal characteristics Characteristics Test information Package outline Packing information Soldering Revision history Data sheet status Definitions Disclaimers Trademarks Contact information Koninklijke Philips Electronics N.V All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 14 July 2005 Document number: _2 Published in The Netherlands